Semiconductor device package and methods of manufacture thereof
A semiconductor device package and method of manufacturing is provided. An interconnect pre-assembly includes a first frame having a plurality of first signal conduits affixed to a second frame having a plurality of second signal conduits embedded in a second substrate forming an electrical coupling between one or more first signal conduits and one or more of the second signal conduits. One or more conductive balls are connected to the one or more second signal conduits. The interconnect pre-assembly is placed over a semiconductor die, having at least one of the first conductive balls disposed over the semiconductor die. An encapsulant encapsulates the interconnect pre-assembly, the semiconductor die, and the one or more conductive balls, such that a portion of the one or more first conductive balls is exposed at a top surface of the encapsulant.
1. A method of manufacturing a packaged semiconductor device, the method comprising:
providing a stacked interconnect pre-assembly including:
a first frame including a plurality of first signal conduits embedded in a first substrate,
a second frame including a plurality of second signal conduits embedded in a second substrate, the second frame affixed to the first frame such that an electrical coupling is formed between one or more first signal conduits and one or more of the second signal conduits, and
one or more first conductive balls electrically connected to the one or more second signal conduits;
forming an assembly by placing a semiconductor die over a first area of a carrier and placing the stacked interconnect pre-assembly over a second area of the carrier such that at least one of the first conductive balls is over the semiconductor die;
encapsulating the assembly with a molding compound;
exposing a portion of the one or more first conductive balls, the exposed portion providing electrical contact to the stacked interconnect pre-assembly; and
removing the carrier to expose a first surface of the semiconductor die and a first surface of the first substrate.
2. The method of claim 1 , wherein placing the stacked interconnect pre-assembly over the second area further comprises positioning an opening formed in the first frame such that the semiconductor die is located within the opening.
3. The method of claim 1 , wherein the providing the stacked interconnect pre-assembly further comprises one or more second conductive balls disposed between the first frame and the second frame, electrically coupling the one or more of the first signal conduits with the one or more second signal conduits.
4. The method of claim 1 , further comprising:
forming an insulating layer on the exposed first surface of the semiconductor die and the first surface of the first substrate;
patterning and etching the insulating layer to expose one or more bond pads at the first surface of the semiconductor die and to expose conductive surface at a bottom end of the one or more first signal conduits at the first surface of the first substrate; and
forming a conductive layer to electrically connect at least one of the exposed one or more bond pads with at least one of the exposed conductive surfaces.
5. The method of claim 4 , wherein forming a conductive layer to electrically connect at least one of the exposed one or more bond pads with at least one of the exposed conductive surfaces provides a conductive path electrically connecting the exposed portion of the one or more first conductive balls with the at least one of the exposed one or more bond pads.
6. The method of claim 5 , wherein the at least one of the first conductive balls over the semiconductor die is electrically coupled to the at least one of the exposed one or more bond pads via one or more first signal conduits and one or more of the second signal conduits.
7. The method of claim 1 , wherein exposing the portion of the one or more first conductive balls comprises grinding the molding compound to a predetermined depth.
8. The method of claim 1 , wherein exposing the portion of the one or more first conductive balls comprises forming an area sufficient to provide a coupling to a second packaged device attached at a top surface of the packaged semiconductor device.
9. The method of claim 1 , wherein the one or more first conductive balls comprises a solder ball.
10. A method of manufacturing a packaged semiconductor device, the method comprising:
providing a stacked interconnect pre-assembly including:
a first frame including a plurality of first signal conduits embedded in a first substrate and extending from a first major surface of the first substrate to a second major surface of the first substrate, the first frame having an opening,
a second frame including a plurality of second signal conduits embedded in a second substrate and extending from a first major surface of the second substrate to a first interconnect formed on a second major surface of the second substrate, the second frame affixed to the first frame to provide an electrical coupling between the first interconnect and one or more first signal conduits, and
one or more first conductive balls electrically coupled to the first interconnect at the second major surface of the second substrate;
forming an assembly by placing a semiconductor die over a carrier and placing the stacked interconnect pre-assembly over the semiconductor die and the carrier, the semiconductor die disposed within the opening such that at least one of the one or more first conductive balls is over the semiconductor die;
encapsulating the assembly with a molding compound;
exposing a portion of the one or more first conductive balls, the exposed portion providing electrical contact to the stacked interconnect pre-assembly; and
removing the carrier to expose a first major surface of the semiconductor die and the first major surface of the first substrate.
11. The method of claim 10 , wherein the providing the stacked interconnect pre-assembly further comprises one or more second conductive balls disposed between the first frame and the second frame, electrically coupling the one or more of the first signal conduits with the first interconnect.
12. The method of claim 10 , further comprising:
forming an insulating layer on the exposed first major surface of the semiconductor die and the first major surface of the first substrate;
patterning and etching the insulating layer to expose one or more bond pads on the first major surface of the semiconductor die and to expose conductive surface at a bottom end of the one or more first signal conduits on the first major surface of the first substrate; and
forming a conductive layer to electrically connect at least one of the exposed one or more bond pads with at least one of the exposed conductive surfaces.
13. The method of claim 12 , wherein forming a conductive layer to electrically connect at least one of the exposed one or more bond pads with at least one of the exposed conductive surfaces provides a conductive path electrically connecting the exposed portion of the one or more first conductive balls with the at least one of the exposed one or more bond pads.
14. The method of claim 13 , wherein the at least one of the first conductive balls over the semiconductor die is electrically coupled to the at least one of the exposed one or more bond pads via one or more first signal conduits and one or more of the second signal conduits.
15. The method of claim 10 , wherein exposing the portion of the one or more first conductive balls comprises grinding the molding compound to a predetermined depth.
16. The method of claim 10 , wherein exposing the portion of the one or more first conductive balls comprises forming an area sufficient to provide a coupling to a second packaged device attached at a top surface of the packaged semiconductor device.
17. The method of claim 10 , wherein the one or more first conductive balls comprises a solder ball.
18. A packaged semiconductor device comprising:
a stacked interconnect pre-assembly including:
a first frame including a plurality of first signal conduits embedded in a first substrate and extending from a first major surface of the first substrate to a second major surface of the first substrate, the first frame having an opening,
a second frame including a plurality of second signal conduits embedded in a second substrate and extending from a first major surface of the second substrate to a first interconnect formed on a second major surface of the second substrate, the second frame affixed to the first frame forming an electrical connection between the first interconnect and one or more first signal conduits, and
one or more first conductive balls electrically coupled to the first interconnect at the second major surface of the second substrate;
a semiconductor die disposed within the opening of the first frame such that at least one of the first conductive balls is over the semiconductor die; and
an encapsulant encapsulating the semiconductor die and the stacked interconnect pre-assembly, the encapsulant having exposed portion of the one or more first conductive balls at a top surface of the encapsulant and exposed portion of one or more bond pads of the semiconductor die at a bottom surface of the encapsulant.
19. The packaged semiconductor device of claim 18 , wherein the second frame affixed to the first frame further comprises one or more second conductive balls disposed between the first frame and the second frame, electrically coupling one or more of the first signal conduits with one or more second signal conduits.
20. The packaged semiconductor device of claim 18 , further comprising a second interconnect formed below the semiconductor die, the second interconnect to electrically couple the exposed portion of the one or more bond pads of the semiconductor die with one or more of the first signal conduits at the first major surface of the first substrate.