Apparatus and method for treating substrate
An apparatus for treating a substrate includes an injecting member having a first nozzle configured to supply a first chemical to the substrate that is mounted on the supporting unit, and a second nozzle configured to supply a second chemical, which is different from the first chemical, to the substrate that is mounted on the supporting unit, and a controller configured to supply the first chemical before supplying the second chemicals and to control the first chemical, which is variable according to a type of thin film on the substrate mounted on the supporting unit, to be supplied.
1. Substrate treating equipment, comprising:
an index module including at least one load portion and a transfer frame;
a process execution module including a buffer unit, a transfer chamber, and at least one processing chamber; and
an apparatus for treating a substrate, the apparatus disposed within the at least one processing chamber of the process execution module and including:
a housing configured to provide an internal space for a substrate treating process;
a supporting unit on that the substrate is mounted in the housing;
an injecting member having a first nozzle configured to supply a pre-treatment chemical to the substrate that is mounted on the supporting unit, and a second nozzle configured to supply a treatment chemical, which is different from the pre-treatment chemical, to the substrate that is mounted on the supporting unit, wherein the first nozzle is connected to containers storing a plurality of first chemicals, and the second nozzle is connected to containers storing a plurality of second chemicals; and
a controller configured to supply the pre-treatment chemical before supplying the treatment chemical and to select, based on a type of a thin film on the substrate, the pre-treatment chemical among the plurality of first chemicals and the treatment chemical among the plurality of second chemicals to reduce friction between the substrate and the pre-treatment or treatment chemical.
2. The substrate treating equipment of claim 1 , wherein the controller is configured to select the pre-treatment chemical, which contains isopropyl alcohol, if the thin film is a hydrophobic film.
3. The substrate treating equipment of claim 1 , wherein the controller is configured to select the pre-treatment chemical, which contains deionized water, if the thin film is a hydrophilic film.