Silicone resin liquid composition
A silicone resin liquid composition containing a silicone resin is provided. The 29 Si-NMR measurement of the resin exhibits a ratio of the area of signals assigned to A3 silicon atoms to the area of all signals derived from silicon atoms of 51% to 69%. An A3 silicon atom represents a silicon atom to which are bonded three oxygen atoms bonded to another silicon atom.
1. A silicone resin liquid composition comprising a silicone resin,
the 29 Si-NMR measurement thereof affords a ratio of the area of signals assigned to A3 silicon atoms as defined below to the area of all signals derived from silicon atoms of 51% to 69%,
where said A3 silicon atom represents a silicon atom to which are bonded three oxygen atoms bonded to another silicon atom,
wherein the silicone resin comprises a resin A as defined below and an oligomer B as defined below,
where said resin A is a resin having a ratio of the content of the A3 silicon atoms to the total content of A1 silicon atoms as defined below, A2 silicon atoms as defined below and the A3 silicon atoms of 20% to 90%, and having a weight-average molecular weight of 1500 to 8000;
said oligomer B is an oligomer having a ratio of the content of the A3 silicon atoms to the total content of A1 silicon atoms as defined below, A2 silicon atoms as defined below and the A3 silicon atoms of 0% to 30%, having a weight-average molecular weight of less than 1500,
where said A1 silicon atom represents a silicon atom to which is bonded one oxygen atom bonded to another silicon atom;
said A2 silicon atom represents a silicon atom to which are bonded two oxygen atoms bonded to another silicon atom, and
wherein a mixing mass ratio of the resin A and the oligomer B is resin A : oligomer B=100:0.1 to 20.
2. The silicone resin liquid composition according to claim 1 , wherein the resin A is a resin having an organopolysiloxane structure represented by the formula (1):
in the formula (1), R 1 each independently represents an alkyl group or an aryl group; R 2 each independently represents an alkoxy group, an alkenyl group, a hydrogen atom or a hydroxyl group; and p 1 , q 1 , a 1 and b 1 represent arbitrary positive numbers satisfying [p 1 +b 1 ×q 1 ]:[a 1 ×q 1 ]=1:0.25 to 9.
3. The silicone resin liquid composition according to claim 1 , wherein the oligomer B is an oligomer having an organopolysiloxane structure represented by the formula (2):
in the formula (2), R 1 and R 2 represent the same meaning as in the formula (1); and p 2 , q 2 , r 2 , a 2 and b 2 represent arbitrary positive numbers larger than 0 satisfying [a 2 ×q 2 ]/[(p 2 +b 2 ×q 2 )+a 2 ×q 2 +(r 2 +q 2 )]=0 to 0.3.
4. The silicone resin liquid composition according to claim 1 , further comprising inorganic particles.
5. The silicone resin liquid composition according to claim 4 , wherein the inorganic particles are composed of one or more species selected from the group consisting of a silicon oxide, a titanium oxide and an aluminum oxide.
6. The silicone resin liquid composition according to claim 1 , further comprising a fluorescent substance.
7. The silicone resin liquid composition according to claim 1 , further comprising a silane coupling agent.
8. The silicone resin liquid composition according to claim 1 , wherein the specific gravity of a cured product produced by raising the temperature of the silicon resin liquid composition from room temperature to 150° C. at a temperature ramp-up rate of 5° C./min and then curing the silicon resin liquid composition by heating it at 150° C. for three hours is within a range of 1.20 g/cm 3 to 1.35 g/cm 3 .
9. A cured product produced by heating the silicone resin liquid composition according to claim 1 to a temperature of 40° C. to 250° C.
10. The cured product according to claim 9 , wherein the specific gravity thereof is within a range of 1.20 g/cm 3 to 1.35 g/cm 3 .
11. An encapsulating material for a semiconductor light-emitting element, comprising the cured product according to claim 9 .
12. A semiconductor light-emitting device comprising the cured product according to claim 9 .
13. A method for producing a semiconductor light-emitting device, comprising a step of heating the silicone resin liquid composition according to claim 1 to a temperature of 40° C. to 250° C., thereby curing the composition.
14. The silicone resin liquid composition according to claim 2 , wherein R 2 in the formula (1) is an alkoxy group or a hydroxyl group.
15. The silicone resin liquid composition according to claim 3 , wherein R 2 in the formula (2) is an alkoxy group or a hydroxyl group.
16. The silicone resin liquid composition according to claim 2 , wherein the oligomer B is an oligomer having an organopolysiloxane structure represented by the formula (2):
in the formula (2), R 1 and R 2 represent the same meaning as in the formula (1); and p 2 , q 2 , r 2 , a 2 and b 2 represent arbitrary positive numbers larger than 0 satisfying [a 2 ×q 2 ]/[(p 2 +b 2 ×q 2 )+a 2 ×q 2 +(r 2 +q 2 )]=0 to 0.3.
17. The silicon resin liquid composition according to claim 16 , wherein each R 2 in the formulae (1) and (2) is an alkoxy group or a hydroxyl group.