Integrated circuits with deep and ultra shallow trench isolations and methods for fabricating the same

1. An integrated circuit comprising:

an SOI substrate comprising an active layer, a buried insulator layer, and a handle layer, wherein the active layer overlies the buried insulator layer, and the buried insulator layer overlies the handle layer;

a source defined within the active layer;

a gate well defined within the active layer;

a first ultra shallow trench isolation extending into the active layer, wherein a first portion of the active layer is positioned between the first ultra shallow trench isolation and the buried insulator layer, and wherein the first ultra shallow trench isolation is positioned between the source and the gate well;

a gate insulator directly overlying the first ultra shallow trench isolation, wherein the gate insulator is an electrical insulator; and

a USTI gate directly overlying the gate insulator.

2. The integrated circuit of claim 1 further comprising a gate well silicide directly contacting the gate well.

3. The integrated circuit of claim 2 further comprising:

a primary gate contact directly contacting the gate well silicide.

4. The integrated circuit of claim 1 further comprising:

a second ultra shallow trench isolation extending into the active layer, wherein a second portion of the active layer is positioned between the second ultra shallow trench isolation and the buried insulator layer, and wherein the gate well is positioned between the first ultra shallow trench isolation and the second ultra shallow trench isolation.

5. The integrated circuit of claim 4 further comprising:

a drain defined within the active layer, wherein the second ultra shallow trench isolation is positioned between the drain and the gate well.

6. The integrated circuit of claim 4 further comprising:

a drain defined within the active layer;

a first deep trench isolation extending through the active layer and contacting the buried insulator layer, wherein the source directly contacts the first deep trench isolation and the first ultra shallow trench isolation; and

a second deep trench isolation extending through the active layer and contacting the buried insulator layer; wherein the drain directly contacts the second deep trench isolation and the second ultra shallow trench isolation.

7. The integrated circuit of claim 6 wherein the active layer comprises an N well positioned between the first deep trench isolation and the second deep trench isolation, wherein the gate well overlies the N well.

8. The integrated circuit of claim 1 wherein the source comprises “N” type conductivity determining ions.

9. The integrated circuit of claim 8 wherein the gate well comprises “P” type conductivity determining ions.

10. The integrated circuit of claim 1 further comprising:

a gate well silicide directly contacting the gate well;

a primary gate contact directly contacting the gate well silicide; and wherein a source distance between the source and the gate well is about 0.2 nanometers or less.

11. The integrated circuit of claim 1 further comprising:

a source silicide overlying the source, wherein the source silicide directly contacts the source; and

a source contact directly contacting the source silicide.

12. The integrated circuit of claim 1 wherein the gate insulator directly overlying the first ultra shallow trench isolation is a different component than the first ultra shallow trench isolation.

13. The integrated circuit of claim 1 further comprising:

a spacer adjacent to the USTI gate;

a source contact in electrical communication with the source;

a primary gate contact in electrical communication with the gate well; and

an interlayer dielectric, wherein the interlayer dielectric is positioned between the source contact and the spacer, and wherein the interlayer dielectric is positioned between the gate contact and the spacer.

14. An integrated circuit comprising:

an SOI substrate comprising an active layer, a buried insulator layer, and a handle layer, wherein the active layer overlies the buried insulator layer, and the buried insulator layer overlies the handle layer;

a first deep trench isolation extending through the active layer and contacting the buried insulator layer;

a second deep trench isolation extending through the active layer and contacting the buried insulator layer;

a source positioned between the first deep trench isolation and the second deep trench isolation, wherein the source directly contacts the first deep trench isolation;

a drain positioned between the first deep trench isolation and the second deep trench isolation, wherein the drain directly contacts the second deep trench isolation;

a gate well positioned between the source and the drain;

a first ultra shallow trench isolation extending into the active layer, wherein a first portion of the active layer is positioned between the first ultra shallow trench isolation and the buried insulator layer, and wherein the first ultra shallow trench isolation is positioned between the gate well and the source;

a gate insulator directly overlying the first ultra shallow trench isolation, wherein the gate insulator is an electrical insulator; and

a USTI gate directly overlying the gate insulator.

15. The integrated circuit of claim 14 further comprising a gate well silicide directly connected to the gate well.

16. The integrated circuit of claim 15 further comprising:

a primary gate contact directly contacting the gate well silicide.

17. The integrated circuit of claim 14 further comprising:

a spacer adjacent to the USTI gate;

a source contact in electrical communication with the source; and

an interlayer dielectric, wherein the interlayer dielectric is positioned between the source contact and the spacer.

18. The integrated circuit of claim 14 further comprising:

a second ultra shallow trench isolation extending into the active layer, wherein a second portion of the active layer is positioned between the second ultra shallow trench isolation and the buried insulator layer, and wherein the second ultra shallow trench isolation is positioned between the gate well and the drain.

19. The integrated circuit of claim 14 wherein:

the gate insulator directly overlying the first ultra shallow trench isolation is a different component than the first ultra shallow trench isolation.

20. A method of producing an integrated circuit comprising:

forming a first ultra shallow trench isolation in an active layer of an SOI substrate, wherein the SOI substrate comprises a buried insulator layer underlying the active layer, and wherein a first portion of the active layer is positioned between the first ultra shallow trench isolation and the buried insulator layer;

forming a source adjacent to the first ultra shallow trench isolation;

forming a gate well adjacent to the first ultra shallow trench isolation such that the first ultra shallow trench isolation is positioned between the source and the gate well;

forming a gate well silicide directly contacting the gate well;

forming a primary gate contact directly contacting the gate well silicide;

forming a gate insulator directly overlying the first ultra shallow trench isolation, wherein the gate insulator is an electrical insulator; and

forming a USTI gate directly overlying the gate insulator.