IP Library Granted Patent US 10,600,619
Granted Patent B2
US 10,600,619 · App. 15/091,730 · Granted Mar 24, 2020

Plasma processing apparatus

Inventors: Yoshiharu Inoue (Yamaguchi, JP); Tetsuo Ono (Yamaguchi, JP); Michikazu Morimoto (Yamaguchi, JP); Masaki Fujii (Yamaguchi, JP); Masakazu Miyaji (Yamaguchi, JP)
Assignee: HITACHI HIGH-TECHNOLOGIES CORPORATION
H01J37/32266H01J37/3266H01J37/32192H01J37/32935H01L21/3065H01L21/32137H01L21/67069H01L22/26H01J2237/2485H01J2237/334
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Quick Facts
Patent No.
US 10,600,619
App. No.
15/091,730
Granted
Mar 24, 2020
Kind
B2
Abstract

A plasma processing method in which a stable process region can be ensured in a wide range, from low microwave power to high microwave power. The plasma processing method includes making production of plasma easy in a region in which production of plasma by continuous discharge is difficult, and plasma-processing an object to be processed, with the generated plasma, wherein the plasma is produced by pulsed discharge in which ON and OFF are repeated, radio-frequency power for producing the pulsed discharge, during an ON period, is a power to facilitate production of plasma by continuous discharge, and a duty ratio of the pulsed discharge is controlled so that an average power of the radio-frequency power per cycle is power in the region in which production of plasma by continuous discharge is difficult.

Claims (12)

1. A plasma processing apparatus, comprising:

a processing chamber configured to plasma etch a wafer;

a radio-frequency power supply configured to supply radio-frequency power for generating plasma into the processing chamber;

a pulse generator configured to generate pulse for ON-OFF modulation of the radio-frequency power;

a sample stage configured to hold the wafer;

a control computer configured to control the radio-frequency power supply so as to provide a power value in a region in which plasma instability does not occur when generating plasma by continuous discharge to the processing chamber, and

control the pulse generator so as to generate the pulse of a duty ratio so as to control the time average value of the power by ON-OFF modulating the power of the power supply, setting the peak power during ON to a value which when plasma is generated by continuous discharge, instability of the plasma does not occur, and changing a duty ratio of the ON-OFF modulation.

2. The plasma processing apparatus according to claim 1 ,

wherein an OFF period of the pulse is set to a period of 10 ms or less.

3. The plasma processing apparatus according to claim 1 ,

wherein the radio-frequency power is a microwave radio-frequency power, and

the plasma processing apparatus further comprises a magnetic field generation means which generates in the processing chamber a magnetic field that generates the plasma by an interaction with the microwave.

Assignments (1)
CHANGE OF NAME Recorded Mar 25, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052220/0045 →
Priority Claims (3)
JP 2011-163831 · Jul 27, 2011 · national
JP 2011-211896 · Sep 28, 2011 · national
JP 2011-232446 · Oct 24, 2011 · national
Continuity (3)
Continuation 14452578 · Aug 6, 2014
Continuation 13363415 · Feb 1, 2012
Related Publication 20160225587A1 · Aug 4, 2016
Cited By (6)
US 12,230,477 US 12,348,228 US 12,354,832 US 12,437,967 US 12,451,811 US 12,555,745