IP Library › Granted Patent US 9,691,753
Granted Patent B2
US 9,691,753 · App. 15/093,725 · Granted Jun 27, 2017

Zener triggered silicon controlled rectifier with small silicon area

Inventors: Lei Zhong (Shanghai, CN); Hongwei Li (Shanghai, CN); Wei Lei (Shanghai, CN); Huijuan Cheng (Shanghai, CN)
Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
H01L27/0262H01L27/0647H01L29/0649H01L29/87
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Quick Facts
Patent No.
US 9,691,753
App. No.
15/093,725
Granted
Jun 27, 2017
Kind
B2
Abstract

A semiconductor device includes a P-type semiconductor substrate, an N-well and a P-well disposed adjacent to each other and extending along a first direction within the P-type semiconductor substrate, a first N+ doped region and a first P+ doped region extending along the first direction within the N-well and spaced away from each other along a second direction perpendicular to the first direction, a second N+ doped region and a second P+ doped region extending along the first direction within the P-well and spaced away from each other along the second direction, and a plurality of third N+ doped regions and a plurality of P+ doped regions alternatively disposed in a junction region formed between the N-well and P-well the third N+ doped regions. The third N+ doped regions and the third P+ doped regions form a Zener diode.

Claims (31)

1. A semiconductor device comprising:

a P-type semiconductor substrate;

an N-well and a P-well disposed adjacent to each other and extending along a first direction within the P-type semiconductor substrate;

a first N+ doped region and a first P+ doped region extending along the first direction within the N-well and spaced away from each other along a second direction perpendicular to the first direction;

a second N+ doped region and a second P+ doped region extending along the first direction within the P-well and spaced away from each other along the second direction; and

a plurality of third N+ doped regions and a plurality of P+ doped regions alternatively disposed in a junction region formed between the N-well and P-well and extending along the first direction, the third N+ doped regions and the third P+ doped regions being separated from the adjacent first P+ doped region and second N+ doped region,

wherein the third N+ doped regions and the third P+ doped regions form a Zener diode.

2. The semiconductor device of claim 1 , wherein the first N+ doped region and the first P+ doped region are connected to each other to form an anode of a silicon controlled rectifier (SCR) device.

3. The semiconductor device of claim 1 , wherein the second N+ doped region and the second P+ doped region are connected to each other to form a cathode of a silicon controlled rectifier (SCR) device.

4. The semiconductor device of claim 1 , wherein the semiconductor device comprises an NPN transistor and a PNP transistor, and the Zener diode being disposed between a base of the NPN transistor and a base of the PNP transistor.

5. The semiconductor device of claim 1 , further comprising a first insulation structure disposed between the first N+ doped region and the first P+ doped region, and a second insulation structure disposed between the second N+ doped region and the second P+ doped region.

6. The semiconductor device of claim 5 , wherein the first and second insulator structures are shallow trench insulator structures.

7. An electronic device comprising a semiconductor device and an electronic component connected to the semiconductor device, wherein the semiconductor device comprises:

a P-type semiconductor substrate;

an N-well and a P-well disposed adjacent to each other and extending along a first direction within the P-type semiconductor substrate;

a first N+ doped region and a first P+ doped region extending along the first direction within the N-well and spaced away from each other along a second direction perpendicular to the first direction;

a second N+ doped region and a second P+ doped region extending along the first direction within the P-well and spaced away from each other along the second direction; and

a plurality of third N+ doped regions and a plurality of P+ doped regions alternatively disposed in a junction region formed between the N-well and P-well and extending along the first direction, the third N+ doped regions and the third P+ doped regions being separated from the adjacent first P+ doped region and second N+ doped region,

wherein the third N+ doped regions and the third P+ doped regions form a Zener diode.

8. A Zener-triggered silicon controlled rectifier (SCR) device including a first node and a second node, the Zener-triggered SCR device comprising:

a P-type semiconductor substrate;

an N-well and a P-well disposed adjacent to each other and extending along a first direction within the P-type semiconductor substrate;

a first N+ doped region and a first P+ doped region extending along the first direction within the N-well and separated from each other by a first shallow trench insulation structure;

a second N+ doped region and a second P+ doped region extending along the first direction within the P-well and separated from each other by a second shallow trench insulation structure;

a plurality of third N+ doped regions and a plurality of P+ doped regions alternatively disposed in a junction region formed between the N-well and the P-well to form a Zener diode;

a PNP transistor having a base and its emitter connected to the first node; and

an NPN transistor having an emitter connected to the second node.

9. The Zener-triggered SCR device of claim 8 , further comprising:

a first resistor connected between the base of the PNP transistor and the first node; and

a second resistor connected between a base of the NPN transistor and the second node.

10. The Zener-triggered SCR device of claim 9 , wherein the Zener diode is connected between the base of the PNP transistor and the base of the NPN transistor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 11, 2016
From: ZHONG, LEI; LI, HONG WEI; LEI, WEI; CHENG, HUIJUAN
To: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
Reel/Frame 038238/0487 →
Priority Claims (1)
CN 2015 1 0255838 · May 19, 2015 · national
Continuity (1)
Related Publication 20160343701A1 · Nov 24, 2016