2.5D microelectronic assembly and method with circuit structure formed on carrier
A dielectric element has a plurality of contacts at a first surface and a plurality of first traces coupled thereto which extend in directions parallel to the first surface. A circuit structure made of a plurality of dielectric layers and electrically conductive features thereon includes a plurality of bumps at a first surface which face the contacts of the dielectric element and are joined thereto. Circuit structure contacts at a second surface opposite the first surface are electrically coupled with the bumps through second traces on the circuit structure, the circuit structure contacts configured for connection with a plurality of element contacts of each of a plurality of microelectronic elements, wherein the microelectronic elements can be assembled therewith such that element contacts thereof face and are joined with the circuit structure contacts.
1. An assembly, comprising:
a dielectric element having a plurality of contacts at a first surface thereof and a plurality of first electrically conductive traces coupled with the contacts, the first traces extending in directions parallel to the first surface;
a circuit structure made of a plurality of dielectric layers and electrically conductive features thereon, the electrically conductive features comprising a plurality of bumps at a first surface of the circuit structure facing the contacts of the dielectric element and joined thereto, a plurality of circuit structure contacts at a second surface opposite the first surface, and a plurality of second traces, wherein the bumps and the circuit structure contacts are electrically coupled by the second traces, and the circuit structure contacts are configured for connection with a plurality of element contacts of each of a plurality of microelectronic elements in a state in which the circuit structure contacts are juxtaposed with the element contacts of each of the plurality of microelectronic elements, wherein the circuit structure has a maximum thickness of less than 10 micrometers in a direction normal to the first surface of the circuit structure; and
at least one electronic component underlying the second surface of the circuit structure, wherein an electronic component of the at least one electronic component is disposed between the first surface of the dielectric element and the second surface of the circuit structure.
2. The assembly as claimed in claim 1 , wherein the circuit structure contacts include first circuit structure contacts configured for connection with a first microelectronic element, and second circuit structure contacts configured for connection with a second microelectronic element spaced apart from the first microelectronic element in a direction parallel to the first surface of the circuit structure, wherein at least some of the first circuit structure contacts are electrically coupled with the second circuit structure contacts through the second traces.
3. The assembly as claimed in claim 1 , further comprising an encapsulant contacting and underlying the first surface of the circuit structure.
4. The assembly as claimed in claim 1 , wherein the bumps comprise extruded wire segments, the assembly further comprising a compliant underfill disposed between the first surface of the dielectric element and the second surface of the circuit structure, the underfill having a composition different from a composition of the dielectric element, and different from a composition of the circuit structure.
5. The assembly as claimed in claim 1 , wherein at least some of the second traces are disposed closer to the first surface of the circuit structure and have maximum widths greater than maximum widths of the second traces which are disposed closer to the second surface of the circuit structure.
6. The assembly as claimed in claim 1 , further comprising the plurality of microelectronic elements, wherein the circuit structure contacts are juxtaposed with and joined with the element contacts of the plurality of microelectronic elements.
7. The assembly as claimed in claim 1 , further comprising the plurality of microelectronic elements, wherein the circuit structure contacts are juxtaposed with and joined with the element contacts of the plurality of microelectronic elements, and a peripheral portion of the circuit structure extends in a lateral direction between an edge of at least one of the microelectronic elements and an edge of the assembly, the peripheral portion overlying an electronic component of the at least one electronic component.
8. The assembly as claimed in claim 1 , wherein another electronic component of the at least one electronic component extends below the first surface of the dielectric element.
9. The assembly as claimed in claim 1 , wherein the at least one electronic component comprises at least one of a capacitor or a voltage regulator.
10. The assembly as claimed in claim 1 , further comprising an encapsulant extending between the second surface of the circuit structure and an edge surface of the dielectric element.
11. The assembly as claimed in claim 1 , further comprising an encapsulant extending between the first surface of the dielectric element and an edge surface of the circuit structure, wherein the encapsulant forms a fillet which tapers in thickness overlying the edge surface of the circuit structure in a direction normal to the second surface of the circuit structure.
12. The assembly as claimed in claim 2 , wherein at least one of: the bumps, or connections between the bumps and the contacts of the dielectric element comprises a bond material, the assembly further comprising an underfill mechanically reinforcing the connections between the bumps of the circuit structure and the contacts of the dielectric element, the underfill having a composition different from a composition of the dielectric element, and different from a composition of the circuit structure.
13. The assembly as claimed in claim 8 , wherein the another electronic component extending below the first surface of the dielectric element is disposed beyond a peripheral edge surface of the dielectric element.
14. The assembly as claimed in claim 8 , wherein the another electronic component extending below the first surface of the dielectric element is disposed in a recess in the dielectric element, the recess extending downwardly from the first surface of the dielectric element.
