IP Library Granted Patent US 11,143,042
Granted Patent B2
US 11,143,042 · App. 15/117,626 · Granted Oct 12, 2021

System and method for applying a metallic coating

Inventors: Giovanni Whitman (Berlin, CT); Henry H. Thayer (Wethersfield, CT); Gary J. Larson (Madison, CT); Wangen Lin (South Glastonbury, CT); Donn Blankenship (Southbury, CT)
Assignee: RAYTHEON TECHNOLOGIES CORPORATION
F01D9/041C23C4/02C23C4/08C23C4/134C23C14/221F01D5/288F05D2220/32F05D2230/312F05D2230/313F05D2300/10Y02T50/60
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Quick Facts
Patent No.
US 11,143,042
App. No.
15/117,626
Granted
Oct 12, 2021
Kind
B2
Abstract

The present disclosure relates generally to a system and method for applying a metallic coating. A first metallic coating may be applied to a portion of a total surface of a part and a second metallic coating may be applied to substantially the total surface. The metallic coating may be applied to a vane cluster for use in a turbomachine.

Claims (30)

1. A method for application of a metallic coating to a vane cluster including at least two cluster vanes, the method comprising:

applying a first layer of metallic coating within a portion of a total surface of the at least two cluster vanes; and

applying a second layer of metallic coating to substantially the total surface of the at least two cluster vanes.

2. The method of claim 1 , wherein the first and second layers of metallic coating comprise a metallic bond coat.

3. The method of claim 1 , wherein the portion comprises a non-line of sight area of the total surface.

4. The method of claim 1 , wherein the applying a first layer step comprises applying the first layer of metallic coating within the portion of the total surface of the at least two cluster vanes using a contact metal deposition process.

5. The method of claim 4 , wherein the contact metal deposition process comprises an electro-spark deposition process.

6. The method of claim 5 , wherein the electro-spark deposition process utilizes an electrode and comprises:

applying a first voltage to the electrode;

applying a second voltage to at least one of the at least two cluster vanes, wherein the first voltage is greater than the second voltage; and

touching the electrode to the portion of the total surface of the at least two cluster vanes.

7. The method of claim 6 , wherein the second voltage comprises ground.

8. The method of claim 6 , further comprising rotating the electrode while touching the electrode to the portion of the total surface of the at least two cluster vanes.

9. The method of claim 6 , further comprising supplying a shielding gas to an area where the electrode touches portion of the total surface of the at least two cluster vanes.

10. The method of claim 6 , wherein the step of touching the electrode to the portion of the total surface of the at least two cluster vanes is performed until a predetermined thickness of the first layer of metallic coating is deposited.

11. A vane cluster including at least two cluster vanes and comprising a metallic coating formed according to the method of claim 5 .

12. The method of claim 1 , wherein the step of applying the second layer of metallic coating is performed using a process selected from the group consisting of: low pressure plasma spray, electron beam physical vapor deposition, air spray, and electron beam directed vapor deposition.

13. A vane cluster including at least two cluster vanes and comprising a metallic coating formed according to the method of claim 12 .

14. The method of claim 1 , wherein the first layer is disposed beneath the second layer.

15. A vane cluster including at least two cluster vanes and comprising a metallic coating formed according to the method of claim 14 .

16. A vane cluster including at least two cluster vanes and comprising a metallic coating formed according to the method of claim 1 .

17. A vane cluster comprising:

a cluster platform;

a cluster shroud;

at least two cluster vanes extending between the cluster platform and the cluster shroud and defining a total surface;

a first layer of metallic coating disposed within a portion of the total surface of the at least two cluster vanes; and

a second layer of metallic coating disposed on substantially the total surface of the at least two cluster vanes.

18. The vane cluster of claim 17 , wherein the metallic coating comprises a metallic bond coat.

19. The vane cluster of claim 17 , wherein the first layer of metallic coating is applied within the portion of the total surface of the at least two cluster vanes using an electro-spark deposition process.

20. The vane cluster of claim 17 , wherein the first layer is disposed beneath the second layer.

Assignments (5)
CHANGE OF NAME Recorded Jul 27, 2023
From: RAYTHEON TECHNOLOGIES CORPORATION
To: RTX CORPORATION
Reel/Frame 064714/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE AND REMOVE PATENT APPLICATION NUMBER 11886281 AND ADD PATENT APPLICATION NUMBER 14846874. TO CORRECT THE RECEIVING PARTY ADDRESS PREVIOUSLY RECORDED AT REEL: 054062 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF ADDRESS. Recorded Mar 4, 2021
From: UNITED TECHNOLOGIES CORPORATION
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 055659/0001 →
CHANGE OF NAME Recorded Sep 4, 2020
From: UNITED TECHNOLOGIES CORPORATION
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 054062/0001 →
CHANGE OF NAME Recorded Apr 22, 2020
From: UNITED TECHNOLOGIES CORPORATION
To: RAYTHEON TECHNOLOGIES CORPORATION
Reel/Frame 052469/0921 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 28, 2017
From: WHITMAN, GIOVANNI; THAYER, HENRY H.; LARSON, GARY J.; LIN, WANGEN; BLANKENSHIP, DONN R.
To: UNITED TECHNOLOGIES CORPORATION
Reel/Frame 043976/0584 →
Continuity (2)
Provisional Application 61938418 · Feb 11, 2014
Related Publication 20160348519A1 · Dec 1, 2016