Image device having multi-layered refractive layer on back surface
An image sensor device is disclosed. The image sensor device includes: a substrate having a front surface and a back surface; a radiation-sensing region formed in the substrate; an opening extending from the back surface of the substrate into the substrate; a first metal oxide film including a first metal, the first metal oxide film being formed on an interior surface of the opening; and a second metal oxide film including a second metal, the second metal oxide film being formed over the first metal oxide film; wherein the electronegativity of the first metal is greater than the electronegativity of the second metal. An associated fabricating method is also disclosed.
1. An image sensor device, comprising:
a substrate having a front surface and a back surface;
at least two adjacent radiation-sensing regions formed in the substrate;
an opening extending from the back surface of the substrate into the substrate between the two adjacent radiation-sensing regions;
an isolation feature formed of dielectric material in the substrate between the at least two adjacent radiation-sensing regions and abutting the front surface; and
a film conformally and completely covering an interior surface of the opening and the back surface of the substrate;
wherein the film consists of an aluminum oxide layer, a hafnium oxide layer, and a tantalum oxide layer sequentially stacked up from the substrate in a contiguous and conformal manner.
2. The image sensor device of claim 1 , further comprising a doped isolation region in the substrate.
3. The image sensor device of claim 2 , wherein—the at least two adjacent radiation-sensing regions are separated by the doped isolation region.
4. The image sensor device of claim 1 , wherein the opening has a depth greater than 1.5 um.
5. The image sensor device of claim 1 , wherein each of a thickness of the aluminum oxide layer, a thickness of the hafnium oxide layer, and a thickness of the tantalum oxide layer is greater than 30 angstroms.
6. The image sensor device of claim 1 , further comprising an interlayer between the film and the interior surface of the opening.
7. An image sensor device, comprising:
a substrate having a front surface and a back surface;
at least two adjacent radiation-sensing regions formed in the substrate;
an opening extending from the back surface of the substrate into the substrate between the two adjacent radiation-sensing regions;
an isolation feature formed of dielectric material in the substrate between the at least two adjacent radiation-sensing regions and abutting the front surface; and
a film conformally and completely covering an interior surface of the opening and the back surface of the substrate, the film consisting of an aluminum oxide layer, a hafnium oxide layer, and a tantalum oxide layer sequentially stacked up from the substrate toward the opening in a contiguous and conformal manner, and refractive indexes of the aluminum oxide layer, the hafnium oxide layer and the tantalum oxide layer being an increasing sequence from the substrate toward the opening.
8. The image sensor device of claim 7 , further comprising a doped isolation region in the substrate.
9. The image sensor device of claim 8 , wherein the at least two adjacent radiation-sensing regions are separated by the doped isolation region.
10. The image sensor device of claim 8 , wherein the doped isolation region is doped with a doping polarity the same as a doping polarity of the substrate.
11. The image sensor device of claim 10 , wherein a doping concentration of the doped isolation region is higher than a doping concentration of the substrate.
12. The image sensor device of claim 8 , further comprising an interlayer between the aluminum oxide layer and the interior surface of the opening.
13. The image sensor device of claim 12 , wherein the interlayer includes SiO 2 .
14. The image sensor device of claim 8 , wherein the doped isolation region is aligned with the isolation feature.
15. A sensor device, comprising:
a substrate having a surface;
at least two adjacent radiation-sensing regions formed in the substrate;
a trench isolation extending from the surface of the substrate into the substrate between the two adjacent radiation-sensing regions;
an isolation feature formed of dielectric material in the substrate between the at least two adjacent radiation-sensing regions and abutting the front surface;
a doped isolation region in the substrate; and
a film lining between the trench isolation and the substrate;
wherein the film consists of an aluminum oxide layer, a hafnium oxide layer, and a tantalum oxide layer sequentially stacked up from the substrate in a contiguous and conformal manner, and a refractive index of the tantalum oxide layer is greater than a refractive index of the hafnium oxide layer, and the refractive index of the hafnium oxide layer is greater than a refractive index of the aluminum oxide layer.
16. The sensor device of claim 15 , wherein each of a thickness of the aluminum oxide layer, a thickness of the hafnium oxide layer, and a thickness of the tantalum oxide layer is greater than 30 angstroms.
17. The sensor device of claim 15 , wherein the at least two adjacent radiation-sensing regions are separated by the doped isolation region.
18. The sensor device of claim 15 , wherein the doped isolation region is doped with a doping polarity the same as a doping polarity of the substrate.
19. The sensor device of claim 18 , wherein a doping concentration of the doped isolation region is higher than a doping concentration of the substrate.
20. The sensor device of claim 15 , wherein the doped isolation region is aligned with the isolation feature.