IP Library Granted Patent US 10,180,317
Granted Patent B2
US 10,180,317 · App. 15/117,964 · Granted Jan 15, 2019

Pattern-measuring device and computer program

Inventors: Yasutaka Toyoda (Tokyo, JP); Hiroyuki Sindo (Tokyo, JP)
Assignee: Hitachi High-Technologies Corporation
G01B15/00G01N23/203G01N23/2251G01B2210/56G01N2223/6116H01L22/12
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Quick Facts
Patent No.
US 10,180,317
App. No.
15/117,964
Granted
Jan 15, 2019
Kind
B2
Abstract

In order to provide a pattern-measuring device and a computer program that quantitatively evaluate the effects brought about by the presence of pattern deformations in a circuit, this invention proposes a pattern-measuring device that measures first distances between first edges in pattern data being measured and second edges that correspond to said first edges in a benchmark pattern that corresponds to the pattern being measured. Said pattern-measuring device computes a score for the first edges or the pattern being measured on the basis of the first distances and second distances between the first edges and/or the second edges and third edges that are adjacent to but different from the first and second edges.

Claims (39)

1. A pattern-measuring device, comprising:

an arithmetic device configured to

transmit a control signal to a charged particle beam device to obtain an image of a circuit pattern from the charged particle beam device,

measure a dimension of a first distance between a first edge of pattern data of the image of the circuit pattern obtained by the charged particle beam device and a second edge corresponding to the first edge of a benchmark pattern corresponding to the circuit pattern being measured,

calculate a score of the first edge of the circuit pattern being measured based on a dimension of a second distance between a third edge, which is adjacent to the first edge and the second edge and is different from the first edge and the second edge, and at least one of the first edge and the second edge and the dimension of the first distance,

determine whether a defect is present in the first edge of the circuit pattern based on a comparison between the score and a predetermined threshold value, and

display the score or a value expressing numerically an index about a degree of the defect based on the score.

2. The pattern-measuring device according to claim 1 ,

wherein the arithmetic device calculates the score by using an arithmetic expression described below:

Score=Coefficient×Dimension of First Distance/Dimension of Second Distance.

3. The pattern-measuring device according to claim 2 ,

wherein the arithmetic device calculates the score by using at least one of arithmetic expressions described below:

Score 1= W*E/P

Score 2= W*E/S

E: Dimension of First Distance

W: Coefficient

P: Dimension of Second Distance (Width of Benchmark Pattern)

S: Dimension of Second Distance (Distance between Benchmark Patterns).

4. The pattern-measuring device according to claim 1 ,

wherein the arithmetic device calculates the score by using an arithmetic expression described below:

Score=Coefficient×Dimension of First Distance/(Distance between Edges of Benchmark Patterns−Distance between Edges of Patterns being Measured).

5. The pattern-measuring device according to claim 4 ,

wherein the arithmetic device calculates the score by using at least one of arithmetic expressions described below:

Score 1= W*E/ ( P−D in)

Score 2= W*E/ ( S−D out)

E: Dimension of First Distance

W: Coefficient

P: Dimension of Second Distance (Width of Benchmark Pattern)

S: Dimension of Second Distance (Distance between Benchmark Patterns)

Din: Width of Pattern Being Measured

Dout: Distance between Patterns being Measured.

6. The pattern-measuring device according to claim 1 ,

wherein the arithmetic device obtains a plurality of the scores, and calculates a statistic value of the plurality of scores.

7. A non-transitory computer-readable medium storing a program which, when executed on a computer, causes the computer to:

transmit a control signal to a charged particle beam device to obtain an image of a circuit pattern from the charged particle beam device,

measure a dimension of a first distance between a first edge of pattern data of the image of the circuit pattern obtained by the charged particle beam device and a second edge corresponding to the first edge of a benchmark pattern corresponding to the circuit pattern being measured,

calculate a score of the first edge of the circuit pattern being measured based on a dimension of a second distance between a third edge, which is adjacent to the first edge and the second edge and is different from the first edge and the second edge, and at least one of the first edge and the second edge, and the dimension of the first distance,

determine whether a defect is present in the first edge of the circuit pattern based on a comparison between the score and a predetermined threshold value, and

display the score or a value expressing numerically an index about a degree of the defect based on the score.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2016
From: TOYODA, YASUTAKA; SINDO, HIROYUKI
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 039400/0308 →
Priority Claims (1)
JP 2014-031203 · Feb 21, 2014 · national
Continuity (1)
Related Publication 20160356598A1 · Dec 8, 2016