IP Library Granted Patent US 10,153,158
Granted Patent B2
US 10,153,158 · App. 15/102,553 · Granted Dec 11, 2018

Semiconductor nanowire fabrication

Inventors: Mattias Bengt Borg (Adliswil, CH); Kirsten Emilie Moselund (Rueschlikon, CH); Heike E. Riel (Baech, CH); Heinz Schmid (Waedenswil, CH)
Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
H01L21/02603H01L21/0262H01L21/02422H01L21/02546H01L21/02639H01L21/02645H01L21/76262H01L21/02647
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Quick Facts
Patent No.
US 10,153,158
App. No.
15/102,553
Granted
Dec 11, 2018
Kind
B2
Abstract

Methods are provided for fabricating semiconductor nanowires on a substrate. A nanowire template is formed on the substrate. The nanowire template defines an elongate tunnel which extends, laterally over the substrate, between an opening in the template and a seed surface. The seed surface is exposed to the tunnel and of an area up to about 2×10 4 nm 2 . The semiconductor nanowire is selectively grown, via said opening, in the template from the seed surface. The area of the seed surface is preferably such that growth of the nanowire proceeds from a single nucleation point on the seed surface. There is also provided a method for fabricating a plurality of semiconductor nanowires on a substrate and a semiconductor nanowire and substrate structure.

Claims (22)

1. A method for fabricating a semiconductor nanowire on a substrate, the method comprising:

forming a nanowire template defining an elongate tunnel which extends, laterally over the substrate, between an opening in the template and a seed surface, the seed surface being exposed to the tunnel and of having an area up to about 2×10 4 nm 2 such that growth of the nanowire proceeds from a single nucleation point on the seed surface; and

via said opening, selectively epitaxially growing the semiconductor nanowire in the template from the seed surface, wherein selectively epitaxially growing the semiconductor nanowire is by one of: metal-organic vapor phase deposition; migration enhanced epitaxy; and hydride vapor phase epitaxy.

2. The method according to claim 1 , wherein the area of the seed surface is no greater than about 10 4 nm 2 .

3. The method according to claim 1 , wherein the seed surface has a width of up to about 100 nm and a breadth, perpendicular to said width, of up to about 100 nm.

4. The method according to claim 1 , wherein the seed surface occludes one end of the tunnel.

5. The method according to claim 4 , wherein the seed surface is perpendicular to the longitudinal axis of the tunnel.

6. The method according to claim 1 , wherein the seed surface is a monocrystalline semiconductor surface.

7. The method according to claim 1 , wherein the seed surface is a surface of consisting of at least one of: an amorphous semiconductor, a polycrystalline semiconductor, a metal, and a metal-semiconductor alloy.

8. The method according to claim 1 , wherein said elongate tunnel has one or more branches, defined by the template, extending therefrom.

9. The method according to claim 1 , wherein the substrate comprises a seed region, in the shape of the interior of said nanowire template, overlying and in contact with an insulating layer such that the insulating layer is exposed around the seed region, the method further comprising:

forming a masking layer in contact with the seed region and the insulating layer whereby the masking layer and insulating layer provide the nanowire template;

defining an opening in the masking layer to provide said opening in the nanowire template; and

via said opening, removing part of the seed region to form said tunnel whereby a remaining part of the seed region provides said seed surface.

10. The method according to claim 9 , the method further comprising:

patterning a seed layer overlying the insulating layer of the substrate to form said seed region and expose the insulating layer around the seed region.

11. The method according to claim 10 , wherein the substrate comprises a semiconductor-on-insulator wafer having a semiconductor layer providing said seed layer.

12. The method according to claim 1 , wherein the substrate comprises a seed layer, the method further comprising:

patterning the seed layer to form a seed region projecting from the surface of the seed layer; and

forming the nanowire template on the seed layer such that the seed region occludes one end of said tunnel and provides said seed surface.

13. The method according to claim 12 , wherein the seed region comprises at least one of: silicon, germanium and alloys thereof.

14. The method according to claim 1 , wherein the nanowire comprises a compound semiconductor material.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 4, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 052561/0161 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THIRD ASSIGNOR EXECUTION DATE AND ORDER OF LISTED ASSIGNOR'S PREVIOUSLY RECORDED ON REEL 038839 FRAME 0838. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNOR'S Recorded Apr 26, 2017
From: BORG, MATTIAS BENGT; MOSELUND, KIRSTEN EMILIE; RIEL, HEIKE E; SCHMID, HEINZ
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 042334/0944 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2016
From: BORG, MATTIAS BENGT; MOSELUND, KIRSTEN EMILIE; REIL, HEIKE E; SCHMID, HEINZ
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038839/0838 →
Priority Claims (1)
GB 1321949.8 · Dec 12, 2013 · national
Continuity (1)
Related Publication 20160351391A1 · Dec 1, 2016