Methods for mounting a MEMS sensor for in-stream measurements
Systems and methods for packaging a MEMS device to measure the in-stream pressure within a pipe are provided. Embodiments herein avoid the use of a metal housing enclosing the MEMS device or die pad of the MEMS device. Instead, the MEMS device is mounted directly to the pipe using a ceramic carrier. In preferred embodiments, the ceramic carrier is soldered, brazed, welded or eutectic bonded to the metal pipe.
1. A method of mounting a MEMS sensor to a pipe for in-stream measurement comprising:
forming a first opening through a side of the pipe;
forming a flat area on the side of the pipe around the first opening;
hermetically sealing a MEMS device around a second opening in a ceramic substrate on a first side of the ceramic substrate wherein a backside of the MEMS device is exposed to an opposite side of the ceramic substrate through the opening;
mounting signal-conditioning electronics for the MEMS device on the first side of the ceramic substrate;
enclosing the MEMS device and signal-conditioning electronics on the first side of the ceramic substrate with a non-metallic housing;
depositing a layer of metallic paste around the opening on the opposite side of the ceramic substrate; and,
hermetically sealing the ceramic substrate to the flat area in the side of the pipe by soldering the flat area to the layer of metallic paste.
2. The method of claim 1 , wherein the MEMS device is a pressure sensor.
3. The method of claim 1 , wherein the pressure sensor includes a diaphragm exposed to the opposite side of the ceramic substrate through the opening.
4. The method of claim 1 , wherein the flat area is square.
5. The method of claim 1 , wherein the non-metallic housing is made from ceramic.
6. The method of claim 1 , wherein the layer of metallic paste is screen printed onto the ceramic substrate.
7. The method of claim 1 , wherein the ceramic substrate is soldered to the flat area of the pipe with a solder preform.
8. A method of mounting a MEMS sensor to a pipe for in-stream measurement comprising:
hermetically sealing a MEMS device around an opening in a ceramic substrate on a first side of the ceramic substrate wherein a backside of the MEMS device is exposed to an opposite side of the ceramic substrate through the opening;
depositing a layer of metallic paste around the opening on the opposite side of the ceramic substrate; and,
hermetically sealing the ceramic substrate to the pipe by soldering the opposite side of ceramic substrate directly to the pipe over an opening in the pipe using the metallic layer as a metal interface for the ceramic substrate.
9. The method of claim 8 , wherein the depositing step is performed by screen printing the metallic paste around the opening.
10. The method of claim 8 , further comprising mounting signal conditioning electronics for the MEMS device on the first side of the ceramic substrate.
11. The method of claim 8 , further comprising enclosing the MEMS device and signal conditioning electronics on the first side of the ceramic substrate with a non-metallic housing.
12. The method of claim 11 , wherein the non-metallic housing is ceramic.
13. The method of claim 1 , wherein the pressure sensor includes a diaphragm exposed to the opposite side of the ceramic substrate through the opening.
14. A system for measuring the in-stream pressure in a pipe comprising:
a ceramic substrate including a first side, an opposite side to the first side and a hole that passes through the ceramic substrate from the first side to the opposite side wherein the opposite side of the ceramic substrate is hermetically sealed to a side of the pipe by a solder joint between the ceramic substrate and the pipe; and
a MEMS device hermetically sealed directly to the ceramic substrate around the hole on the first side of the ceramic substrate wherein a backside of the MEMS device is exposed to the opposite side of the ceramic substrate through the hole.
15. The system of claim 14 , further comprising signal conditioning electronics for the MEMS device mounted on the first side of the ceramic substrate.
16. The system of claim 15 , further comprising a non-metallic housing that encloses the MEMS device and signal conditioning electronics.
17. The system of claim 14 wherein the solder joint couples the side of the pipe to a layer of metallic paste deposited around the hole on the opposite side of the ceramic substrate.
18. The system of claim 14 , wherein the ceramic substrate is soldered to a flat area on the side of the pipe.
19. The system of claim 14 , wherein the MEMS device is a pressure sensor.
20. The system of claim 19 , wherein the pressure sensor includes a diaphragm exposed to the opposite side of the ceramic substrate through the hole.