Seam healing of metal interconnects
Embodiments of the present disclosure describe removing seams and voids in metal interconnects and associated techniques and configurations. In one embodiment, a method includes conformally depositing a metal into a recess disposed in a dielectric material to form an interconnect, wherein conformally depositing the metal creates a seam or void in the deposited metal within or directly adjacent to the recess and heating the metal in the presence of a reactive gas to remove the seam or void, wherein the metal has a melting point that is greater than a melting point of copper. Other embodiments may be described and/or claimed.
1. A method comprising:
conformally depositing a metal into a recess disposed in a dielectric material to form an interconnect, wherein conformally depositing the metal creates a seam or void in the deposited metal within or directly adjacent to the recess; and
heating the metal in the presence of a reactive gas to remove the seam or void, wherein the metal has a melting point that is greater than a melting point of copper.
2. The method of claim 1 , wherein conformally depositing the metal comprises depositing a metal selected from the group consisting of ruthenium (Ru), molybdenum (Mo), tungsten (W), cobalt (Co), rhenium (Re), iron (Fe), osmium (Os), rhodium (Rh), iridium (Ir), nickel (Ni), palladium (Pd), platinum (Pt), titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr) and technetium (Tc).
3. The method of claim 1 , wherein conformally depositing the metal is carried out by physical vapor deposition (PVD), chemical vapor deposition (CVD) or atomic layer deposition (ALD).
4. The method of claim 1 , wherein:
heating the metal comprises an anneal process; and
the reactive gas comprises hydrogen.
5. The method of claim 1 , wherein heating the metal comprises exposing the metal to a temperature between 300° C. and 800° C.
6. The method of claim 5 , wherein heating the metal is performed at atmospheric pressure or higher.
7. The method of claim 1 , further comprising:
forming the recess in the dielectric material.
8. The method of claim 1 , wherein conformally depositing the metal is part of a dual-damascene process.
9. A product formed according to the method of claim 1 .
10. An apparatus, comprising:
a semiconductor substrate;
a dielectric material disposed on the semiconductor substrate; and
an interconnect formed in a recess of the dielectric material by conformal deposition of a metal such that a seam or void within the metal is removed by heating of the metal in the presence of a reactive hydrogen gas subsequent to the conformal deposition of the metal, wherein the metal has a melting point that is greater than a melting point of copper, and wherein the metal includes a concentration of hydrogen atoms from the reactive hydrogen gas.
11. The apparatus of claim 10 , wherein the metal is selected from the group consisting of ruthenium (Ru), molybdenum (Mo), tungsten (W) and cobalt (Co).
12. The apparatus of claim 10 , wherein the interconnect is a dual-damascene structure.
13. A computing device comprising:
a circuit board; and
a die coupled with the circuit board, the die including:
a semiconductor substrate,
a dielectric material disposed on the semiconductor substrate, and
an interconnect formed in a recess of the dielectric material by conformal deposition of a metal such that a seam or void within the metal is removed by heating of the metal in the presence of a reactive hydrogen gas subsequent to the conformal deposition of the metal, wherein the metal has a melting point that is greater than a melting point of copper, and wherein the metal includes a concentration of hydrogen atoms from the reactive hydrogen gas.
14. The computing device of claim 13 , wherein the metal is selected from the group consisting of ruthenium (Ru), molybdenum (Mo), tungsten (W) and cobalt (Co).
15. The computing device of claim 13 , wherein the interconnect is a dual-damascene structure.
16. The computing device of claim 13 , wherein:
the die is a processor; and
the computing device is a mobile computing device including one or more of an antenna, a display, a touchscreen display, a touchscreen controller, a battery, an audio codec, a video codec, a power amplifier, a global positioning system (GPS) device, a compass, a Geiger counter, an accelerometer, a gyroscope, a speaker, and a camera.