IP Library Granted Patent US 10,443,941
Granted Patent B2
US 10,443,941 · App. 15/158,358 · Granted Oct 15, 2019

Light annealing in a cooling chamber of a firing furnace

Inventors: Daniel M. Ruf (Minneapolis, MN); Brandon Oakes Long (Rosemount, MN); Prathna Ung (Rosemount, MN); Erik Richard Anderson (Lakeville, MN)
Assignee: Illinois Tool Works Inc.
F27D9/00F27B9/14F27D11/00H01L21/67098H01L21/67109H01L21/67115H01L21/67173H01L31/1864F27B2009/124Y02E10/50Y02P70/521
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,443,941
App. No.
15/158,358
Granted
Oct 15, 2019
Kind
B2
Abstract

One embodiment is directed to an apparatus comprising a firing furnace comprising a heating chamber configured to fire a metallization layer of photovoltaic devices and a cooling chamber configured to cool the photovoltaic devices that have been heated by the heating chamber. The cooling chamber comprises lights to light anneal the photovoltaic devices to reduce light induced degradation as the photovoltaic devices are cooled in the cooling chamber. The cooling chamber of the firing furnace is configured to use residual heat from heating performed in the heating chamber of the firing furnace as heat for the light annealing of the photovoltaic devices. Light annealing is not performed in the heating chamber of the firing furnace.

Claims (27)

1. An apparatus comprising:

a firing furnace comprising: a heating chamber configured to fire a metallization layer of photovoltaic devices and a cooling chamber configured to cool the photovoltaic devices that have been heated by the heating chamber;

wherein the cooling chamber comprises light emitting diodes (LEDs) configured to light anneal the photovoltaic devices to reduce light induced degradation as the photovoltaic devices are cooled in the cooling chamber, wherein the LEDs comprise a plurality of zones within the cooling chamber, each zone comprising a subset of the LEDs, wherein an intensity of light output by the LEDs of each of the zones differs from an intensity of light output by the LEDs of at least one of the other zones; and

wherein the cooling chamber of the firing furnace is configured to use residual heat from heating performed in the heating chamber of the firing furnace as heat for the light annealing of the photovoltaic devices; and

wherein light annealing is not performed in the heating chamber of the firing furnace.

2. The apparatus of claim 1 , wherein the cooling chamber of the firing furnace is configured to light anneal the photovoltaic devices for between 5 seconds and 45 seconds.

3. The apparatus of claim 1 , wherein the cooling chamber of the firing furnace is configured to light anneal the photovoltaic devices while each of the photovoltaic devices is at a temperature between 700° C. and 240° C.

4. The apparatus of claim 1 , wherein the LEDs comprise a plurality of zones within the cooling chamber, each zone comprising a subset of the LEDs, wherein an intensity of light output by the LEDs of each of the zones differs from an intensity of light output by the LEDs of at least one of the other zones.

5. The apparatus of claim 1 , wherein an intensity of light output by the light emitting diodes is adjustable.

6. The apparatus of claim 1 , wherein an intensity of light output by the LEDs to light anneal is in a range of between 3,000 Watts/meters 2 and 48,000 Watts/meter 2 .

7. The apparatus of claim 1 , wherein the LEDs emit light in the visible spectrum.

8. The apparatus of claim 1 , wherein the LEDs emit light having a wavelength between about 300 nanometers and about 900 nanometers.

9. The apparatus of claim 1 , wherein the LEDs are mounted to a water-cooled plate.

10. The apparatus of claim 9 , wherein the water-cooled plate is configured to enable air to pass around or through the water-cooled plate.

11. The apparatus of claim 1 , wherein the cooling chamber comprises first and second cooling sections, wherein the first section is configured to radiantly cool the photovoltaic devices and the second section is configured to convectively cool the photovoltaic devices.

12. The apparatus of claim 1 , wherein the heating chamber comprises a first and second heating sections, wherein the first heating section is configured to burn out a binder used in the metallization layer of the photovoltaic devices and the second heating section is configured to fire the metallization layer of the photovoltaic devices.

13. The apparatus of claim 1 , further comprising a drying furnace configured to dry the metallization layers of the photovoltaic devices prior to being conveyed to the firing furnace.

14. The apparatus of claim 1 , wherein the cooling chamber is configured to light anneal the photovoltaic devices in ambient air.

15. The apparatus of claim 1 , wherein the cooling chamber comprises a first cooling section configured to cool the photovoltaic devices via radiant cooling and a second cooling section configured to cool the photovoltaic devices via convection cooling.

16. The apparatus of claim 15 , wherein the LEDs are positioned in at least one of the first cooling section or the second cooling section.

17. A method of co-firing comprising:

heating photovoltaic devices in a heating chamber of a firing furnace to co-fire metallization layers of the photovoltaic devices; and

cooling the photovoltaic devices that have been heated by the heating chamber in a cooling chamber of the firing furnace, while light annealing the photovoltaic devices in the cooling chamber, using light emitting diodes (LEDs) located in the cooling chamber, to reduce the effects of light-induced degradation using residual heat from heating the photovoltaic devices in the heating chamber as heat for light annealing, wherein the LEDs comprise a plurality of zones within the cooling chamber, each zone comprising a subset of the LEDs, wherein an intensity of light output by the LEDs of each of the zones differs from an intensity of light output by the LEDs of at least one of the other zones; and

wherein light annealing is not performed in the heating chamber of the firing furnace.

18. The method of claim 17 , wherein the cooling chamber of the firing furnace is configured to light anneal the photovoltaic devices for between 5 seconds and 45 seconds.

19. The method of claim 17 , wherein light annealing the photovoltaic devices to reduce the effects of light-induced degradation comprises light annealing the photovoltaic devices to reduce the effects of light-induced degradation while the photovoltaic devices are at a temperature between 700° C. and 240° C.

20. The method of claim 17 , wherein light annealing the photovoltaic devices to reduce the effects of light-induced degradation comprises light annealing the photovoltaic devices to reduce the effects of light-induced degradation using light emitting diodes positioned within the cooling chamber of the firing furnace.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2016
From: DESPATCH INDUSTRIES LIMITED PARTNERSHIP
To: ILLINOIS TOOL WORKS INC.
Reel/Frame 040346/0914 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 18, 2016
From: RUF, DANIEL M.; LONG, BRANDON OAKES; UNG, PRATHNA; ANDERSON, ERIK RICHARD
To: DESPATCH INDUSTRIES LIMITED PARTNERSHIP
Reel/Frame 038638/0882 →
Continuity (2)
Provisional Application 62164235 · May 20, 2015
Related Publication 20160341479A1 · Nov 24, 2016