IP Library Granted Patent US 9,653,499
Granted Patent B2
US 9,653,499 · App. 15/156,564 · Granted May 16, 2017

Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus

Inventor: Hiroaki Ishiwata (Tokyo, JP)
Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
H01L27/14612H01L27/14603H01L27/14605H01L27/14621H01L27/14627H01L27/14641H01L27/14645H01L27/14685H04N5/2253H04N5/2254H04N5/347H04N5/357H04N5/3696H04N5/3745H04N5/37457H04N9/045
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,653,499
App. No.
15/156,564
Granted
May 16, 2017
Kind
B2
Abstract

A solid-state imaging device including an imaging area where a plurality of unit pixels are disposed to capture a color image, wherein each of the unit pixels includes: a plurality of photoelectric conversion portions; a plurality of transfer gates, each of which is disposed in each of the photoelectric conversion portions to transfer signal charges from the photoelectric conversion portion; and a floating diffusion to which the signal charges are transferred from the plurality of the photoelectric conversion portions by the plurality of the transfer gates, wherein the plurality of the photoelectric conversion portions receive light of the same color to generate the signal charges, and wherein the signal charges transferred from the plurality of the photoelectric conversion portions to the floating diffusion are added to be output as an electrical signal.

Claims (21)

1. An imaging device comprising a semiconductor substrate and a plurality of unit pixels, wherein each of the unit pixels comprises:

a first photoelectric conversion element;

a second photoelectric conversion element;

a first floating diffusion region;

a second floating diffusion region;

a first transfer gate disposed between the first photoelectric conversion element and the first floating diffusion;

a second transfer gate disposed between the second photoelectric conversion element and the second floating diffusion;

a signal line;

an amplification transistor connected to output an electrical signal to a column circuit via the signal line; and

a wire line,

wherein,

the signal line extends along a first direction,

the first floating diffusion region and second floating diffusion region are arranged along a second direction that is different from the first direction,

the first floating diffusion region and the second floating diffusion region are formed in the semiconductor substrate, and

a gate of the amplification transistor is electrically connected to the first floating diffusion region and the second floating diffusion region via the wire line.

2. The imaging device of claim 1 , wherein each of the unit pixels further comprises:

a third photoelectric conversion element; and

a fourth photoelectric conversion element.

3. The imaging device of claim 2 , wherein each of the unit pixels further comprises:

a third transfer gate disposed between the third photoelectric conversion element and the first floating diffusion region; and

a fourth transfer gate disposed between the fourth photoelectric conversion element and the second floating diffusion region.

Priority Claims (1)
JP 2010-107265 · May 7, 2010 · national
Continuity (3)
Continuation 14495318 · Sep 24, 2014
Continuation 13085676 · Apr 13, 2011
Related Publication 20160260758A1 · Sep 8, 2016