MOS capacitors structures for variable capacitor arrays and methods of forming the same
A capacitor structure is described. A capacitor structure including a substrate; a source/drain region formed in the substrate to form an active area having an active area width; and a plurality of gates formed above the substrate. The source/drain region having a reflection symmetry. Each of the plurality of gates having a gate width. The gate width is configured to be less than said active area width. And, the plurality of gates are formed to have reflection symmetry.
1. A capacitor structure comprising:
a substrate;
a source/drain region formed in said substrate to form an active area having an active area width, said source/drain region having a reflection symmetry; and
a plurality of gates formed above said substrate, each of said plurality of gates having a gate width, said gate width configured to be less than said active area width, and said plurality of gates formed to have reflection symmetry.
2. The capacitor structure of claim 1 , wherein said substrate is an silicon-on-insulator substrate.
3. The capacitor structure of claim 1 , wherein said plurality of source/drain regions, and said plurality of gates are interconnected to form one or more pairs of capacitors connected in an anti-series configuration.
4. The capacitor structure of claim 1 , wherein said plurality of source/drain regions, and said plurality of gates are interconnected to form a variable capacitor cell of a variable capacitor array.
5. The capacitor structure of claim 4 , wherein the variable capacitor cell is part of an integrated circuit.
6. The capacitor structure of claim 1 , wherein said plurality of source/drain regions, and said plurality of gates are interconnected to form a plurality of variable capacitor cells of a variable capacitor array.
7. A method to form a plurality of capacitors comprising:
forming a source/drain region in a substrate to form an active area having an active area width, said source/drain region having reflection symmetry; and
forming a plurality of gates above said substrate, each of said plurality of gates having a gate width, said gate width configured to be less than said active area width, and said plurality of gates formed to have reflection symmetry.
8. The method of claim 7 , wherein said substrate is an silicon-on-insulator substrate.
9. The method of claim 7 , further comprising forming connections between said plurality of source/drain regions, and said plurality of gates to form one or more pairs of capacitors connected in an anti-series configuration.
10. The method of claim 7 , further comprising forming connections between said plurality of source/drain regions, and said plurality of gates to form a variable capacitor cell of a variable capacitor array.
11. The capacitor structure of claim 7 , further comprising forming connections between said plurality of source/drain regions, and said plurality of gates to form a plurality of variable capacitor cells of a variable capacitor array.
12. An integrated circuit comprising:
a substrate;
a source/drain region formed in said substrate to form an active area having an active area width, said source/drain region having an active area width; and
a plurality of gates formed above said substrate, each of said plurality of gates having a gate width, said gate width configured to be less than said active area width, and said plurality of gates formed to have reflection symmetry.
13. The integrated circuit of claim 12 , wherein said substrate is a silicon-on-insulator substrate.
14. The integrated circuit of claim 12 , wherein said plurality of source/drain regions, and said plurality of gates are interconnected to form one or more pairs of capacitors connected in an anti-series configuration.
15. The integrated circuit of claim 12 , wherein said plurality of source/drain regions, and said plurality of gates are interconnected to form a variable capacitor cell of a variable capacitor array.
16. The integrated circuit of claim 12 , wherein said plurality of source/drain regions, and said plurality of gates are interconnected to form a plurality of variable capacitor cells of a variable capacitor array.
17. The integrated circuit of claim 12 , further comprising a bias voltage generator configured to generate a bias voltage for each one of said plurality of variable capacitor cells of said variable capacitor array.
18. The integrated circuit of claim 17 , further comprising an interface configured to receive a control signal for said bias voltage generator used to adjust a value of said bias voltage for each one of said plurality of variable capacitor cells of said variable capacitor array.
19. The integrated circuit of claim 18 , wherein said interface is a Mobile Industry Processor Interface radio front end interface.
20. The integrated circuit of claim 12 , wherein said plurality of source/drain regions, and said plurality of gates are interconnected to form a plurality of variable capacitor arrays.