Camera module and manufacturing method thereof
A camera module includes a circuit board, an optical lens, an insulating member, a photosensitive sensor, and an integral encapsulating support structure. The insulating member is disposed on the periphery of a photosensitive area of the photosensitive sensor to prevent the photosensitive sensor from contacting to and being damaged by the formation mold during the forming process of the integral encapsulating support structure and to prevent the fluid material from flowing to the photosensitive area of the photosensitive sensor.
1. A photosensitive sensor module,
at least a circuit board;
at least a photosensitive sensor having a photosensitive area and a non-photosensitive area on an upper surface of said photosensitive sensor;
at least an integral encapsulating support structure, integrally covering and enclosing at least a portion of said non-photosensitive area of said photosensitive sensor and at least a portion of an upper surface of said circuit board;
at least a filter element positioned over said photosensitive area of said photosensitive sensor; and
at least an insulating member which is a solidified adhesive formed by solidified material having a stickiness after solidification, wherein said insulating member is provided on said upper surface of said photosensitive sensor insulating said photosensitive area from said non-photosensitive area of said photosensitive sensor, and wherein said integral encapsulating support structure, said upper surface of said photosensitive sensor, and a lower surface of said filter element form an enclosed cavity, and said insulating member is located within said enclosed cavity for sticking dust within said enclosed cavity.
2. The photosensitive sensor module, as recited in claim 1 , wherein said solidified adhesive is applied along a periphery around at least said photosensitive sensor to form said insulating member on said periphery of said photosensitive sensor after said solidified adhesive is solidified to insulate said photosensitive area from said non-photosensitive area of said photosensitive sensor.
3. The photosensitive sensor module, as recited in claim 1 , wherein said solidified adhesive is solidified with a solidifying reaction selected from a group consisting of damp, heat, and UV lighting.
4. The photosensitive sensor module, as recited in claim 2 , wherein said solidified adhesive is solidified with a solidifying reaction selected from a group consisting of damp, heat, and UV lighting.
5. A camera module, comprising:
at least an optical lens; and
a photosensitive sensor module, comprising:
at least a circuit board;
at least a photosensitive sensor having a photosensitive area and a nor photosensitive area on an upper surface of said photosensitive sensor;
at least an integral encapsulating support structure, integrally covering and enclosing at least a portion of said non-photosensitive area of said photosensitive sensor and at least a portion of an upper surface of said circuit board;
at least a filter element positioned over said photosensitive area of said photosensitive sensor; and
at least an insulating member which is a solidified adhesive formed by solidified material having a stickiness after solidification, wherein said insulating member is provided on said upper surface of said photosensitive sensor insulating said photosensitive area from said non-photosensitive area of said photosensitive sensor, and wherein said integral encapsulating support structure, said upper surface of said photosensitive sensor, and a lower surface of said filter element form an enclosed cavity, and said insulating, member is located within said enclosed cavity for sticking dust within said enclosed cavity, wherein said optical lens is supported along a photosensitive path of said photosensitive sensor.
6. The camera module, as recited in claim 5 , wherein said solidified adhesive is applied along a periphery around at least said photosensitive sensor to form said insulating member on said periphery of said photosensitive sensor after said solidified adhesive is solidified to insulate said photosensitive area from said non-photosensitive area of said photosensitive sensor.
7. The camera module, as recited in claim 5 , wherein said solidified adhesive is solidified with a solidifying reaction selected from a group consisting of damp, heat, and UV lighting.
8. The camera module, as recited in claim 6 , wherein said solidified adhesive is solidified with a solidifying reaction selected from a group consisting of damp, heat, and UV lighting.