Device metrology targets and methods
Metrology methods and targets are provided, that expand metrological procedures beyond current technologies into multi-layered targets, quasi-periodic targets and device-like targets, without having to introduce offsets along the critical direction of the device design. Several models are disclosed for deriving metrology data such as overlays from multi-layered target and corresponding configurations of targets are provided to enable such measurements. Quasi-periodic targets which are based on device patterns are shown to improve the similarity between target and device designs, and the filling of the surroundings of targets and target elements with patterns which are based on device patterns improve process compatibility. Offsets are introduced only in non-critical direction and/or sensitivity is calibrated to enable, together with the solutions for multi-layer measurements and quasi-periodic target measurements, direct device optical metrology measurements.
1. A method of directly measuring metrology parameters on devices, the method comprising:
measuring at least one metrology parameter from at least one portion of a device design selected to have a plurality of irregularly repeating units, wherein the irregularly repeating units include specified features including different structural elements, along at least one direction of the at least one portion; and
calibrating sensitivity using at least one of: an intensity of diffraction orders orthogonal to the at least one direction; introduced offsets along a non-critical direction, wherein the non-critical direction comprises a direction in the device tolerable of offsets greater than 1 nm without device malfunction; target cells with introduced offsets adjacent to the at least one portion; and at least one sensitivity calibration target,
wherein the measuring is carried out scatterometrically on a plurality of targets to provide layer-specific metrology parameters, at least one of the targets being part of the at least one portion having N>2 overlapping layers, wherein the plurality of targets comprises at least one of: N cell pairs, each pair having opposite offsets at a different layer; N cells with selected intended offsets; N or fewer cells with selected intended offsets configured to utilize pupil information; and N-cell calibration targets between N−1 and two overlay targets, wherein N is an integer number.
2. The method recited in claim 1 , wherein the measuring is of M≥N differential signals and comprises calculating the at least one metrology parameter therefrom using a set of corresponding M equations relating the differential signals to the intended offsets and the at least one metrology parameter.
3. The method recited in claim 2 , wherein the measuring of signals is carried out sequentially for consecutive layers of the targets.
4. The method recited in claim 2 , wherein the measuring of M signals is carried out simultaneously for the N layers, by carrying out the measuring at a pupil plane with respect to the targets and using measurements of a plurality of pixel positions at the pupil plane.
5. The method recited in claim 1 , wherein the introduced offsets are orthogonal to a critical direction of the at least one portion of the device and wherein the measuring the at least one metrology parameter is carried out without introducing an intended offset along the critical direction of the at least one portion.
6. The method recited in claim 5 , wherein a measurement direction of the adjacent target cells is perpendicular to the critical direction portion of the at least one portion.
7. The method recited in claim 1 , wherein the measuring the at least one metrology parameter further comprises estimating noise resulting from irregularities of the at least one portion of the device.
8. The method recited in claim 7 , wherein the at least one portion comprises a plurality of device design portions selected to yield a derived pupil plane image from respective pupil images of the plurality of portions.
9. The method recited in claim 1 , further comprising deriving at least one device-like pattern from a respective at least one device design and designing at least one of the targets to have regions between periodic structures thereof at least partially filled by the at least one device-like pattern.
10. The method recited in claim 9 , further comprising designing the at least one target to have sub-regions between elements of the periodic structures at least partially filled by the at least one device-like pattern.
11. The method recited in claim 1 , further comprising selecting parameters of at least one of the adjacent target cells and the sensitivity calibration targets to reduce inaccuracy.
12. The method recited in claim 1 , wherein the at least one sensitivity calibration target is on one or more scribe lines.
13. The method recited in claim 1 , wherein the targets comprise N cell pairs, each pair with opposite offsets at a different layer, at least one of the cells being part of the at least one portion.
14. The method recited in claim 1 , wherein the targets comprise N cells with selected intended offsets, at least one of the cells being part of the at least one portion and having a zero-intended offset.
15. The method recited in claim 1 , wherein the multi-layered targets comprise N or fewer cells with selected intended offsets configured to utilize pupil information, at least one of the cells being part of the at least one portion and having a zero-intended offset.
16. The method recited in claim 1 , wherein the targets comprise N-cell calibration targets between N−1 and two overlay targets, at least one of the overlay targets being part of the at least one portion and having a zero-intended offset.
17. The method recited in claim 1 , wherein the specified features comprise a least one set of lines and cuts.
18. A metrology target comprising:
at least one portion of a device design having N>2 overlapping layers, wherein the at least one portion includes a plurality of irregularly repeating units, wherein the irregularly repeating units include specified features including different structural elements, along at least one direction of the portion, wherein N is an integer number, and
a plurality of additional cells comprising at least multi-layer cells and sensitivity calibration cells.
19. The metrology target of claim 18 , wherein the sensitivity calibration cells comprise at least two target cells with introduced offsets in an area adjacent to the at least a portion of the device.
20. The metrology target of claim 19 , wherein the introduced offsets are orthogonal to a critical direction of the portion of the device and wherein the at least one portion has no intended offset along the critical direction thereof, wherein a non-critical direction comprises a direction in the device tolerable of offsets greater than 1 nm without device malfunction.
21. The metrology target of claim 19 , wherein the parameters of at least one of the adjacent target cells and the sensitivity calibration cells are selected to reduce inaccuracy.
22. The metrology target of claim 18 , wherein the multi-layer cells comprise at least one of: N cell pairs, each pair having opposite offsets at a different layer; N cells with selected intended offsets; Nor fewer cells with selected intended offsets configured to utilize pupil information; and N-cell calibration targets alongside between N−1 and two overlay targets.
23. The metrology target of claim 18 , wherein the sensitivity calibration cells are on scribe lines.
24. The metrology target of claim 18 , wherein the at least one portion comprises a plurality of device design portions selected to yield a derived pupil plane image from respective pupil images of the plurality of device design portions.
25. The metrology target of claim 18 , wherein the specified features comprise a least one set of lines and cuts.