Thin film transistor substrate and method for manufacturing the same
A thin film transistor substrate includes a substrate; a first thin film transistor on the substrate and including a polycrystalline semiconductor layer, a first gate electrode on the polycrystalline semiconductor layer, a first source electrode, and a first drain electrode; a second thin film transistor on the substrate and including a second gate electrode, an oxide semiconductor layer on the second gate electrode, a second source electrode, and a second drain electrode; an intermediate insulating layer on the first gate electrode and the second gate electrode and under the oxide semiconductor layer; and a dummy layer between the first source electrode and the intermediate insulating layer and between the first drain electrode and the intermediate insulating layer, wherein the dummy layer is formed of a same material as the oxide semiconductor layer.
1. A thin film transistor substrate, comprising:
a substrate;
a first thin film transistor on the substrate, the first thin film transistor including a polycrystalline semiconductor layer, a first gate electrode on the polycrystalline semiconductor layer, a first source electrode on a portion of the polycrystalline semiconductor layer, and a first drain electrode on another portion of the polycrystalline semiconductor layer;
a second thin film transistor on the substrate, the second thin film transistor including a second gate electrode, an oxide semiconductor layer on the second gate electrode, a second source electrode on a portion of the oxide semiconductor layer, and a second drain electrode on another portion of the oxide semiconductor layer;
an intermediate insulating layer on the first gate electrode and the second gate electrode and under the oxide semiconductor layer; and
a dummy layer between the first source electrode and the intermediate insulating layer and between the first drain electrode and the intermediate insulating layer, wherein the dummy layer is formed of a same material as the oxide semiconductor layer.
2. The thin film transistor substrate according to claim 1 , wherein the second source electrode is on one side portion of the oxide semiconductor layer, and
wherein the second drain electrode is on other side portion of the oxide semiconductor layer.
3. The thin film transistor substrate according to claim 1 , further comprising:
a gate insulating layer covering the polycrystalline semiconductor layer,
wherein the first gate electrode and the second gate electrode are on the gate insulating layer.
4. The device according to the claim 3 , wherein the first source electrode is on the dummy layer and is connected to a portion of the polycrystalline semiconductor layer using a source contact hole through the dummy layer, the intermediate insulating layer, and the gate insulating layer, and
wherein the first drain electrode is on the dummy layer and is connected to another portion of the polycrystalline semiconductor layer using a drain contact hole through the dummy layer, the intermediate insulating layer, and the gate insulating layer.
5. The device according to the claim 1 , wherein the intermediate insulating layer includes:
a first intermediate insulation layer and a second intermediate insulating layer,
wherein the first intermediate insulating layer is on the first gate electrode,
wherein the second gate electrode is on the first intermediate insulating layer, and
wherein the second intermediate insulating layer is on the second gate electrode.
6. The device according to the claim 1 , wherein the intermediate insulating layer includes:
a nitride layer; and
an oxide layer on the nitride layer.
7. A thin film transistor substrate, comprising:
a substrate;
a first semiconductor layer on the substrate and including a polycrystalline semiconductor material;
a gate insulating layer covering the first semiconductor layer;
a first gate electrode on the gate insulating layer and overlapping the first semiconductor layer;
a second gate electrode on the gate insulating layer;
an intermediate insulating layer covering the first gate electrode and the second gate electrode;
a second semiconductor layer on the intermediate insulating layer, the second semiconductor layer including an oxide semiconductor material overlapping the second gate electrode;
a first source electrode and a first drain electrode on the intermediate insulating layer;
dummy layers disposed under the first source electrode and the first drain electrode, the dummy layers including a same material as the oxide semiconductor material of the second semiconductor layer; and
a second source electrode and a second drain electrode on the second semiconductor layer.
8. The device according to the claim 7 , wherein the second source electrode contacts portion of the second semiconductor layer, and
wherein the second drain electrode contacts another portion of the second semiconductor layer.
9. The device according to the claim 7 , wherein the first source electrode is connected to a portion of the first semiconductor layer using a source contact hole through the dummy layer, the intermediate insulating layer, and the gate insulating layer, and
wherein the first drain electrode is connected to another portion of the first semiconductor layer using a drain contact hole through the dummy layer, the intermediate insulating layer and the gate insulating layer.
10. The device according to the claim 7 , wherein the intermediate insulating layer includes:
a first intermediate insulation layer and a second intermediate insulating layer,
wherein the first intermediate insulating layer is on the first gate electrode,
wherein the second gate electrode is on the first intermediate insulating layer, and
wherein the second intermediate insulating layer is on the second gate electrode.
11. The device according to the claim 7 , wherein the intermediate insulating layer includes:
a nitride layer; and
an oxide layer on the nitride layer.