Low profile IC package

1. A low profile IC package, comprising:

a single redistribution layer comprising:

a plurality of dielectric material layers stacked one on top another in a thickness direction of the single redistribution layer; and

a redistribution circuitry embedded in the plurality of dielectric material layers, the redistribution circuitry comprising:

a plurality of bottom pads at a bottommost surface of a bottommost dielectric material layer among the plurality of dielectric material layers, the plurality of bottom pads having a pad dimension and pad density configured for the IC package to mount onto a mother board;

a plurality of top pads at a topmost surface of a topmost dielectric material layer among the plurality of dielectric material layers, the plurality of top pads having a pad dimension and pad density configured for an IC chip to mount thereon;

a plurality of conductive layers embedded in the plurality of dielectric material layers, and stacked one above another in the thickness direction between the plurality of bottom pads and the plurality of top pads; and

a plurality of conductive vias embedded in the plurality of dielectric material layers, and electrically coupling the plurality of conductive layers with each other and with the plurality of bottom pads and the plurality of top pads; and

a first monolithic molding compound wrapping around the single redistribution layer on four sides of the single redistribution layer, wherein

the IC package is free of any interposer, and

the first monolithic molding compound has a side face in direct contact with side faces of the plurality of dielectric material layers.

2. A low profile IC package as claimed in claim 1 further comprising:

an IC chip mounted on top of the single redistribution layer; and

a second molding compound on top of the single redistribution layer and the first monolithic molding compound, wherein

the IC chip is embedded in the second molding compound.

3. A low profile IC package as claimed in claim 2 further comprising:

a solder resist layer on bottom of the single redistribution layer, wherein the plurality of bottom pads are exposed out of the solder resist layer; and

a plurality of solder balls, each on a bottom of a corresponding exposed bottom pad among the plurality of bottom pads.

4. A low profile IC package as claimed in claim 3 , wherein

the IC chip mounted directly on the plurality of top pads, and

each of the plurality of solder balls is directly on the corresponding exposed bottom pad among the plurality of bottom pads.

5. A low profile IC package as claimed in claim 1 wherein, in a plan view along the thickness direction of the dielectric material, at least one side of the four sides of the single redistribution layer has a zigzag shape.

6. A low profile IC package as claimed in claim 1 , wherein, in a cross-section view taken along the thickness direction of the dielectric material,

the single redistribution layer has a step along at least one side of the four sides of said single redistribution layer, and

the first molding compound has another step corresponding to the step of said single redistribution layer.

7. A low profile IC package as claimed in claim 1 , wherein

a topmost surface of the first monolithic molding compound is flush with the topmost surface of the topmost dielectric material layer, and with topmost surfaces of the plurality of top pads, and

a bottommost surface of the first monolithic molding compound is flush with the bottommost surface of the bottommost dielectric material layer, and with bottommost surfaces of the plurality of bottom pads.

8. A low profile IC package as claimed in claim 7 , further comprising:

an IC chip mounted directly on the plurality of top pads; and

a second monolithic molding compound on top of the single redistribution layer and the first monolithic molding compound, wherein

the IC chip is embedded in the second molding compound, and

a bottommost surface of the second molding compound is in direct contact with the topmost surface of the first monolithic molding compound and the topmost surface of the topmost dielectric material layer.

9. A low profile IC package as claimed in claim 8 , further comprising:

a solder resist layer on bottom of the single redistribution layer, wherein the plurality of bottom pads are exposed out of the solder resist layer; and

a plurality of solder balls, each directly on a bottom of a corresponding exposed bottom pad among the plurality of bottom pads, wherein

a topmost surface of the solder resist layer is in direct contact with the bottommost surface of the first monolithic molding compound and the bottommost surface of the bottommost dielectric material layer.

10. A fabrication process, comprising:

forming a single redistribution layer on top of a temporary carrier wherein the single redistribution layer comprises:

a dielectric material; and

a redistribution circuitry embedded in the dielectric material, the redistribution circuitry comprising:

a plurality of bottom pads formed at a bottommost surface of the dielectric material, the plurality of bottom pads having a pad dimension and pad density configured for the IC package to mount onto a mother board;

a plurality of top pads formed at a topmost surface of the dielectric material, the plurality of top pads having a pad dimension and pad density configured for an IC chip to mount thereon;

a plurality of conductive layers stacked one above another in a thickness direction of the dielectric material between the plurality of bottom pads and the plurality of top pads; and

a plurality of conductive vias electrically coupling the plurality of conductive layers with each other and with the plurality of bottom pads and the plurality of top pads;

