IP Library Granted Patent US 9,847,335
Granted Patent B2
US 9,847,335 · App. 15/149,774 · Granted Dec 19, 2017

Methods and apparatuses including an active area of a tap intersected by a boundary of a well

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Quick Facts
Patent No.
US 9,847,335
App. No.
15/149,774
Granted
Dec 19, 2017
Kind
B2
Abstract

Apparatuses and methods are disclosed. One such apparatus includes a well having a first type of conductivity formed within a semiconductor structure having a second type of conductivity. A boundary of the well intersects an active area of a tap to the well.

Claims (29)

1. An apparatus comprising:

a memory array comprising a plurality of memory cells; and

support circuitry coupled to the memory array, the support circuitry comprising a semiconductor device comprising a well having a first type of conductivity formed within a semiconductor structure having a second type of conductivity;

a tap to the well comprising an active area having a lightly doped area outside a boundary of the well and a more heavily doped area outside a boundary of the semiconductor structure.

2. The apparatus of claim 1 , wherein the memory array and the support circuitry are included in a memory device.

3. The apparatus of claim 2 , further comprising a processor coupled to the memory device.

4. The apparatus of claim 1 , wherein the semiconductor structure comprises a P-well, the well comprises an N-well, the more heavily doped area comprises an N+ area, and the lightly doped area comprises an N− area.

5. The apparatus of claim 4 , wherein the semiconductor structure comprises a N-well, the well comprises an P-well, the more heavily doped area comprises a P+ area, and the lightly doped area comprises a P− area.

6. The apparatus of claim 1 , comprising a contact over the more heavily doped area.

7. The apparatus of claim 6 , wherein the active area is over a substantially vertical junction between the lightly doped area and the more heavily doped area, and

wherein the contact is entirely over the more heavily doped area.

8. The apparatus of claim 1 , wherein the more heavily doped area is limited to under the contact.

9. The apparatus of claim 1 , wherein the well creates an electric field peak at the edge of the well within lightly doped area of the active area to increase breakdown voltage of the apparatus.

10. The apparatus of claim 1 , comprising an isolation area, wherein the lightly doped area is between the contact and the isolation area.

11. The apparatus of claim 1 , wherein the active area is over a junction between the lightly doped area and the more heavily doped area.

12. The apparatus of claim 11 , wherein the junction comprises a substantially vertical junction.

13. The apparatus of claim 11 , wherein the junction comprises a substantially vertical junction, and

wherein the contact is entirely over the more heavily doped area.

14. The apparatus of claim 11 , wherein the contact is entirely over the more heavily doped area.

15. The apparatus of claim 11 , wherein the contact is not over the lightly doped area.

16. An apparatus comprising:

a memory array comprising a plurality of memory cells;

support circuitry coupled to the memory array, the support circuitry comprising a semiconductor device comprising a well having a first type of conductivity formed within a semiconductor structure having a second type of conductivity;

a tap to the well comprising an active area having a lightly doped area outside a boundary of the well and a more heavily doped area outside a boundary of the semiconductor structure; and

a contact over the more heavily doped area.

17. The apparatus of claim 16 , wherein the contact is not over the lightly doped area.

18. The apparatus of claim 16 , wherein the contact is entirely over the more heavily doped area.

19. The apparatus of claim 16 , wherein the active area is over a junction between the lightly doped area and the more heavily doped area.

20. The apparatus of claim 16 , wherein the junction comprises a substantially vertical junction.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050676/0782 →
RELEASE OF SECURITY INTEREST Recorded Jul 20, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 046635/0634 →
SUPPLEMENT NO. 1 TO PATENT SECURITY AGREEMENT Recorded Aug 26, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 039841/0207 →
SUPPLEMENT NO. 1 TO PATENT SECURITY AGREEMENT Recorded Aug 25, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 039824/0681 →