IP Library › Granted Patent US 9,889,650
Granted Patent B2
US 9,889,650 · App. 15/155,590 · Granted Feb 13, 2018

Liquid ejecting head, ejecting element substrate and liquid ejecting apparatus

Inventors: Takuma Kodoi (Kawasaki, JP); Keiji Tomizawa (Yokohama, JP)
Assignee: Canon Kabushiki Kaisha
B41J2/14112B41J2/1404B41J2/145
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Quick Facts
Patent No.
US 9,889,650
App. No.
15/155,590
Granted
Feb 13, 2018
Kind
B2
Abstract

There are provided a liquid ejecting head, an ejecting element substrate and a liquid ejecting apparatus that can suppress degradation in print quality. Therefore in an ejecting element substrate arranged the closest to the center of a support member, a flow resistance of a flow passage corresponding to an ejection opening of an ejection opening array arranged the closest to the center of the ejecting element substrate is made high.

Claims (8)

1. A liquid ejecting head comprising:

a heat generating element array in which heat generating elements to generate heat energy that is used to eject a liquid are arranged in a predetermined direction;

a pressure chamber that includes one of the heat generating elements therein; and

a flow passage of which one end communicates with the pressure chamber, and of which the other end communicates with a common liquid chamber,

wherein an amount per liquid droplet ejected by the heat generating elements included in the heat generating element array is equal, and

wherein a flow resistance of the flow passage which communicates with a heat generating element disposed in a central portion in the predetermined direction among the heat generating elements included in the heat generating element array is higher than a flow resistance of a flow passage which communicates with a heat generating element disposed in an end portion.

2. The liquid ejecting head according to claim 1 ,

further comprising an element substrate on which the heat generating elements are formed, the element substrate having a plurality of the heat generating element arrays in parallel in a direction intersecting with the predetermined direction, wherein a flow resistance of flow channels included in the heat generating element array which are disposed in a central portion of the element substrate is higher than a flow resistance of flow channels included in the heat generating element array arranged on an end side of the element substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2016
From: KODOI, TAKUMA; TOMIZAWA, KEIJI
To: CANON KABUSHIKI KAISHA
Reel/Frame 039504/0414 →
Priority Claims (1)
JP 2015-104876 · May 22, 2015 · national
Continuity (1)
Related Publication 20160339700A1 · Nov 24, 2016