Method for fabricating transistor with thinned channel
View Patent ↗A method of fabricating a MOS transistor having a thinned channel region is described. The channel region is etched following removal of a dummy gate. The source and drain regions have relatively low resistance with the process.
1. A mobile computing device, comprising:
one or more electronic memories; and
one or more processors coupled to the memories by a bus, wherein at least one of the processors includes at least one transistor further comprising:
a semiconductor body disposed over a substrate, the semiconductor body having a first width, a second width, a length, and a height;
a source region disposed within a first end of the semiconductor body having the first width and the height;
a drain region disposed within a second end of the semiconductor body having the first width and the height, the second end opposite the first end;
a channel region disposed only in a portion of the semiconductor body having the second width and the height and disposed between the source region and the drain region, wherein:
the length of the semiconductor body runs from the source region through the channel region to the drain region;
the second width is narrower than the first width;
the height of the semiconductor body is taken from an interface of the substrate and the semiconductor body to a top surface of the semiconductor body opposite the substrate; and
the first and second width are orthogonal to the length and the height;
a gate stack disposed over the channel region, the gate stack having a distance between sidewalls of the gate stack equal to and in direct alignment with the length of the portion of the semiconductor body having the second width, wherein the gate stack comprises a gate dielectric layer and a gate electrode; and
a pair of spacers adjacent to the sidewalls of the gate stack, wherein the pair of spacers are recessed into the semiconductor body.
2. The device of claim 1 , wherein the one or more processors includes at least one of:
a central processing unit (CPU);
a graphics processor;
a digital signal processor; or
a crypto processor.
3. The device of claim 1 , further comprising a network interface coupled to at least one of processors by the bus.
4. The device of claim 1 , wherein the one or more memories further comprise at least one of volatile and non-volatile memory.
5. The device of claim 1 , wherein the channel region is directly adjacent to both the source region and the drain region.
6. The device of claim 5 , further comprising:
a first tip region disposed within the first end of the semiconductor body having the first width; and
a second tip region disposed within the second end of the semiconductor body having the first width.
7. The device of claim 1 , wherein the gate dielectric layer is disposed beneath the gate electrode and also forms the sidewalls of the gate stack.
8. The device of claim 1 , wherein the gate dielectric layer is disposed only beneath the gate electrode.
9. The device of claim 1 , wherein the gate dielectric layer comprises a high-k material layer, and the gate electrode comprises a metal layer disposed directly on the high-k material layer.
10. The device of claim 9 , wherein the metal layer has a work function between 3.9 eV and 5.2 eV.
11. The device of claim 1 , wherein the semiconductor body is disposed directly on a silicon-on-insulator substrate.
12. The device of claim 1 , wherein the semiconductor body is disposed directly on a delta-doped substrate.
13. The mobile computing device of claim 1 , wherein the pair of spacers include a carbon-doped nitride material.
14. The mobile computing device of claim 13 , wherein the carbon-doped nitride material has carbon concentration in a range of 5% to 15%.
15. The mobile computing device of claim 1 , wherein the pair of spacers includes N.
16. The mobile computing device of claim 1 , wherein the source and drain regions comprise As or Ph.
17. The mobile computing device of claim 1 , wherein the gate dielectric is a dual layer gate dielectric having a first layer and a second layer, wherein the first layer comprises Si and O, and wherein the second layer comprises Hf and O.
18. A mobile computing device, comprising:
one or more electronic memories; and
one or more processors coupled to the memories by a bus, wherein at least one of the processors includes at least one transistor further comprising:
a semiconductor body disposed above a substrate, the semiconductor body having a width, a length, a first height, and a second height;
a source region disposed within a first end of the semiconductor body having the first height and the width;
a drain region disposed within a second end of the semiconductor body, opposite the first, and having the first height and the width;
a channel region disposed within a portion of the semiconductor body having the second height and the width between the source region and the drain region,
wherein:
the second height is shorter than the first height;
the length of the semiconductor body runs from the source region through the channel region to the drain region;
the first and second heights of the semiconductor body are from an interface of the semiconductor body and the substrate to a top surface of the semiconductor body; and
the width is orthogonal to the length and the first and second heights; and
a gate stack disposed above the channel region, the gate stack having a distance between sidewalls of the gate stack equal to, and in direct alignment with, the length of the portion of the semiconductor body having the second height, wherein the gate stack comprises a gate dielectric layer and a gate electrode.
19. The device of claim 18 , wherein the one or more processors includes at least one of:
a central processing unit (CPU);
a graphics processor;
a digital signal processor; or
a crypto processor.
20. The device of claim 18 , further comprising a network interface coupled to at least one of processors by the bus.
21. The device of claim 18 , wherein the one or more memories further comprise at least one of volatile and non-volatile memory.
22. The device of claim 18 , wherein the channel region is directly adjacent to both the source region and the drain region.
23. The device of claim 18 , further comprising:
a first tip region disposed only in the first end of the semiconductor body having the width and the first height; and
a second tip region disposed only in the second end of the semiconductor body having the width and the first height, wherein the channel region is directly adjacent to both the first and second tip regions.
24. The device of claim 18 , wherein the gate dielectric layer is disposed beneath the gate electrode and also forms the sidewalls of the gate stack.