IP Library › Granted Patent US 9,825,083
Granted Patent B2
US 9,825,083 · App. 15/104,359 · Granted Nov 21, 2017

Optical detector with photodiode array having avalanche photodiodes connected to quenching resistors

Inventors: Terumasa Nagano (Hamamatsu, JP); Kenichi Sato (Hamamatsu, JP); Ryutaro Tsuchiya (Hamamatsu, JP)
Assignee: HAMAMATSU PHOTONICS K.K.
H01L27/14663H01L27/1446H01L27/14603H01L27/14636H01L27/14658H01L27/14676H01L31/1075H01L31/115
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Quick Facts
Patent No.
US 9,825,083
App. No.
15/104,359
Granted
Nov 21, 2017
Kind
B2
Abstract

Disclosed is an optical detector in which a boundary line BY defining an edge of a semiconductor region 14 is covered with signal read wiring E3 and a capacitor is configured between the semiconductor region 14 and the signal read wiring E3. High frequency components peak components of a carrier are quickly extracted to the outside via the capacitor, but the signal read wiring E3 covers the boundary line BY so that a semiconductor potential in the vicinity of the boundary line is stabilized and an output signal is stabilized.

Claims (37)

1. An optical detector comprising:

a semiconductor substrate;

a first semiconductor region formed on the semiconductor substrate;

second semiconductor regions formed two-dimensionally within the first semiconductor region and having a higher impurity concentration than the first semiconductor region;

quenching resistors electrically connected to the second semiconductor regions, each of the quenching resistors being connected to one respective second semiconductor region from among the second semiconductor regions; and

ring-shaped signal read wiring portions electrically connected to the quenching resistors, each of the ring-shaped signal read wiring portions being connected to one respective quenching resistor from among the quenching resistors;

wherein the optical detector comprises a pn junction that forms an avalanche photodiode operable in a Geiger mode formed in an interface between the semiconductor substrate and the first semiconductor region or between the first semiconductor region and the one respective second semiconductor region,

wherein each of the quenching resistors is positioned above the one respective second semiconductor region, and

wherein, in a plan view, each of the ring-shaped signal read wiring portions surrounds circumferences of the one respective second semiconductor region, and covers boundary lines between the one respective second semiconductor region and the first semiconductor region, and

wherein each of the quenching resistors is positioned inside the one respective ring-shaped signal read wiring portion.

2. The optical detector according to claim 1 , wherein, in the plan view, the signal read wiring covers the entire boundary line between the one respective second semiconductor region and the first semiconductor region.

3. The optical detector according to claim 1 ,

wherein, in the plan view, each of the ring-shaped signal read wiring portions comprises:

a first portion covering a part of the boundary line between the one respective second semiconductor region and the first semiconductor region, and

a second portion adjacent to the first portion,

wherein a size of a width direction of the first portion is greater than a size of a width direction of the second portion.

4. An optical detector comprising:

a semiconductor substrate;

a first semiconductor region formed on the semiconductor substrate;

second semiconductor regions formed two-dimensionally within the first semiconductor region and having a higher impurity concentration than the first semiconductor region;

quenching resistors electrically connected to the second semiconductor regions, each of the quenching resistors being connected to one respective second semiconductor region from among the second semiconductor regions; and

ring-shaped signal read wiring portions electrically connected to the quenching resistors, each of the ring-shaped signal read wiring portions being connected to one respective quenching resistor from among the quenching resistors; and

wherein the optical detector comprises a pn junction that forms an avalanche photodiode operable in a Geiger mode formed in an interface between the semiconductor substrate and the first semiconductor region or between the first semiconductor region and the one respective second semiconductor region,

wherein each of the quenching resistors is positioned above the one respective second semiconductor region,

wherein, in a plan view, each of the ring-shaped signal read wiring portions surrounds circumferences of the one respective second semiconductor region,

wherein each of the quenching resistors is positioned inside the one respective ring-shaped signal read wiring portion, and

wherein each quenching resistor linearly extends without being bent.

5. An optical detector comprising:

a semiconductor substrate;

a first semiconductor region formed on the semiconductor substrate;

second semiconductor regions formed two-dimensionally within the first semiconductor region and having a higher impurity concentration than the first semiconductor region;

quenching resistors electrically connected to the second semiconductor regions, each of the quenching resistors being connected to one respective second semiconductor region from among the second semiconductor regions; and

ring-shaped signal read wiring portions electrically connected to the quenching resistors, each of the ring-shaped signal read wiring portions being connected to one respective quenching resistor from among the quenching resistors;

wherein the optical detector comprises a pn junction that forms an avalanche photodiode operable in a Geiger mode formed in an interface between the semiconductor substrate and the first semiconductor region or between the first semiconductor region and the one respective second semiconductor region,

wherein each of the quenching resistors is positioned above the one respective second semiconductor region, and

wherein, in a plan view, each of the ring-shaped signal read wiring portions surrounds circumferences of the one respective second semiconductor region, and

wherein each of the quenching resistors is positioned inside the one respective ring-shaped signal read wiring portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2016
From: NAGANO, TERUMASA; SATO, KENICHI; TSUCHIYA, RYUTARO
To: HAMAMATSU PHOTONICS K.K.
Reel/Frame 039107/0751 →
Priority Claims (1)
JP 2013-262598 · Dec 19, 2013 · national
Continuity (1)
Related Publication 20160322417A1 · Nov 3, 2016