Power package lid

1. A ring-frame power package comprising:

a thermal carrier having a carrier surface;

a ring structure residing on the carrier surface of the thermal carrier, and comprising a ring body and a plurality of interconnect tabs that extend outward from an outer periphery of the ring body, wherein a portion of the carrier surface of the thermal carrier is exposed through an interior opening of the ring body and each interconnect tab of the plurality of interconnect tabs comprises:

a top plated area that covers at least a portion of a top surface of a corresponding interconnect tab and a corresponding contact portion of the ring body; and

a bottom plated area that covers at least a portion of a bottom surface of the corresponding interconnect tab such that the corresponding interconnect tab and the thermal carrier are electrically isolated, wherein the top plated area and the bottom plated area are electrically coupled;

one or more semiconductor devices connected to the portion of the carrier surface of the thermal carrier; and

a power package lid residing on the ring body and having at least one cavity conjoined with the interior opening of the ring body, wherein:

the one or more semiconductor devices are exposed to the at least one cavity; and

the at least one cavity has a depth less than a thickness of the power package lid.

2. The ring-frame power package of claim 1 wherein the power package lid is formed as a solid structure.

3. The ring-frame power package of claim 2 wherein the power package lid is formed from an organic material.

4. The ring-frame power package of claim 3 wherein the organic material is selected from the group consisting of Isola 370HR and Isola 300MD.

5. The ring-frame power package of claim 2 wherein the power package lid is formed from a polyimide material.

6. The ring-frame power package of claim 5 wherein the polyimide material comprises Isola P95.

7. The ring-frame power package of claim 1 wherein the thickness of the power package lid is approximately between 1.2 mm and 2.4 mm.

8. The ring-frame power package of claim 7 wherein the depth of the at least one cavity is approximately between 15% and 90% of the thickness of the power package lid.

9. The ring-frame power package of claim 1 wherein the at least one cavity comprises:

a plurality of separate cavities conjoined with the interior opening of the ring body.

10. The ring-frame power package of claim 9 wherein each separate cavity of the plurality of separate cavities has a depth less than the thickness of the power package lid.

11. The ring-frame power package of claim 10 wherein the power package lid has a thickness approximately between 1.2 mm and 2.4 mm.

12. The ring-frame power package of claim 11 wherein each separate cavity of the plurality of separate cavities has a depth approximately between 15% and 90% of the thickness of the power package lid.

13. The ring-frame power package of claim 1 wherein the power package lid is attached to the ring body via a non-conductive epoxy.

14. The ring-frame power package of claim 13 wherein the non-conductive epoxy comprises Ablebond 84-3.

15. The ring-frame power package of claim 1 wherein the at least one cavity comprises a first cavity and a second cavity, both of which are conjoined with the interior opening of the ring body.

16. The ring-frame power package of claim 15 wherein the first cavity and the second cavity have a same depth.

17. The ring-frame power package of claim 15 wherein the first cavity and the second cavity have different depths.