Urethane oligomer and active energy ray curable resin composition containing same
[Problem] An problem of the present invention is to provide to a (meth)acrylamide-based urethane oligomer which has excellent compatibility with organic solvents, general purpose acrylic monomers and oligomers, and a high curing speed to active energy rays, and to provide an active energy ray curable resin composition which contains the urethane oligomer, has excellent adhesion, moisture resistance and surface curability, and has low curing shrinkage, and a formed product thereof [Means for Solution] By using a (meth)acrylamide-based urethane oligomer of the present invention which has a carbonate skeleton, a diene-based skeleton or a hydrogenated diene-based skeleton in the molecule, one or more (meth)acrylamide groups and a component having a molecular weight of less than 1,000 (excluding a (meth)acrylamide compound (A) having a hydroxyl group) at a content of 5% by weight or less, it is possible to obtain a urethane oligomer which has excellent compatibility with organic solvents, general purpose acrylic monomers and oligomers, and a high curability and to obtain an active energy ray curable resin composition which contains the urethane oligomer and has excellent adhesion, tack resistance, moisture resistance and shrinkage resistance.
1. A (meth)acrylamide-based urethane oligomer, which has:
one type or two or more types of skeletons selected from the group consisting of a carbonate skeleton, a diene-based skeleton and a hydrogenated diene-based skeleton in the molecule; a glass transition temperature (Tg) of −50° C. to 80° C.; and one or more (meth)acrylamide groups on the terminal, the oligomer containing 5% by weight or less of components, excluding a (meth)acrylamide compound (A) having a hydroxyl group,
having a molecular weight of less than 1,000.
2. The (meth)acrylamide-based urethane oligomer according to claim 1 ,
wherein the component having a molecular weight of less than 1,000, excluding a (meth)acrylamide compound (A) having a hydroxyl group, is a urethane adduct compound obtainable by an addition reaction between an isocyanate monomer (B) having two or more isocyanate groups in one molecule and the (meth)acrylamide compound (A) having a hydroxyl group.
3. The (meth)acrylamide-based urethane oligomer according to claim 1 ,
wherein the diene-based skeleton or the hydrogenated diene-based skeleton is one or more types of skeletons selected from the group consisting of polybutadiene, hydrogenated products of polybutadiene, polyisoprene and hydrogenated products of polyisoprene.
4. The (meth)acrylamide-based urethane oligomer according to claim 1 , which is obtainable by an addition reaction between a compound (A) represented by Formula [1] (R 1 represents a hydrogen atom or a methyl group, R 2 and R 3 are the same as or different from each other and each represent a hydrogen atom or an alkyl group having 1 to 3 carbon atoms which may be substituted with a hydroxyl group, provided that a case where R 2 and R 3 are hydrogen atoms at the same time and a case where R 2 and R 3 are alkyl groups at the same time are excluded) and a compound (C) having one or more isocyanate groups and one or two or more types of skeletons selected from a group consisting of a polycarbonate skeleton, a polybutadiene skeleton, a hydrogenated polybutadiene skeleton, a polyisoprene skeleton and a hydrogenated polyisoprene skeleton in one molecule:
5. The (meth)acrylamide-based urethane oligomer according to claim 1 ,
wherein the compound (A) is an N-hydroxyalkylene (meth)acrylamide, an N,N-dihydroxyalkylene (meth)acrylamide or an N-alkyl-N-hydroxyalkylene (meth)acrylamide.
6. An active energy ray curable resin composition, comprising:
the (meth)acrylamide-based urethane oligomer according to claim 1 .
7. An active energy ray curable pressure sensitive adhesive composition for optical materials, comprising:
1% by weight or greater of the (meth)acrylamide-based urethane oligomer according to claim 1 .
8. An active energy ray curable adhesive composition, comprising:
1% by weight or greater of the (meth)acrylamide-based urethane oligomer according to claim 1 .
9. An active energy ray curable adhesive composition for optical members, comprising:
1% by weight or greater of the (meth)acrylamide-based urethane oligomer according to claim 1 .
10. An active energy ray curable adhesive composition for polarizing plates, comprising:
1% by weight or greater of the (meth)acrylamide-based urethane oligomer according to claim 1 .
11. An active energy ray curable sealant composition for electronic parts, comprising:
1% by weight or greater of the (meth)acrylamide-based urethane oligomer according to claim 1 .
12. An active energy ray curable coating agent composition, comprising:
1% by weight or greater of the (meth)acrylamide-based urethane oligomer according to claim 1 .
13. An active energy ray curable ink jet ink composition, comprising:
1% by weight or greater of the (meth)acrylamide-based urethane oligomer according to claim 1 .
14. An active energy ray curable resin composition for three-dimensional modeling, comprising:
1% by weight or greater of the (meth)acrylamide-based urethane oligomer according to claim 1 .