Display device, method for manufacturing same, polyimide film for display device supporting bases, and method for producing polyimide film for display device supporting bases
Provided is a display device that can be made thin, lightweight, and flexible, has no problems of cracks and peeling caused by thermal stress, and is excellent in dimension stability and the like. The display device includes: a supporting base including a polyimide film; and a gas barrier layer formed on the supporting base, in which the polyimide film has a transmittance of 80% or more in a wavelength region of from 440 nm to 780 nm, and a coefficient of thermal expansion of 15 ppm/K or less, and has a difference in coefficient of thermal expansion from the gas barrier layer of 10 ppm/K or less.
1. A manufacturing method for a display device,
the manufacturing method comprising:
applying a resin solution of polyimide or a polyimide precursor onto a base substrate so that a thickness of a polyimide film becomes 50 μm or less;
forming the polyimide film on the base substrate by completing heat treatment;
forming a stress relaxation layer for preventing stretching of the polyimide film on the polyimide film;
removing the base substrate under a state in which the polyimide film and the stress relaxation layer are laminated; and
forming a member for a display device,
wherein the polyimide film comprises a single polyimide layer or a plurality of polyimide layers and has a retardation in an in-plane direction of 10 nm or less.
2. A manufacturing method for a display device according to claim 1 , wherein a bottom surface of the polyimide film is irradiated with laser light through the base substrate so that the polyimide film and the base substrate are peeled from each other.
3. A display device obtained by using the method according to claim 1 .
4. A production method for a polyimide film for a display device supporting base,
the production method comprising:
applying a resin solution of polyimide or a polyimide precursor onto a base substrate so that a thickness of a polyimide film becomes 50 μm or less;
forming the polyimide film on the base substrate by completing heat treatment; and
peeling the polyimide film from the base substrate,
wherein the polyimide film has a transmittance of 80% or more in a wavelength region of from 440 nm to 780 nm and a transmittance of 80% or less at 400 nm, and
wherein a bottom surface of the polyimide film is irradiated with laser light through the base substrate so that the polyimide film and the base substrate are peeled from each other.
5. A production method for a polyimide film for a display device supporting base according to claim 4 , wherein the base substrate comprises glass.
6. A production method for a polyimide film for a display device supporting base,
the production method comprising:
applying a resin solution of polyimide or a polyimide precursor onto a base substrate so that a thickness of a polyimide film becomes 50 μm or less;
forming the polyimide film on the base substrate by completing heat treatment; and
peeling the polyimide film from the base substrate,
wherein the base substrate is removed under a state which the polyimide film is fixed to another substrate, and the polyimide film and the base are peeled from each other.