Device and method for localized underfill
A device and method for localizing underfill includes a substrate, a plurality of dies, and underfill material. The substrate includes a plurality of contacts and a plurality of cavities separated by a plurality of mesas. The plurality of dies is mounted to the substrate using the plurality of contacts. The underfill material is located between the substrate and the dies. The underfill material is localized into a plurality of regions using the mesas. Each of the contacts is located in a respective one of the cavities. In some embodiments, the substrate further includes a plurality of channels interconnecting the cavities. In some embodiments, the substrate further includes a plurality of intra-cavity mesas for further localizing the underfill material. In some embodiments, outer edges of a first one of the dies rest on first mesas located on edges of a first one of the cavities.
1. A semiconductor package, the package comprising:
a substrate comprising a first cavity and a second cavity separated by a first mesa, the first cavity having a length along the first mesa and a width orthogonal to the length;
a first plurality of contacts located in the first cavity;
a second plurality of contacts located in the second cavity;
a first die mounted to the substrate using the first plurality of contacts, a first outer edge of the first die resting on an upper surface of the first mesa, the first outer edge being shorter than the length of the first cavity and a second outer edge of the first die orthogonal to the first outer edge of the first die being longer than the width;
a second die mounted to the substrate using the second plurality of contacts;
a first underfill material between the substrate and the first die; and
a second underfill material between the substrate and the second die, the second underfill material being separated from the first underfill material by the first mesa.
2. The package of claim 1 , wherein the first outer edge covers only a portion of the first mesa.
3. The package of claim 1 , wherein the first outer edge being shorter than the length of the first cavity allows introduction of the first underfill material.
4. The package of claim 1 , further comprising a channel interconnecting the first cavity and the second cavity.
5. The package of claim 4 , wherein a depth of the channel is less than a depth of the first cavity.
6. The package of claim 1 , further comprising one or more intra-cavity mesas subdividing the first cavity, each of the intra-cavity mesas further localizing the first underfill material.
7. The package of claim 1 , further comprising a second mesa on an opposite side of the first cavity from the first mesa, wherein a third outer edge of the first die rests on an upper surface of the second mesa.
8. The package of claim 7 , further comprising a third mesa and a fourth mesa on remaining sides of the first cavity.
9. The package of claim 8 , wherein the second outer edge of the first die rests on an upper surface of the third mesa and a fourth outer edge of the first die rests on an upper surface of the fourth mesa.
10. The package of claim 8 , wherein a distance between the third mesa and the fourth mesa is longer than the first outer edge of the first die.
11. A method of packaging semiconductor dies, the method comprising:
forming a first substrate;
forming a first cavity and a second cavity in the first substrate, the first cavity having a length and a width orthogonal to the length;
forming a plurality of first contacts in the first cavity;
forming a plurality of second contacts in the second cavity;
forming a first mesa separating the first and second cavities along the length of the first cavity;
mounting a first die to the first substrate using the first contacts, the first die having a first outer edge shorter than the length of the first cavity and a second outer edge orthogonal to the first outer edge that is longer than the width of the first cavity;
resting a first outer edge of the first die on an upper surface of the first mesa;
mounting a second die to the first substrate using the second contacts;
adding first underfill material to a first area between the first substrate and the first die;
adding second underfill material to a second area between the first substrate and the second die; and
maintaining separation between the first underfill material and the second underfill material using the first mesa.
12. The method of claim 11 , further comprising forming a channel interconnecting the first and second cavities.
13. The method of claim 12 , wherein forming the channel comprises forming the channel to a depth that is less than a depth of the first cavity.
14. The method of claim 12 , further comprising removing an excess portion of the first underfill material from the first cavity using the channel.
15. The method of claim 11 , further comprising:
forming a second mesa on an opposite side of the first cavity from the first mesa; and
resting a third outer edge of the first die on an upper surface of the second mesa.
16. The method of claim 15 , further comprising:
forming a third mesa and a fourth mesa on remaining sides of the first cavity.
17. The method of claim 16 , further comprising:
resting the second outer edge of the first die on an upper surface of the third mesa; and
resting a fourth outer edge of the first dies on an upper surface of the fourth mesa.
18. The method of claim 16 , wherein:
a distance between the third mesa and the fourth mesa is longer than the first outer edge of the first die; and
the method further comprises adding the first underfill material to the first area between the first substrate and the first die using an opening between the third mesa and the second outer edge of the first die.
19. The method of claim 13 , further comprising:
forming one or more intra-cavity mesas in the first cavity; and
further localizing the first underfill material using the intra-cavity mesas.
20. The method of claim 11 , further comprising:
forming a second substrate comprising the first mesa separately from the first substrate; and
bonding the second substrate to the first substrate.