IP Library Granted Patent US 10,171,090
Granted Patent B2
US 10,171,090 · App. 15/071,543 · Granted Jan 1, 2019

Oscillator, electronic apparatus, and moving object

Inventor: Masaaki Okubo (Minowa-machi, JP)
Assignee: SEIKO EPSON CORPORATION
H03L1/028H03B5/04H03L1/00H03L1/023H03L1/025H03L1/04
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Quick Facts
Patent No.
US 10,171,090
App. No.
15/071,543
Granted
Jan 1, 2019
Kind
B2
Abstract

An oscillator includes a vibrator element, a container in which the vibrator element is housed, at least one of a heating element and a cooling body configured to control the temperature on the inside of the container, an oscillation circuit electrically connected to the vibrator element, a D/A conversion circuit configured to control a frequency output by the oscillation circuit, and a reference-voltage generation circuit configured to supply a voltage to the D/A conversion circuit. The reference-voltage generation circuit is mounted on the inside of the container or on a substrate on which the container is mounted.

Claims (55)

1. An oscillator comprising:

a vibrator element;

a container in which the vibrator element is housed;

a base substrate on which the container is mounted via one or more supporting bodies;

at least one of a heating element and a cooling body configured to control temperature on an inside of the container;

an oscillation circuit electrically connected to the vibrator element;

a D/A conversion circuit configured to control a frequency output by the oscillation circuit;

a first reference-voltage generation circuit configured to supply voltage to the D/A conversion circuit; and

a second reference-voltage generation circuit configured to generate, on the basis of a power supply voltage supplied from outside of the oscillator, a power supply voltage of the oscillation circuit, wherein

temperature of the first reference-voltage generation circuit is controlled by the at least one of the heating element and the cooling body, and

the container is elevated and separated from the base substrate by being supported by the one or more supporting bodies.

2. The oscillator according to claim 1 , wherein the first reference-voltage generation circuit is housed on the inside of the container.

3. The oscillator according to claim 1 , wherein

the base substrate is a first substrate on which the container is mounted via a first supporting body,

the oscillator further comprises: a second substrate on which the first substrate is mounted via a second supporting body, and

the first reference-voltage generation circuit is mounted on the first substrate.

4. The oscillator according to claim 1 , wherein

the base substrate is a first substrate on which the container is mounted via a first supporting body,

the oscillator further comprises: a second substrate on which the first substrate is mounted via a second supporting body,

the at least one of the heating element and the cooling body is disposed on the first substrate, and

the first reference-voltage generation circuit is mounted on the first substrate.

5. The oscillator according to claim 3 , wherein the at least one of the heating element and the cooling body is disposed on an outer surface of the container opposed to the first substrate.

6. The oscillator according to claim 1 , wherein

the at least one of the heating element and the cooling body is the heating element, and

the heating element is a heater.

7. The oscillator according to claim 1 , wherein

the at least one of the heating element and the cooling body is the cooling body, and

the cooling body is a Peltier element.

8. The oscillator according to claim 2 , wherein

the oscillation circuit includes:

a circuit for oscillation configured by a semiconductor element; and

an electronic component, and

the semiconductor element is housed on the inside of the container.

9. The oscillator according to claim 3 , wherein

the oscillation circuit includes:

a circuit for oscillation configured by a semiconductor element; and

an electronic component, and

the semiconductor element is mounted on the first substrate.

10. The oscillator according to claim 4 , wherein

the oscillation circuit includes:

a circuit for oscillation configured by a semiconductor element; and

an electronic component, and

the semiconductor element is mounted on the first substrate.

11. The oscillator according to claim 1 , wherein

the oscillation circuit is configured by a semiconductor element, and

the semiconductor element is housed on the inside of the container.

12. The oscillator according to claim 2 , further comprising a thermosensitive element configured to detect the temperature on the inside of the container.

13. The oscillator according to claim 3 , further comprising a thermosensitive element disposed on an outer surface of the container.

14. The oscillator according to claim 4 , further comprising a thermosensitive element disposed on the first substrate.

15. The oscillator according to claim 2 , wherein the D/A conversion circuit is housed on the inside of the container.

16. The oscillator according to claim 3 , wherein the D/A conversion circuit is mounted on the first substrate.

17. The oscillator according to claim 4 , wherein the D/A conversion circuit is mounted on the first substrate.

18. The oscillator according to claim 17 , wherein the first reference-voltage generation circuit and the D/A conversion circuit are included in one semiconductor element.

19. An electronic apparatus comprising the oscillator according to claim 1 .

20. A moving object comprising the oscillator according to claim 1 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 16, 2016
From: OKUBO, MASAAKI
To: SEIKO EPSON CORPORATION
Reel/Frame 038110/0302 →
Priority Claims (3)
JP 2015-066968 · Mar 27, 2015 · national
JP 2015-067451 · Mar 27, 2015 · national
JP 2015-067452 · Mar 27, 2015 · national
Continuity (1)
Related Publication 20160285461A1 · Sep 29, 2016