Flat no-lead packages with electroplated edges

Inventors: Reynaldo Corpuz Javier (Plano, TX); Alok Kumar Lohia (Dallas, TX); Andy Quang Tran (Grand Prairie, TX)

Assignee: TEXAS INSTRUMENTS INCORPORATED

H01L23/49548 H01L23/293 H01L23/3675 H01L23/49579 H01L24/09 H01L24/29 H01L24/46 H01L2224/2908 H01L2224/29144 H01L2224/29155 H01L2224/29164 H01L2224/48091 H01L2924/01029

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Quick Facts

Patent No.: US 9,576,886
App. No.: 15/162,807
Granted: Feb 21, 2017
Kind: B1

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Abstract

A lead frame sheet of flat no-lead lead frames having a semiconductor die on a die pad, terminals, and plastic encapsulation except on a back side of the sheet to provide an exposed thermal die pad, exposed side walls, and exposed back sides of the terminals. A solder wetable metal or metal alloy plating layer is on the back side and on the exposed the walls of the terminals. The exposed thermal pad and the back side of the terminals each include a contact region which lacks the plating layer.

Claims (12)

1. A packaged semiconductor flat no-lead device, comprising:

a flat no-lead lead frame having a semiconductor die including bond pads thereon mounted on a die pad of said lead frame with bond wires between said bond pads and terminals of said lead frame, and plastic encapsulation except on a back side of said lead frame to expose said die pad to provide an exposed thermal die pad and to expose a back side of said terminals and side walls of said terminals;

a solder wetable metal or metal alloy plating layer on said back side and on said exposed side walls of said terminals;

wherein said exposed thermal die pad and said back side of said terminals each include a contact region which lacks said plating layer.

2. The packaged semiconductor device of claim 1 , wherein said plastic encapsulation is at a first width on a top portion of said packaged semiconductor device and at a second width at a bottom of said packaged semiconductor device, and

wherein said first width is greater than said second width to provide a side wall step along an edge of said plastic encapsulation.

3. The packaged semiconductor device of claim 1 , wherein said lead frame comprises a quad-flat no-lead (QFN) or a dual-flat no-lead (DFN).

4. The packaged semiconductor device of claim 1 , wherein said lead frame comprises copper or a copper alloy.

5. The packaged semiconductor device of claim 1 , wherein said plating layer comprises a stack of a plurality of different ones of said plating layer.

6. The packaged semiconductor device of claim 5 ,

wherein said stack comprises nickel (Ni)-palladium (Pd)-gold (Au).

7. The packaged semiconductor device of claim 1 , wherein said contact region is 0.8 mil (0.0206 mm) to 5 mil (0.127 mm) in diameter.

Continuity (1)

Division 14842460 · Sep 1, 2015