IP Library Granted Patent US 10,267,483
Granted Patent B2
US 10,267,483 · App. 15/157,897 · Granted Apr 23, 2019

Light-emitting device

Inventors: Seiji Kiyota (Itano-gun, JP); Kazuma Kozuru (Anan-shi, JP); Eiichiro Okahisa (Tokushima, JP)
Assignee: NICHIA CORPORATION
F21V5/007F21V5/04G02B3/0056G02B19/0057H01S5/0071H01S5/405H01S5/4025
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Quick Facts
Patent No.
US 10,267,483
App. No.
15/157,897
Filed
May 18, 2016
Granted
Apr 23, 2019
Kind
B2
Art Unit
2875
USPC
362/240
Abstract

A light-emitting device includes a substrate; a lens array having a plurality of lens sections in a matrix pattern; and a plurality of semiconductor laser elements disposed on the substrate. Each of the semiconductor laser elements emits a respective laser beam, each laser beam having a beam shape with a greater width in a column direction than in a row direction on a light incident surface of each respective lens section. The lens sections have an inter-vertex distance in the row direction that is smaller than both (i) a maximum outer diameter of each of the lens sections, and (ii) an inter-vertex distance in the column direction. A curvature of the lens sections in the row direction is the same as a curvature of the lens sections in the column direction.

Claims (52)

1. A light-emitting device comprising:

a substrate;

a lens array having a plurality of lens sections in a matrix pattern; and

a plurality of semiconductor laser elements disposed on the substrate,

wherein each semiconductor laser element corresponds to a single one of the lens sections,

wherein each of the semiconductor laser elements emits a respective laser beam, each laser beam having a beam shape with a greater width in a column direction than in a row direction on a light incident surface of each respective lens section,

wherein an inter-vertex distance between lens sections corresponding to adjacent semiconductor laser elements in the row direction is smaller than both (i) a maximum outer diameter of each of the lens sections, and (ii) an inter-vertex distance between lens sections corresponding to adjacent semiconductor laser elements in the column direction, and

wherein, in each lens section, a curvature of the lens section in the row direction is the same as a curvature of the lens section in the column direction.

2. The light-emitting device according to claim 1 , further comprising one or more mirrors disposed on the substrate and configured to reflect emission light of at least one of the semiconductor laser elements toward at least one of the lens sections.

3. The light-emitting device according to claim 2 , wherein the one or more mirrors is positioned directly below a vertex of at least one of the lens sections.

4. The light-emitting device according to claim 1 , wherein at least a part of each of the lens sections has an aspherical curved surface.

5. The light-emitting device according to claim 4 , wherein at least a part of an outer edge of each of the lens sections has an arc shape in a plan view.

6. The light-emitting device according to claim 1 , further comprising a sealing member between the substrate and the lens array.

7. The light-emitting device according to claim 2 , further comprising a sealing member between the substrate and the lens array.

8. The light-emitting device according to claim 7 , wherein:

the lens array further includes a connecting part that connects a plurality of the lens sections with one another, the lens array being fixed to the sealing member by an adhesive at the connecting part, and

a space is located between the lens array and the sealing member, the space being open to an area outside the light-emitting device.

9. The light-emitting device according to claim 8 , wherein:

the sealing member includes a recess that is recessed toward a region at which the semiconductor laser elements are arranged on the substrate, and

in a plan view, a part of an outer edge of the lens array is arranged so as to be positioned at an inner side of the recess, and

the lens array is fixed to the sealing member by an adhesive at an outer side of the recess.

10. The light-emitting device according to claim 8 , wherein:

the sealing member includes a recess that is recessed toward a region at which the semiconductor laser elements are arranged on the substrate, and

the lens array includes a through-hole that, in a plan view, is located at an inner side of the recess, and

the lens array is fixed to the sealing member by an adhesive at an outer side of the recess in a plan view.

11. The light-emitting device according to claim 9 , wherein the number of the semiconductor laser elements in the row direction is larger than the number of the semiconductor laser elements in the column direction.

12. The light-emitting device according to claim 2 , wherein the one or more mirrors comprise a plurality of mirrors, including a mirror corresponding to each of the plurality of lens sections.

13. The light-emitting device according to claim 7 , wherein the sealing member includes a plurality of window parts, including a window part corresponding to each of the semiconductor laser elements.

14. The light-emitting device according to claim 1 , wherein:

in the row direction, a relay member is disposed between adjacent semiconductor laser elements, and

the adjacent semiconductor laser elements are electrically connected to each other by wires via the relay member.

15. A light-emitting device comprising:

a substrate;

a plurality of lens arrays arranged in a column direction, each lens array having a plurality of lens sections in a row direction; and

a plurality of semiconductor laser elements disposed on the substrate,

wherein each semiconductor laser element corresponds to a single one of the lens sections,

wherein each of the semiconductor laser elements emits a respective laser beam, each laser beam having a beam shape with a greater width in a column direction than in a row direction on a light incident surface of each respective lens section,

wherein an inter-vertex distance between lens sections corresponding to adjacent semiconductor laser elements in the row direction that is smaller than both (i) a maximum outer diameter of each of the lens sections, and (ii) an inter-vertex distance between lens sections corresponding to adjacent semiconductor laser elements in the column direction, and

wherein, in each lens section, a curvature of the lens section in the row direction is the same as a curvature of the lens section in the column direction.

16. The light-emitting device according to claim 15 , further comprising one or more mirrors disposed on the substrate and configured to reflect emission light of at least one of the semiconductor laser elements toward at least one of the lens sections.

17. The light-emitting device according to claim 16 , further comprising a sealing member between the substrate and the lens arrays.

18. The light-emitting device according to claim 17 , wherein:

each lens array further includes a connecting part that connects a plurality of the lens sections with one another, each lens array being fixed to the sealing member by an adhesive at the connecting part, and

a space is located between each lens array and the sealing member, the space being open to an area outside the light-emitting device.

19. The light-emitting device according to claim 18 , wherein:

the sealing member includes a recess that is recessed toward a region at which the semiconductor laser elements are arranged on the substrate, and

in a plan view, a part of an outer edge of each lens array is arranged so as to be positioned at an inner side of the recess, and

each lens array is fixed to the sealing member by an adhesive at an outer side of the recess.

20. The light-emitting device according to claim 18 , wherein:

the sealing member includes a recess that is recessed toward a region at which the semiconductor laser elements are arranged on the substrate, and

each lens array includes a through-hole that, in a plan view, is located at an inner side of the recess, and

each lens array is fixed to the sealing member by an adhesive at an outer side of the recess in a plan view.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 18, 2016
From: KIYOTA, SEIJI; KOZURU, KAZUMA; OKAHISA, EIICHIRO
To: NICHIA CORPORATION
Reel/Frame 038635/0776 →
Priority Claims (2)
JP 2015-103264 · May 20, 2015 · national
JP 2016-051530 · Mar 15, 2016 · national
Continuity (1)
Related Publication 20160341395A1 · Nov 24, 2016
Cited By (1)
US 12,493,234