Patent Assignment
Reel/Frame 075543/0195
Assignment of Assignor's Interest
Recorded: 2026-08-06
Pages: 7
Assignor
HU, DYI-CHUNG
Executed: 2026-01-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Properties
(21)
Interposer and Packaging Substrate Having the Interposer
Package Substrate
Molding Compound Supported Rdl for Ic Package
Redistribution Film for Ic Package
Molding Compound Supported Rdl for Ic Package
Thin Film Rdl for Ic Package
Wafer Reconfiguration
Stacked Package-on-Package Memory Devices
Thin Film Rdl for Nanochip Package
Bonding Process for a Chip Bonding to a Thin Film Substrate
Package Substrate with Lateral Communication Circuitry
Patent:
9,543,249 →
Application:
14/859,464 →
Molding Compound Wrapped Package Substrate
System in Package
Circuit Board Structure with Embedded Fine-Pitch Wires and Fabrication Method Thereof
Composite Carrier for Warpage Management
Low Profile Ic Package
Embedded Optical Fiber Module
Coaxial Copper Pillar
Package Substrate with Embedded Circuit
Fabricating Process for Package Substrate
Glass Fiber Reinforced Package Substrate