Method of manufacturing semiconductor device and non-transitory computer-readable recording medium
To improve the characteristics of a film formed on a substrate, a method of manufacturing a semiconductor device includes: loading a substrate into a processing container, the substrate being provided with a film having a silazane bond, the film being subjected to pre-baking; supplying oxygen-containing gas at a first temperature not higher than the temperature of the pre-baking; and supplying processing gas containing at least any one of steam and hydrogen peroxide at a second temperature higher than the first temperature.
1. A method of manufacturing a semiconductor device comprising:
loading a substrate into a processing container, the substrate being provided with a film having a silazane bond, the film being subjected to pre-baking;
supplying oxygen-containing gas to the substrate at a first temperature not higher than a temperature of the pre-baking; and
supplying processing gas containing at least any one of steam or hydrogen peroxide to the substrate at a second temperature higher than the first temperature, where supplying processing gas is performed after supplying oxygen-containing gas; and
annealing in which supply of the processing gas and the oxygen-containing gas is stopped and nitrogen-containing gas is supplied, after the supplying processing gas.
2. The method of manufacturing a semiconductor device according to claim 1 , wherein the oxygen-containing gas contains at least one of oxygen gas, ozone gas, nitric oxide gas and nitrous oxide gas.
3. The method of manufacturing a semiconductor device according to claim 2 , wherein the film having the silazane bond is a film containing a silazane bond of a low molecular weight, and the oxygen-containing gas is supplied to the substrate to change skeletal structure of the silazane bond of the low molecular weight to silicon oxide, in the supplying the oxygen-containing gas.
4. The method of manufacturing a semiconductor device according to claim 1 , wherein the oxygen-containing gas is supplied to the substrate to change skeletal structure of the silazane bond to silicon oxide, in supplying oxygen-containing gas.
5. The method of manufacturing a semiconductor device according to claim 1 , including exhausting the inside of the processing container while keeping the temperature of the substrate, after the supplying the processing gas.
6. The method of manufacturing a semiconductor device according to claim 5 , including cooling the substrate after supplying inert gas into the processing container while keeping the temperature of the substrate until a pressure of the inside of the processing container reaches a predetermined pressure, after the exhausting the inside of the processing container.
7. The method of manufacturing a semiconductor device according to claim 1 , wherein the first temperature is 150° C. or lower, and the second temperature is in a range from 250° C. to 400° C.
8. The method of manufacturing a semiconductor device according to claim 1 , wherein the film having the silazane bond is a film containing a silazane bond of a low molecular weight, and skeletal structure of the silazane bond of the low molecular weight is changed to silicon oxide, in the supplying the oxygen-containing gas.
9. The method of manufacturing a semiconductor device according to claim 1 , wherein the film having the silazane bond is a film formed by a CVD method.
10. A non-transitory computer-readable recording medium configured to record a program to be executed by a computer, the program including procedures of:
loading a substrate into a processing container, the substrate being provided with a film having a silazane bond, the film being subjected to pre-baking;
supplying oxygen-containing gas to the substrate at a first temperature not higher than a temperature of the pre-baking; and
supplying processing gas containing at least any one of steam or hydrogen peroxide to the substrate at a second temperature higher than the first temperature, where supplying processing gas is performed after supplying oxygen-containing gas; and
annealing in which supply of the processing gas and the oxygen-containing gas is stopped and nitrogen-containing gas is supplied, after supplying processing gas.
11. A method of manufacturing a semiconductor device comprising:
loading a substrate into a processing container, the substrate being provided with a film having a silazane bond, the film being subjected to pre-baking;
supplying oxygen-containing gas to the substrate at a first temperature not higher than a temperature of the pre-baking; and
supplying processing gas containing at least any one of steam or hydrogen peroxide to the substrate at a second temperature higher than the first temperature;
exhausting the inside of the processing container while keeping the temperature of the substrate, after supplying processing gas; and
cooling the substrate after supplying inert gas into the processing container while keeping the temperature of the substrate until a pressure of the inside of the processing container reaches a predetermined pressure, after exhausting the inside of the processing container.