IP Library Granted Patent US 10,203,278
Granted Patent B2
US 10,203,278 · App. 15/100,441 · Granted Feb 12, 2019

Far-infrared imaging device and far-infrared imaging method

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Quick Facts
Patent No.
US 10,203,278
App. No.
15/100,441
Granted
Feb 12, 2019
Kind
B2
Abstract

Provided are an imaging method and device for imaging using far infrared light that make it possible to quickly image a subject without producing damage or a non-linear phenomenon in the subject. A variable-frequency coherent light source is used, illumination light from the light source is irradiated onto a linear area on an imaging subject, transmitted or reflected light is used to form an image of the imaging subject, a non-linear optical crystal is used for wavelength conversion, and a one-dimensional or two-dimensional array sensor is used to image the imaging subject while the imaging subject is moved in at least one direction.

Claims (25)

1. A far-infrared imaging apparatus, comprising:

a wavelength-tunable far-infrared light source;

an illumination optical system for irradiating a specimen with far-infrared light;

a far-infrared light imaging optical system for forming an image of the specimen;

a non-linear optical crystal for detection being arranged in the vicinity of an image plane of the far-infrared light imaging optical system;

an array sensor;

a detection optical system for introducing light emitted from the non-linear optical crystal for detection onto the array sensor; and

a stage for placing the specimen, the stage being movable in at least one direction, wherein

the wavelength-tunable far-infrared light source comprises: two near infrared light sources each having wavelengths different from each other; and a non-linear crystal onto which light oscillating from the near infrared light source is incident, the wavelength-tunable far-infrared light source being a light source that generates far-infrared light from a linear area by parametric generation, and

the illumination optical system is an afocal optical system, that includes at least two optical elements, in which a rear focal plane of one of the optical elements matches with a front focal plane of another one of the optical elements, and that images far-infrared light emitting from the linear area of the wavelength-tunable far-infrared light source.

2. The far-infrared imaging apparatus according to claim 1 , wherein

one of the near infrared light sources irradiates a beam that passes through the non-linear crystal approximately in parallel to a side surface of the non-linear crystal, and

the non-linear crystal includes a Si prism that extracts far-infrared light from the side surface.

3. The far-infrared imaging apparatus according to claim 1 , wherein

the far-infrared imaging optical system includes at least two lenses, and

a side of the specimen of the far-infrared imaging optical system is a one-side object telecentric imaging optical system, or the far-infrared imaging optical system is a double telecentric imaging optical system.

4. The far-infrared imaging apparatus according to claim 3 , wherein

in a first cross section along the region on the line, the detection optical system images a portion around an emission surface of the non-linear optical crystal for detection on the array sensor.

5. The far-infrared imaging apparatus according to claim 4 , wherein

the detection optical system includes at least two lenses, and

at least the detection non-linear optical crystal side of the detection optical system is telecentric in the first cross section.

6. The far-infrared imaging apparatus according to claim 3 , wherein

in a second cross section orthogonal to the region on the line, the detection optical system concentrates light emitted from the non-linear optic for detection on the array sensor.

7. The far-infrared imaging apparatus according to claim 6 , wherein

in the second cross section, the detection optical system images the portion around the emission surface of the non-linear optical crystal for detection on the array sensor.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 31, 2016
From: SHIMURA, KEI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 038848/0539 →