IP Library › Granted Patent US 10,614,202
Granted Patent B2
US 10,614,202 · App. 15/141,279 · Granted Apr 7, 2020

Electronic device

Inventors: Kyunghoon Song (Yongin-si, KR); Yoonoh Chi (Suwon-si, KR); Gyeongmin Jin (Seoul, KR); Kwangsub Lee (Yongin-si, KR); Saebom Lee (Suwon-si, KR); Seyoung Jang (Seongnam-si, KR); Chihyun Cho (Suwon-si, KR); Yunjang Jin (Yongin-si, KR)
Assignee: Samsung Electronics Co., Ltd.
G06F21/32G06F1/1626G06F1/1656G06F1/1684G06F3/03547G06F3/041G06F3/044G06F3/0488G06K9/0002H01H13/04H04M1/23G06F2203/0338G06F2203/04103H04M1/67
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Quick Facts
Patent No.
US 10,614,202
App. No.
15/141,279
Granted
Apr 7, 2020
Kind
B2
Abstract

An electronic device is provided. The electronic device includes an input sensing module that detects at least two inputs and a processor that controls the electronic device to perform a function corresponding to an input received through the input sensing module, wherein the input sensing module includes at least one fingerprint recognition sensor, at least one touch sensor, and an input processor electrically connected to the at least one fingerprint recognition sensor and the at least one touch sensor and that processes an input received from the at least one fingerprint recognition sensor or the at least one touch sensor and that transfers the input to the processor.

Claims (37)

1. An electronic device comprising:

an input sensing module comprising:

a flexible circuit board,

at least one fingerprint recognition sensor and at least one touch sensor each electrically connected to the flexible circuit board, and

an input processor configured to receive and process an input from the at least one fingerprint recognition sensor and the at least one touch sensor through the flexible circuit board;

a mounting structure in which the input sensing module is mounted; and

a support structure comprising a space to house the mounting structure, the space being located within the electronic device,

wherein the mounting structure comprises:

a casing that mounts the input processor,

a circumferential edge portion physically divided from the casing and disposed to enclose a side surface of the input processor of the input sensing module, and

a cover glass stacked in an upper portion of the input sensing module,

wherein the at least one fingerprint recognition sensor is mounted on an upper portion of the input processor and the at least one touch sensor is mounted on an upper portion of the support structure spaced apart from the input processor, and

wherein the fingerprint recognition sensor is formed integrally with the input processor.

2. The electronic device of claim 1 , wherein the circumferential edge portion is electrically floated from the casing.

3. The electronic device of claim 1 , wherein the casing and the circumferential edge portion are made of a conductive material.

4. The electronic device of claim 1 ,

wherein the input processor is mounted in an upper portion of the casing.

5. The electronic device of claim 1 ,

wherein a portion of the flexible circuit board is supported by an upper portion of the casing, and

wherein other portions of the flexible circuit board, except for the portion of the flexible circuit board, are supported by the upper portion of the support structure.

6. The electronic device of claim 1 , wherein the flexible circuit board comprises:

a lower solder mask layer disposed in the upper portion of the support structure;

a conductive body layer disposed on the lower solder mask layer; and

an upper solder mask layer disposed in an upper portion of the conductive body layer,

wherein an opening portion that exposes the conductive body layer is formed in the lower solder mask layer, and

wherein the conductive body layer exposed through the opening portion is electrically connected to the support structure.

7. The electronic device of claim 1 , wherein the support structure is made of a material having impedance lower than that of the conductive body layer.

8. The electronic device of claim 1 ,

wherein the circumferential edge portion comprises a protruding portion protruded in a direction toward a side surface of the input processor, and

wherein the protruding portion supports the cover glass in at least a portion of a lower surface of the cover glass.

9. The electronic device of claim 8 , wherein an upper surface of the protruding portion and an upper surface of the input processor form one plane.

10. The electronic device of claim 1 , wherein the casing comprises:

a lower plate that supports the input processor by a contact with a flexible circuit board portion in which the input processor is mounted; and

two side surface portions integrally formed with the lower plate and extended in a vertical direction at an upper surface of the lower plate to form space that houses the input processor together with the lower plate.

11. The electronic device of claim 10 , wherein a slot in which the flexible circuit board penetrates is formed in a portion of the two side surface portions.

12. The electronic device of claim 10 , wherein an upper surface of the two side surface portions and an upper surface of the input processor form one plane.

13. The electronic device of claim 10 , wherein an upper surface of the two side surface portions supports the cover glass in at least a portion of a lower surface of the cover glass.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 28, 2016
From: SONG, KYUNGHOON; CHI, YOONOH; JIN, GYEONGMIN; LEE, KWANGSUB; JANG, SEYOUNG; CHO, CHIHYUN; JIN, YUNJANG
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 038411/0825 →
Priority Claims (1)
KR 10-2015-0060451 · Apr 29, 2015 · national
Continuity (1)
Related Publication 20160321442A1 · Nov 3, 2016
Cited By (1)
US 12,204,372