IP Library Granted Patent US 10,382,002
Granted Patent B2
US 10,382,002 · App. 15/081,715 · Granted Aug 13, 2019

Apparatus and methods for tunable phase networks

Inventor: Chris Levesque (Fountain Valley, CA)
Assignee: TDK Corporation
H03H7/20
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Quick Facts
Patent No.
US 10,382,002
App. No.
15/081,715
Granted
Aug 13, 2019
Kind
B2
Abstract

A radio frequency system is described. A radio frequency system including at least a first tunable phasing network including at least one first set of metal oxide semiconductor variable capacitor arrays. The first tunable phasing network is configured to shift a phase of a radio frequency signal. And, at least a first switch coupled with the first tunable phasing network. The first switched configured to switch between one or more receiver circuits.

Claims (28)

1. A radio frequency system comprising:

a semiconductor chip including:

at least a first tunable phasing network including at least one first set of metal oxide semiconductor variable capacitor arrays including anti-series metal oxide semiconductor capacitors each anti-series metal oxide semiconductor capacitor including at least a first transistor and a second transistor, the first transistor including a first transistor gate, a first transistor source, and a first transistor drain, the second transistor including a second transistor gate, a second transistor source, and a second transistor drain, the first gate of the first transistor and the second gate of the second transistor are electrically coupled, said first tunable phasing network configured to shift a phase of a radio frequency signal; and

at least a first silicon on insulator switch coupled with said first tunable phasing network, said first silicon on insulator switch configured to switch between one or more receiver circuits.

2. The radio frequency system of claim 1 , further comprising at least a second tunable phasing network including at least one second set of metal oxide semiconductor variable capacitor arrays.

3. The radio frequency system of claim 1 , further comprising at least a second silicon on insulator switch configured to couple one or more transmitter circuits to an antenna.

4. The radio frequency system of claim 1 , further comprising an interface coupled with at least said first silicon on insulator switch, said interface configured to receive one or more control signals for said first silicon on insulator switch.

5. The radio frequency system of claim 2 , further comprising at least a second silicon on insulator switch coupled with said second tunable phasing network, said second silicon on insulator switch configured to couple said second tunable phasing network to a first set of one or more receiver circuits.

6. The radio frequency system of claim 5 , further comprising at least a second silicon on insulator switch coupled with said second tunable phasing network, said second silicon on insulator switch configured to couple said second tunable phasing network to a second set of one or more receiver circuits.

7. The radio frequency system of claim 4 , wherein said interface is a mobile industry processor interface.

8. The radio frequency system of claim 6 , further comprising at least a third silicon on insulator switch coupled with a third tunable phasing network, said third silicon on insulator switch configured to couple said third tunable phasing network to a third set of one or more receiver circuits.

9. The radio frequency system of claim 8 , wherein each of said first tunable phasing network, said second tunable phasing network, and said third phasing network are assigned to one of a plurality of carrier aggregation bands.

10. The radio frequency system of claim 1 , wherein said at least one first set of metal oxide semiconductor variable capacitor arrays and at least one second set of metal oxide semiconductor variable capacitor arrays includes at least three variable capacitor cells electrically connected in parallel.

11. The radio frequency system of claim 10 , wherein each of said at least three variable capacitor cells includes two or more pairs of anti-series metal oxide semiconductor capacitors.

12. A semiconductor for a radio frequency system comprising:

a plurality of phasing networks, each of said plurality of phasing networks including at least one first set of metal oxide semiconductor variable capacitor arrays including anti-series metal oxide semiconductor capacitors each anti-series metal oxide semiconductor capacitor including at least a first transistor and a second transistor, the first transistor including a first transistor gate, a first transistor source, and a first transistor drain, the second transistor including a second transistor gate, a second transistor source, and a second transistor drain, the first gate of the first transistor and the second gate of the second transistor are electrically coupled, at least a first tunable phasing network of said plurality of phasing networks configured to shift a phase of a radio frequency signal; and

a plurality of silicon on insulator switches, at least a first silicon on insulator switch of said plurality of silicon on insulator switches coupled with said first tunable phasing network, said first silicon on insulator switch configured to switch between one or more receiver circuits.

13. The radio frequency system of claim 12 , further comprising at least a second tunable phasing network of said plurality of phasing networks including at least one second set of metal oxide semiconductor variable capacitor arrays.

14. The radio frequency system of claim 12 , further comprising at least a second silicon on insulator switch of said plurality of silicon on insulator switches configured to couple one or more transmitter circuits to an antenna.

15. The radio frequency system of claim 12 , further comprising an interface coupled with at least said first silicon on insulator switch of said plurality of silicon on insulator switches, said interface configured to receive one or more control signals for said first silicon on insulator switch.

16. The radio frequency system of claim 13 , further comprising at least a second silicon on insulator switch of said plurality of silicon on insulator switches coupled with said second tunable phasing network of said plurality of silicon on insulator switches, said second silicon on insulator switch of said plurality of silicon on insulator switches configured to couple said second tunable phasing network of said plurality of phasing networks to a first set of one or more receiver circuits.

17. The radio frequency system of claim 16 , further comprising at least a second silicon on insulator switch of said plurality of switches coupled with said second tunable phasing network of said plurality of phasing networks, said second silicon on insulator switch configured to couple said second tunable phasing network to a second set of one or more receiver circuits.

18. The radio frequency system of claim 15 , wherein said interface is a mobile industry processor interface.

19. The radio frequency system of claim 17 , further comprising at least a third silicon on insulator switch coupled with a third tunable phasing network, said third silicon on insulator switch configured to couple said third tunable phasing network to a third set of one or more receiver circuits.

20. A radio-frequency system comprising:

a semiconductor chip including:

a means for shifting a phase of a radio frequency signal including at least one first set of metal oxide semiconductor variable capacitor arrays including anti-series metal oxide semiconductor capacitors each anti-series metal oxide semiconductor capacitor including at least a first transistor and a second transistor, the first transistor including a first transistor gate, a first transistor source, and a first transistor drain, the second transistor including a second transistor gate, a second transistor source, and a second transistor drain, the first gate of the first transistor and the second gate of the second transistor are electrically coupled; and

a means for switching between one or more receiver circuits coupled with said first tunable phasing network formed on a silicon on insulator substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2017
From: NEWLANS, INC.
To: TDK CORPORATION
Reel/Frame 042197/0674 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 8, 2017
From: LEVESQUE, CHRIS
To: NEWLANS, INC.
Reel/Frame 041909/0727 →
Continuity (2)
Provisional Application 62139362 · Mar 27, 2015
Related Publication 20160285432A1 · Sep 29, 2016