IP Library Granted Patent US 10,393,891
Granted Patent B2
US 10,393,891 · App. 15/144,861 · Granted Aug 27, 2019

Sub-pixel segmentation for semiconductor radiation detectors and methods of fabricating thereof

Inventors: Kris Iniewski (Coquitlam, CA); Glenn Bindley (Vancouver, CA)
Assignee: REDLEN TECHNOLOGIES, INC.
G01T1/24G01T1/171
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Quick Facts
Patent No.
US 10,393,891
App. No.
15/144,861
Granted
Aug 27, 2019
Kind
B2
Abstract

Various embodiments described herein may include a detector array for a CT imaging system. The detector array includes a pixel array in which each pair of adjacent pixels in the pixel array may be separated by a collimator (e.g., located between each row and column of the pixel array) that absorbs photons and each pixel in the pixel array includes a sub-pixel array. The collimator absorbs photons that strike at a boundary between adjacent pixels. Each sub-pixel may have an anode that is connected to an ASIC channel. When a sub-pixel in a pixel detects a photon, signals of a plurality of sub-pixels in the pixel are automatically summed, including the sub-pixel that detected the photon.

Claims (21)

1. A detector array for a CT imaging system, comprising:

a pixel array, wherein:

each pair of adjacent pixels in the pixel array is separated by a collimator that absorbs photons and contacts a plurality of cathodes,

each pixel in the pixel array comprises a sub-pixel array and one cathode,

a cathode of a first pixel in the pixel array and a cathode of a second pixel in the pixel array are spaced apart from each other forming a gap; and

the collimator spans the gap and contacts the cathode of the first pixel and the cathode of the second pixel.

2. The detector array of claim 1 , wherein the collimator absorbs photons that strike at a boundary between adjacent pixels at a substantially non-perpendicular angle to the pixel array.

3. The detector array of claim 1 , wherein each sub-pixel in the sub-pixel array has a separate anode.

4. The detector array of claim 3 , wherein the anode of each sub-pixel is electrically connected to an ASIC channel, wherein all the sub-pixels in each sub-pixel array share a cathode.

5. The detector array of claim 1 , wherein when a sub-pixel in a first pixel detects a photon, signals of a plurality of sub-pixels in the first pixel, including the sub-pixel that detected the photon, are automatically summed.

6. The detector array of claim 1 , wherein there is no collimator or other intervening structure between adjacent sub-pixels in each pixel.

7. The detector array of claim 1 , wherein each sub-pixel comprises a CZT sensor, and all the pixels in the pixel array are located on a common CZT substrate.

8. The detector array of claim 1 , wherein each row and each column of pixels in the pixel array is separated by a collimator.

9. A method of fabricating a radiation detector array, comprising:

determining a size of a sub-pixel array for each pixel of a pixel array in a radiation detector, wherein the size is based on attributes of the radiation detector, a maximum photon count rate per second, energy resolution of a CT imaging system including the radiation detector array, and a frequency of pile-up effects;

fabricating the pixel array and the sub-pixel array of each pixel in the sub-pixel array based on the determined size, wherein each pixel is fabricated to include a cathode such that a cathode of a first pixel in the pixel array and a cathode of a second pixel in the pixel array are spaced apart from each other forming a gap;

placing a collimator between each row and each column of the pixel array, wherein the collimator spans the gap and contacts the cathode of the first pixel in the pixel array and the cathode of the second pixel in the pixel array; and

connecting a pixel detector circuit to each pixel in the array of pixels.

10. The method of claim 9 , wherein the attributes of the radiation detector array comprises at least one of a loading capacitance of one or more ASIC channels in the pixel detector circuit, an energy resolution of the radiation detector array, a dark current of each sub-pixel, a noise level of each sub-pixel, a charge cloud size of each sub-pixel, and a maximum count rate of the one or more ASIC channels.

11. The method of claim 9 , wherein each sub-pixel in the sub-pixel array comprises a CZT sensor.

12. The method of claim 9 , wherein the attributes of the radiation detector array comprises each of a loading capacitance of one or more ASIC channels in the pixel detector circuit, an energy resolution of the radiation detector array, a dark current of each sub-pixel, a noise level of each sub-pixel, a charge cloud size of each sub-pixel, and a maximum count rate of the one or more ASIC channels.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Mar 30, 2023
From: THE BUSINESS DEVELOPMENT BANK OF CANADA
To: REDLEN TECHNOLOGIES INC.
Reel/Frame 063170/0719 →
SECURITY INTEREST Recorded Apr 15, 2020
From: REDLEN TECHNOLOGIES INC.
To: BUSINESS DEVELOPMENT BANK OF CANADA
Reel/Frame 052407/0903 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2017
From: INIEWSKI, KRIS; BINDLEY, GLENN
To: REDLEN TECHNOLOGIES, INC.
Reel/Frame 043914/0740 →
Continuity (1)
Related Publication 20170322319A1 · Nov 9, 2017
Cited By (2)
US 12,693,439 US 12,717,050