IP Library Granted Patent US 9,552,988
Granted Patent B2
US 9,552,988 · App. 15/131,341 · Granted Jan 24, 2017

Tone inverted directed self-assembly (DSA) fin patterning

Inventors: Hong He (Schenectady, NY); Chi-Chun Liu (Altamont, NY); Alexander Reznicek (Troy, NY); Chiahsun Tseng (Wynantskill, NY); Tenko Yamashita (Schenectady, NY)
Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
H01L21/0337H01L21/0271H01L21/0332H01L29/0657
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Quick Facts
Patent No.
US 9,552,988
App. No.
15/131,341
Granted
Jan 24, 2017
Kind
B2
Abstract

A method for DSA fin patterning includes forming a BCP layer over a lithographic stack, the BCP layer having first and second blocks, the lithographic stack disposed over a hard mask and substrate, and the hard mask including first and second dielectric layers; removing the first block to define a fin pattern in the BCP layer with the second block; etching the fin pattern into the first dielectric layer; filling the fin pattern with a tone inversion material; etching back the tone inversion material that overfills the fin pattern; removing the first dielectric layer selectively to define an inverted fin pattern from the tone inversion material; etching the inverted fin pattern into the second dielectric layer of the hard mask; removing the tone inversion material; and transferring the inverted fin pattern of the second dielectric layer into the substrate to define fins.

Claims (10)

1. A method for directed self-assembly (DSA) fin patterning, the method comprising:

forming a di-block copolymer layer over a neutral layer comprising a random copolymer of styrene and methyl methacrylate, the di-block copolymer layer having a first block of poly methyl methacrylate and a second block of polystyrene, the neutral layer disposed over a lithographic stack, the lithographic stack disposed over a hard mask and a substrate, and the hard mask comprising a first dielectric layer and a second dielectric layer;

removing the first block from the di-block copolymer and a corresponding portion of the neutral layer beneath the first block to define a fin pattern in the di-block copolymer layer with the second block;

etching the fin pattern into the first dielectric layer of the hard mask;

filling the fin pattern within the first dielectric layer of the hard mask with a tone inversion material, the tone-inversion material being a silicon-containing polymer or a metal oxide;

etching back the tone inversion material that overfills the fin pattern and remains on top of the first dielectric layer;

removing the first dielectric layer selectively to define an inverted fin pattern from the tone inversion material;

etching the inverted fin pattern into the second dielectric layer of the hard mask;

removing the tone inversion material; and

transferring the inverted fin pattern of the second dielectric layer into the substrate to define fins.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 052620/0961 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 18, 2016
From: HE, HONG; LIU, CHI-CHUN; REZNICEK, ALEXANDER; TSENG, CHIAHSUN; YAMASHITA, TENKO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038306/0388 →
Continuity (2)
Continuation 14747487 · Jun 23, 2015
Related Publication 20160379823A1 · Dec 29, 2016