Structure and process for W contacts
Structures and processes include a single metallization step for forming a metal nitride liner layer suitable for contact formation. The structure and processes generally includes forming a nitrogen-enriched surface in a deposited metal liner layer or forming a nitrogen-enriched surface in the dielectric material prior to deposition of the metal liner layer. In this manner, nitridization of the metal occurs upon deposition of nitrogen ions into the metal liner layer and/or as a function of additional conventional processing in fabricating the integrated circuit such that the deposited nitrogen ions diffuse into at least a portion of the metal liner layer. As a consequence, only a single metal layer deposition step is needed to form the metal liner layer.
1. A contact structure for an integrated circuit device, comprising;
a patterned dielectric material comprising at least one contact hole, the contact hole including a bottom surface, and sidewalls extending from the bottom surface to a top surface, wherein the bottom surface is defined by a source/drain region or a metal gate, wherein the bottom surface and sidewalls extending from the bottom surface comprise a nitrogen enriched surface on and in a portion of the patterned dielectric material;
a metal nitride liner layer on the sidewalls and the bottom surface of the at least one contact hole; and
a tungsten plug disposed within the at least one contact hole.
2. The contact structure of claim 1 , wherein the metal nitride liner layer is Ti(N).
3. The contact structure of claim 1 , wherein the metal nitride liner layer covers the bottom surface.
4. A contact structure for an integrated circuit device, comprising;
a patterned dielectric material comprising at least one contact hole, the contact hole including a bottom surface, and sidewalls extending from the bottom surface to a top surface, wherein the bottom surface is defined by a source/drain region or a metal gate, and wherein the patterned dielectric material comprises a nitrogen enriched surface on and in a portion at least at the sidewalls of the contact hole;
a metal liner layer disposed on the sidewalls and the bottom surface of the at least one contact hole, wherein contact of the metal liner layer with the nit nitrogen enriched patterned dielectric material forms a metal nitride gradient in the metal liner layer; and
a tungsten plug disposed within the at least one contact hole.
5. The contact structure of claim 4 , wherein the bottom surface of the at least one contact hole is nitrogen enriched in addition to the sidewalls.
6. The contact structure of claim 4 , wherein the metal liner layer is in direct contact with the source/drain regions or metal gate at the bottom of the contact hole.
7. The contact structure of claim 4 , wherein the metal nitride liner layer is Ti(N).