15. The assembly as claimed in claim 7 , further comprising a heat spreader overlying surfaces of the plurality of microelectronic elements at a first height above the circuit structure, wherein a foot portion of the heat spreader overlies the peripheral portion of the circuit structure at a second height lower than the first height from the circuit structure.
16. The assembly as claimed in claim 15 , wherein the foot portion of the heat spreader extends beyond a peripheral edge of the circuit structure.
17. The assembly as claimed in claim 16 , further comprising an encapsulant contacting a peripheral edge surface of the circuit structure and a downwardly facing surface of the heat spreader disposed beyond the edge surface of the circuit structure.
18. The assembly as claimed in claim 10 , wherein the encapsulant forms a fillet which tapers in thickness overlying the edge surface of the dielectric element in a direction normal to the first surface of the dielectric element.
19. The assembly as claimed in claim 10 , wherein at least a portion of the encapsulant defines an edge surface of the assembly which is parallel to an edge surface of the dielectric element.
20. The assembly as claimed in claim 19 , wherein the dielectric element is a plurality of discrete dielectric elements, and the encapsulant extends between adjacent edge surfaces of at least two adjacent dielectric elements in the assembly.
21. The assembly as claimed in claim 19 , wherein the dielectric element has a plurality of discrete dielectric elements, the encapsulant extending between edge surfaces of adjacent dielectric elements in the assembly.
22. The assembly as claimed in claim 19 , wherein the dielectric element comprises a plurality of first regions connected in at least one lateral direction by partially perforated regions, each partially perforated region extending in a direction normal to the first surface.
23. An assembly, comprising:
a dielectric element having a plurality of contacts at a first surface thereof and a plurality of first electrically conductive traces coupled with the contacts, the first traces extending in directions parallel to the first surface;
a circuit structure made of a plurality of dielectric layers and electrically conductive features thereon, the electrically conductive features comprising a plurality of bumps at a first surface of the circuit structure facing the contacts of the dielectric element and joined thereto, a plurality of circuit structure contacts at a second surface opposite the first surface, and a plurality of second traces, wherein the bumps and the circuit structure contacts are electrically coupled by the second traces, and the circuit structure contacts are configured for connection with a plurality of element contacts of each of a plurality of microelectronic elements in a state in which the circuit structure contacts are juxtaposed with the element contacts of each of the plurality of microelectronic elements, wherein the circuit structure has a maximum thickness of less than 10 micrometers in a direction normal to the first surface of the circuit structure; and
at least one electronic component underlying the second surface of the circuit structure, wherein an electronic component of the at least one electronic component extends below the first surface of the dielectric element and has a plurality of contacts at a surface of the electronic component opposite from a surface of the electronic component which faces the circuit structure, the contacts of the electronic component configured for connection with a second component disposed below the assembly.
24. The assembly as claimed in claim 23 , wherein an electronic component of the at least one electronic component is disposed between the first surface of the dielectric element and the second surface of the circuit structure.
25. An assembly, comprising:
a dielectric element having a plurality of contacts at a first surface thereof and a plurality of first electrically conductive traces coupled with the contacts, the first traces extending in directions parallel to the first surface;
a circuit structure made of a plurality of dielectric layers and electrically conductive features thereon and having a maximum thickness of less than 10 micrometers in a direction normal to the first surface of the circuit structure, the electrically conductive features comprising a plurality of bumps at a first surface of the circuit structure facing the contacts of the dielectric element and joined thereto, a plurality of circuit structure contacts at a second surface opposite the first surface, and a plurality of second traces, wherein the bumps and the circuit structure contacts are electrically coupled by the second traces;
a plurality of microelectronic elements each having a front surface, edge surfaces extending away from the front surface, and element contacts at the front surface, the element contacts juxtaposed with and electrically coupled with the circuit structure contacts;
an insulating encapsulation overlying at least the edge surfaces of the microelectronic elements; and
at least one electronic component underlying the second surface of the circuit structure, wherein an electronic component of the at least one electronic component is disposed between the first surface of the dielectric element and the second surface of the circuit structure.
26. The assembly as claimed in claim 25 , wherein a carrier provides support during formation of the plurality of dielectric layers of the circuit structure thereon and assembly of the microelectronic elements with the circuit structure, and the circuit structure is separated from the carrier prior to assembly with the dielectric element.
27. The assembly as claimed in claim 25 , wherein a release layer maintains the circuit structure atop the carrier during formation of the plurality of dielectric layers, and the circuit structure is separated from the carrier prior to assembly with the dielectric element by releasing the release layer.
28. The assembly as claimed in claim 25 , wherein the circuit structure is separated from the carrier prior to assembly with the dielectric element by abrading the carrier.
29. The assembly as claimed in claim 26 , wherein at least some of the first circuit structure contacts are electrically coupled with the second circuit structure contacts through the second traces.