Semiconductor integrated circuit device
In a semiconductor integrated circuit device, a plurality of electrode pads for external connection are arranged in a zigzag pattern. Some electrode pads of the electrode pads of the plurality of I/O cells which are closer to a side of the semiconductor chip, each have an end portion closer to the side of the semiconductor chip, the end portion being set at the same position as that of an end portion of the corresponding I/O cell. A power source-side protective circuit and a ground-side protective circuit against discharge of static electricity are provided with the power source-side protective circuit being closer to the scribe region. A distance between a center position of one of the electrode pads and the ground-side protective circuit of the corresponding I/O cell and a distance between a center position of the other one electrode pad and the ground-side protective circuit of the corresponding I/O cell are both short and are substantially equal between each I/O cell.
1. A semiconductor integrated circuit device, comprising:
a semiconductor chip including an internal circuit and a plurality of I/O cells, wherein:
the plurality of I/O cells are provided on a periphery area of the semiconductor chip,
each of the plurality of I/O cells includes a first region to which first voltage is supplied and a second region to which second voltage is supplied, wherein the second voltage is lower than the first voltage, the first region including a protective circuit for protecting the internal circuit from discharge of static electricity,
the first region is disposed closer to an outermost edge of the semiconductor chip than the second region,
each of the plurality of I/O cells has a corresponding electrode pad overlapping the I/O cell in plan view and connected to the corresponding protective circuit,
electrode pads of the plurality of I/O cells are arranged on a first line and a second line, the first line being disposed closer to the outermost edge of the semiconductor chip than the second line, and
the protective circuit of each of the plurality of I/O cells includes:
a power source-side protective circuit provided between the corresponding electrode pad and a power source wiring; and
a ground-side protective circuit provided between the corresponding electrode pad and a ground wiring,
wherein the power source-side protective circuit is positioned closer to the outermost edge of the semiconductor chip than the ground-side protective circuit.
2. The semiconductor integrated circuit device of claim 1 , wherein:
the first region further includes a portion of a level shift circuit operated with the first voltage, and
the protective circuit is disposed closer to the outermost edge of the semiconductor chip than the portion of the level shift circuit.
3. The semiconductor integrated circuit device of claim 2 , wherein
the first region further includes a plurality of guard ring diffusion layers.
4. The semiconductor integrated circuit device of claim 3 , wherein
two of the plurality of guard ring diffusion layers adjacent to each other have same polarity.
5. The semiconductor integrated circuit device of claim 4 , wherein
the two of the plurality of guard ring diffusion layers share a portion of the two of the plurality of guard ring diffusion regions.
6. The semiconductor integrated circuit device of claim 5 , wherein
side edges of the electrode pads disposed on the first line, which are parallel to and closest to the outermost edge of the semiconductor chip, are disposed on a substantially same line as side edges of the plurality of I/O cells, which are parallel to and closest to the outermost edge of the semiconductor chip.
7. The semiconductor integrated circuit device of claim 6 , wherein
the side edges of the electrode pads disposed on the first line, which are parallel to and closest to the outermost edge of the semiconductor chip, are disposed on a same line as the side edges of the plurality of I/O cells, which are parallel to and closest to the outermost edge of the semiconductor chip.
8. The semiconductor integrated circuit device of claim 2 , wherein
the ground-side protective circuit includes an N-type diffusion layer region and the power source-side protective circuit includes a P-type diffusion layer region.
9. The semiconductor integrated circuit device of claim 8 , wherein
the portion of the level shift circuit includes a N-type diffusion layer region positioned closer to the side of the semiconductor chip and a P-type diffusion layer region closer to the center of the semiconductor chip.
10. The semiconductor integrated circuit device of claim 2 , wherein
the second region includes a second portion of the level shift circuit operated with the second voltage.
11. The semiconductor integrated circuit device of claim 10 , wherein
the portion of the level shift circuit is positioned closer to the outermost edge of the semiconductor chip than the second portion of the level shift circuit.