after said forming the single redistribution layer, etching the dielectric material to divide the single redistribution layer into a plurality of redistribution layer units;

after said etching, forming a first molding compound to wrap each redistribution layer unit among the plurality of redistribution layer units on four sides of the redistribution layer unit;

after said forming the first molding compound, mounting a plurality of IC chips each on top of a corresponding redistribution layer unit among the plurality of redistribution layer units;

after said mounting the plurality of IC chips, forming a second molding compound on top of the plurality of redistribution layer units and the first molding compound to embed the plurality of IC chips in the second molding compound;

after said forming the second molding compound, removing the temporary carrier; and

after said removing the temporary carrier, singulating to produce a plurality of IC packages.

11. A fabrication process as claimed in claim 10 , further comprising:

before said forming the single redistribution layer,

forming a releasing layer on top of the temporary carrier; and

forming a seed layer on top of the releasing layer, wherein the single redistribution layer is formed on top of the seed layer; and

after said removing the temporary carrier and before said singulating,

removing the seed layer;

forming a solder resist layer on bottom of the single redistribution layer while leaving the plurality of the bottom pads exposed from the solder resist layer; and

planting a plurality of solder balls each on a corresponding exposed bottom pad among the plurality of bottom pads.

12. A fabrication process as claimed in claim 10 , wherein the single redistribution layer is free of an interposer.

13. A fabrication process as claimed in claim 12 , wherein a material of the first molding compound is different from the dielectric material in the single redistribution layer.

14. A fabrication process as claimed in claim 12 , wherein

said etching the dielectric material comprises forming a plurality of trenches in the dielectric material, each trench among the plurality of trenches extending in the thickness direction through an entire thickness of the dielectric material, and

said forming the first molding compound comprises completely filling the plurality of trenches with the first molding compound.

15. A fabrication process as claimed in claim 12 , wherein, in a plan view along the thickness direction of the dielectric material, at least one side of the four sides of each redistribution layer unit among the plurality of redistribution layer units has a zigzag shape.

16. A fabrication process as claimed in claim 12 , wherein, in a cross-section view taken along the thickness direction of the dielectric material,

each redistribution layer unit among the plurality of redistribution layer units has a step along at least one side of the four sides of said redistribution layer unit, and

the first molding compound has another step corresponding to the step of said redistribution layer unit.

17. A low profile IC package, comprising:

a single redistribution layer comprising:

a dielectric material; and

a redistribution circuitry embedded in the dielectric material, the redistribution circuitry comprising:

a plurality of bottom pads at a bottommost surface of the dielectric material, the plurality of bottom pads having a pad dimension and pad density configured for the IC package to mount onto a mother board;

a plurality of top pads at a topmost surface of the dielectric material, the plurality of top pads having a pad dimension and pad density configured for an IC chip to mount thereon;

a plurality of conductive layers stacked one above another in a thickness direction of the dielectric material between the plurality of bottom pads and the plurality of top pads; and

a plurality of conductive vias electrically coupling the plurality of conductive layers with each other and with the plurality of bottom pads and the plurality of top pads; and

a first molding compound wrapping around the single redistribution layer on four sides of the single redistribution layer, wherein

the IC package is free of any interposer,

a topmost surface of the first molding compound is flush with the topmost surface of the dielectric material, and with topmost surfaces of the plurality of top pads, and

a bottommost surface of the first molding compound is flush with the bottommost surface of the dielectric material, and with bottommost surfaces of the plurality of bottom pads.

18. A low profile IC package as claimed in claim 17 , further comprising:

an IC chip mounted directly on the plurality of top pads; and

a second molding compound on top of the single redistribution layer and the first molding compound, wherein

the IC chip is embedded in the second molding compound, and

a bottommost surface of the second molding compound is in direct contact with the topmost surface of the first molding compound and the topmost surface of the dielectric material.

19. A low profile IC package as claimed in claim 18 , further comprising:

a solder resist layer on bottom of the single redistribution layer, wherein the plurality of bottom pads are exposed out of the solder resist layer; and

a plurality of solder balls, each directly on a bottom of a corresponding exposed bottom pad among the plurality of bottom pads, wherein

a topmost surface of the solder resist layer is in direct contact with the bottommost surface of the first molding compound and the bottommost surface of the dielectric material.

20. A low profile IC package as claimed in claim 17 , wherein, in a plan view along the thickness direction of the dielectric material, each of the four sides of the single redistribution layer has a zigzag shape.