IP Library Granted Patent US 10,205,060
Granted Patent B2
US 10,205,060 · App. 15/118,235 · Granted Feb 12, 2019

Semiconductor light emitting device

Inventor: Soo Kun Jeon (Gyeonggi-do, KR)
Assignee: SEMICON LIGHT CO., LTD.
H01L33/405H01L33/38H01L33/46H01L33/14H01L33/32H01L2933/0016H01L2933/0025
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Quick Facts
Patent No.
US 10,205,060
App. No.
15/118,235
Granted
Feb 12, 2019
Kind
B2
Abstract

Disclosed is a semiconductor light emitting device, including: a plurality of semiconductor layers; a non-conductive reflective film coupled to the plurality of the semiconductor layers; and one or more electrodes formed on the non-conductive reflective film and electrically connected to the plurality of semiconductor layers, in which the one or more electrodes respectively include a lower electrode layer for reflecting light generated in the active layer and then passed the non-conductive reflective film, and an upper electrode layer arranged on the lower electrode layer for preventing a foreign material from penetrating into the lower electrode layer.

Claims (24)

1. A semiconductor light emitting device, including:

a plurality of semiconductor layers grown on a growth substrate, the plurality of semiconductor layers including a first semiconductor layer having a first conductivity type, a second semiconductor layer having a second conductivity type different from the first conductivity type, and an active layer interpositioned between the first and second semiconductor layers, for generating light by electron-hole recombination;

a non-conductive reflective film arranged on an opposite side of the growth substrate and coupled to the plurality of the semiconductor layers;

one or more electrodes formed on the non-conductive reflective film and electrically connected to the plurality of semiconductor layers, each of the one or more electrodes respectively including a lower electrode layer as part of the one or more electrodes for reflecting light generated in the active layer and then passing through the non-conductive reflective film and for defining a crack resistant layer, and an upper electrode layer arranged on the lower electrode layer for preventing a foreign material from penetrating into the lower electrode layer and having a thickness and a thermal expansion coefficient to define an anti-burst layer to prevent bursting of the lower electrode layer, the lower electrode layer having a higher reflectance and a higher thermal expansion coefficient than the upper electrode layer, and the one or more electrodes covering a portion of an area of the non-conductive reflective film;

an electrical connecting part for electrically connecting the plurality of semiconductor layers to one of the one or more electrodes, the electrical connecting part passing through the non-conductive reflective film and filled with the one of the one or more electrodes; and

an additional electrode disposed under the electrical connecting part and between the plurality of the semiconductor layers and the non-conductive reflective film;

wherein the one of the one or more electrodes is formed on the non-conductive film and within the electrical connecting part in such a manner that at least a portion of the lower electrode layer of the one of the one or more electrodes is formed on the non-conductive reflective film and within the electrical connecting part to reflect the light generated in the active layer; and

wherein the lower electrode layer has a thickness of at least 1000 Å.

2. The semiconductor light emitting device according to claim 1 , wherein the one or more electrodes respectively have a structure of alternating layers of a lower electrode layer and an upper electrode layer.

3. The semiconductor light emitting device according to claim 1 , wherein the one or more electrodes cover at least 50% of the area of the non-conductive reflective film.

4. The semiconductor light emitting device according to claim 1 , wherein the one or more electrodes have a thickness of at least 2 μm.

5. The semiconductor light emitting device according to claim 1 , wherein the lower electrode layer has a thickness of at least 5000 Å.

6. The semiconductor light emitting device according to claim 1 , wherein the one or more electrodes respectively have at least one lower electrode layer and at least one upper electrode layer, in which a combined thickness of the at least one lower electrode layer and the at least one upper electrode layer is 1 μm or greater.

7. The semiconductor light emitting device according to claim 1 , wherein the one or more electrodes respectively have at least one lower electrode layer and at least one upper electrode layer, in which a combined thickness of the at least one lower electrode layer and the at least one upper electrode layer is 2 μm or greater.

8. The semiconductor light emitting device according to claim 1 , wherein the one or more electrodes respectively have a top layer lower than 5000 Å in thickness.

9. The semiconductor light emitting device according to claim 8 , wherein the top layer includes at least one selected from Au and Pt.

10. The semiconductor light emitting device according to claim 1 , wherein the lower electrode layer includes at least one selected from Al and Ag.

11. The semiconductor light emitting device according to claim 1 , wherein the upper electrode layer includes at least one selected from Ti and Ni.

12. The semiconductor light emitting device according to claim 1 , wherein the non-conductive reflective film includes a Distributed Bragg Reflector.

13. The semiconductor light emitting device according to claim 1 , wherein the one or more electrodes have a thickness of at least 2 μm, and the one or more electrodes have a top layer of 5000 Å or less in thickness.

14. The semiconductor light emitting device according to claim 1 , wherein the lower electrode layer includes Al,

wherein the plurality of semiconductor layers is composed of a Group III nitride semiconductor, and

wherein the non-conductive reflective film includes a Distributed Bragg Reflector.

15. The semiconductor light emitting device according to claim 1 , wherein the lower electrode layer is the bottom layer of the electrode.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 7, 2023
From: SEMICON LIGHT CO., LTD.
To: LUMENS CO., LTD.
Reel/Frame 065788/0381 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 11, 2016
From: JEON, SOO KUN
To: SEMICON LIGHT CO., LTD.
Reel/Frame 039412/0359 →
Priority Claims (3)
KR 10-2014-0015456 · Feb 11, 2014 · national
KR 10-2014-0015459 · Feb 11, 2014 · national
KR 10-2014-0049304 · Apr 24, 2014 · national
Continuity (1)
Related Publication 20170170364A1 · Jun 15, 2017