Reaction system for growing a thin film
An atomic deposition (ALD) thin film deposition apparatus includes a deposition chamber configured to deposit a thin film on a wafer mounted within a space defined therein. The deposition chamber comprises a gas inlet that is in communication with the space. A gas system is configured to deliver gas to the gas inlet of the deposition chamber. At least a portion of the gas system is positioned above the deposition chamber. The gas system includes a mixer configured to mix a plurality of gas streams. A transfer member is in fluid communication with the mixer and the gas inlet. The transfer member comprising a pair of horizontally divergent walls configured to spread the gas in a horizontal direction before entering the gas inlet.
1. A substrate support for processing semiconductor substrates, the substrate support comprising:
a top surface extending along a first plane;
a recess formed in the top surface and extending between a circumferential wall that surrounds the recess, the circumferential wall extending downward from the first plane to a bottom surface of the recess, the bottom surface extending horizontally across the recess to connect opposite sides of the circumferential wall, the recess being configured such that the first plane of the top surface of the substrate support contacts a substrate only along an edge portion of a lower surface of the substrate; and
a plurality of pins extending upward from the first plane of the top surface in locations spaced radially outward from the circumferential wall, wherein adjacent pins of the plurality of pins are separated from each other by a circumferential space there between, wherein the top surface extending along the first plane is located along the circumferential space between the adjacent pins, is located between each pin and the circumferential wall on a radially inner side of each pin, and is located between each pin and an outer edge of the substrate support on a radially outer side of each pin, each of the plurality of pins having a side surface at least partially facing toward the circumferential wall, wherein the side surface is configured to contact an outward facing surface of the edge portion of the substrate to thereby horizontally constrain the substrate over the recess on the top surface.
2. The substrate support of claim 1 , wherein the recess is asymmetrically positioned on the top surface of the substrate support such that a first edge portion of the recess is a first distance from a first adjacent edge portion of the substrate support, and a second edge portion of the recess is opposite from the first edge portion of the recess and is positioned a second distance from a second adjacent edge portion of the substrate support, wherein the first distance is greater than the second distance.
3. The substrate support of claim 1 , wherein the recess has a depth from about 0.2 to about 0.5 millimeters.
4. The substrate support of claim 1 , wherein the recess has a generally circular shape.
5. The substrate support of claim 4 , wherein a center of the generally circular recess is positioned off-center with respect to an outer edge of the substrate support.
6. The substrate support of claim 1 , wherein the top surface of the substrate support is configured to form a generally circular seal with the substrate when the substrate is positioned on the substrate support.
7. The substrate support of claim 6 , wherein a center of the generally circular seal is positioned off-center with respect to an outer edge of the support.
8. The substrate support of claim 1 , wherein a top area of the substrate support between an edge of the substrate support and the recess is substantially flat.