Semiconductor integrated circuit device and a method of manufacturing the same
A semiconductor device including a memory cell featuring a first gate insulating film over a semiconductor substrate, a control gate electrode over the first gate insulating film, a second gate insulating film over the substrate and a side wall of the control gate electrode, a memory gate electrode over the second gate insulating film arranged adjacent with the control gate electrode through the second gate insulating film, first and second semiconductor regions in the substrate positioned on a control gate electrode side and a memory gate side, respectively, the second gate insulating film featuring a first film over the substrate, a charge storage film over the first film and a third film over the second film, the first film having a first portion between the substrate and memory gate electrode and a thickness greater than that of a second portion between the control gate electrode and the memory gate electrode.
1. A semiconductor device having a first memory cell and a second memory cell, comprising:
a semiconductor substrate having a main surface;
a first active region of the first memory cell and a second active region of the second memory cell formed on the main surface of the semiconductor substrate and extending in a first direction, the first active region and the second active region being arranged in a second direction which is perpendicular to the first direction;
a device isolated region formed between the first active region and the second active region and extending in the first direction;
a first gate electrode continuously formed over the first active region and the second active region via a first gate insulating film, and extending in the second direction so as to across the first active region, the device isolated region and the second active region;
a second gate electrode continuously formed over the first active region and the second active region via a second gate insulating film and arranged adjacent with the first gate electrode, and extending in the second direction so as to across the first active region, the device isolated region and the second active region;
an insulating film formed between the first gate electrode and the second gate electrode, and isolating the first gate electrode from the second gate electrode;
a first semiconductor region and a second semiconductor region formed in the first active region at both sides of the first gate electrode and the second gate electrode;
a third semiconductor region and a fourth semiconductor region formed in the second active region at both sides of the first gate electrode and the second gate electrode; and
a first metal wiring connected to the first semiconductor region and the third semiconductor region, and extending in the second direction,
wherein the second gate insulating film has a charge accumulation part therein,
wherein the first semiconductor region and the third semiconductor region are positioned a same side of the first gate electrode and the second gate electrode, and
wherein the first semiconductor region is isolated from the third semiconductor region by the device isolated region.
2. The semiconductor device according to claim 1 , further comprising:
a second metal wiring extending in the first direction and connected to the second semiconductor region; and
a third metal wiring extending in the first direction and connected to the fourth semiconductor region.
3. The semiconductor device according to claim 2 , further comprising:
an interlayer insulating film formed over the main surface of the semiconductor substrate so as to cover the second semiconductor region and the fourth semiconductor region;
a first contact plug electrode formed in the interlayer insulating film and over the second semiconductor region; and
a second contact plug electrode formed in the interlayer insulating film and over the fourth semiconductor region,
wherein the second metal wiring is connected to the second semiconductor region via the first contact plug electrode,
wherein the third metal wiring is connected to the fourth semiconductor region via the second contact plug electrode.
4. The semiconductor device according to claim 1 ,
wherein the first metal wiring comprises a third contact plug electrode formed in the interlayer insulating film.
5. The semiconductor device according to claim 1 ,
wherein the device isolated region comprises a shallow trench isolation including an isolation material embedded in a groove.
6. The semiconductor device according to claim 1 ,
wherein the charge accumulating part comprises a silicon nitride film.