High-voltage isolator testing
A handler for holding an electronic device during high voltage testing includes conductive lead guides for shorting leads on one side of the isolator together and connectors connecting the lead guides to conductors.
1. A handler for holding an electronic device during high voltage testing, the handler comprising:
conductive lead guides, each lead guide having a single conductive surface for shorting all leads on one side of an electronic device under test; and
a plurality of connectors connecting the lead guides to conductors.
2. The handler of claim 1 , further comprising:
an insulator, located between the lead guides.
3. The handler of claim 2 , where the insulator is made of plastic.
4. The handler of claim 1 , where the connectors are spring-loaded test pins.
5. The handler of claim 1 , where high voltage is coupled from the conductors through the connectors to the lead guides.
6. The handler of claim 1 , where the connectors are arranged into sets, each set contacting one lead guide.
7. The handler of claim 6 , further comprising:
an insulator, located between sets of the connectors.
8. The handler of claim 7 , where the insulator is made of plastic.
9. The handler of claim 6 , where each set of connectors is mounted onto a conductor.
10. The handler of claim 9 , where corners of the conductors are rounded.
11. The handler of claim 1 , where the lead guides are made of metal.
12. The handler of claim 11 , where the lead guides are made of copper.
13. The handler of claim 1 where corners of the lead guides are rounded.
14. A method of high-voltage testing an electronic device, comprising:
pressing, by a handler, a conductive lead guide having a single conductive surface against all leads on one side of the electronic device;
pressing, by the handler, the lead guide against connectors; and
applying, by the handler, a high voltage to the connectors.
15. The method of claim 14 , further comprising:
locating, by the handler, an insulator between the lead guides and above the electronic device under test.
16. The method of claim 14 , further comprising:
locating, by the handler, an insulator at a midpoint between sets of the connectors.
17. A method of fabricating a handler for holding an electronic device during high voltage testing, comprising:
mounting lead guides in a position to facilitate each lead guide contacting all leads on one side of an electronic device under test with a single conductive surface of the lead guide; and
mounting connectors in a position to contact the lead guides.
18. The method of claim 17 , further comprising:
mounting an insulator so that it is located between the lead guides and above the electronic device under test.
19. The method of claim 17 , further comprising:
mounting an insulator so that it is located at a midpoint between sets of the connectors.
20. The handler of claim 1 , wherein the conductive lead guides are rigid.
21. The handler of claim 1 , wherein the electronic device under test is an isolator.
22. The handler of claim 1 , wherein each conductive lead guides presses down against a top surface of all leads on one side of the electronic device under test.
23. The method of claim 17 , wherein the conductive lead guides are rigid.
24. The method of claim 17 , wherein the electronic device under test is an isolator.
25. The method of claim 17 , wherein each conductive lead guides presses down against a top surface of all leads on one side of the electronic device under test.
26. A handler for holding an electronic device during high voltage testing, the handler comprising:
conductive lead guides, each lead guide for pressing down against and shorting all leads on one side of an electronic device under test; and
a plurality of connectors connecting the lead guides to conductors.
27. The method of claim 14 , wherein the conductive lead guides are rigid.
28. The method of claim 14 , wherein the electronic device under test is an isolator.
29. The method of claim 14 , wherein each conductive lead guides presses down against a top surface of all leads on one side of the electronic device under test.