IP Library Granted Patent US 9,865,699
Granted Patent B2
US 9,865,699 · App. 15/166,863 · Granted Jan 9, 2018

Semiconductor device and method of manufacturing the same

Inventors: Daiyu Kondo (Kawasaki, JP); Shintaro Sato (Kawasaki, JP)
Assignee: FUJITSU LIMITED
H01L29/66045H01L21/0228H01L21/0262H01L21/02164H01L21/02178H01L21/02181H01L21/02282H01L21/02381H01L21/02488H01L21/02491H01L21/02502H01L21/02527H01L21/02645H01L21/043H01L23/53276H01L29/1606H01L29/66015H01L29/66742H01L29/778H01L29/78648H01L29/78696H01L29/78645H01L29/78684H01L2924/0002Y10S977/734
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Quick Facts
Patent No.
US 9,865,699
App. No.
15/166,863
Granted
Jan 9, 2018
Kind
B2
Abstract

A semiconductor device including a graphene layer and a method of manufacturing the same are disclosed. A method in which graphene is grown on a catalyst metal by a chemical vapor deposition or the like is known. However, the graphene cannot be used as a channel, since the graphene is in contact with the catalyst metal, which is conductive. There is disclosed a method in which a catalyst film ( 2 ) is formed over a substrate ( 1 ), a graphene layer ( 3 ) is grown originating from the catalyst film ( 2 ), an electrode ( 4 ) in contact with the graphene layer ( 3 ) is formed, and the catalyst film ( 2 ) is removed.

Claims (15)

1. A semiconductor device, comprising:

a source electrode and a drain electrode;

a channel including a graphene layer suspended by the source electrode and the drain electrode;

a gate electrode which changes a band structure of the graphene layer; and

a gate insulation film formed between the gate electrode and the channel, wherein

the graphene layer extends in a direction apart from the channel over the source electrode and the drain electrode, and the channel is thinner than a portion of the graphene layer extending in the direction apart from the channel over the source electrode and the drain electrode.

2. The semiconductor device according to claim 1 , wherein

the source electrode and the drain electrode are formed over an insulator, and

the channel is formed apart from the insulator.

3. The semiconductor device according to claim 1 , further comprising:

a first wiring including the portion of the graphene layer extending in the direction apart from the channel over the source electrode; and

a second wiring including the portion of the graphene layer extending in the direction apart from the channel over the drain electrode.

4. The semiconductor device according to claim 3 , further comprising:

a first electrode connected to the first wiring, and

a second electrode connected to the second wiring.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 17, 2025
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 073964/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2024
From: FUJITSU LIMITED
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 069454/0333 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2016
From: KONDO, DAIYU; SATO, SHINTARO
To: FUJITSU LIMITED
Reel/Frame 038737/0410 →
Continuity (4)
Division 14563405 · Dec 8, 2014
Division 13453125 · Apr 23, 2012
Continuation PCTJP2009069383 · Nov 13, 2009
Related Publication 20160284813A1 · Sep 29, 2016