IP Library Granted Patent US 10,612,770
Granted Patent B2
US 10,612,770 · App. 15/171,852 · Granted Apr 7, 2020

Microfluidic-based apparatus and method for vaporization of liquids

Inventors: Carl D. Meinhart (Santa Barbara, CA); Brian Piorek (Santa Barbara, CA); Nicholas B. Judy (Santa Barbara, CA)
Assignee: Numerical Design, Inc.
F22B1/30A24F47/008A61L9/037B01B1/005B05B7/1686F22B1/284F24F6/025F24F6/043H05B3/03A61L2209/135F24F2003/1689
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Quick Facts
Patent No.
US 10,612,770
App. No.
15/171,852
Granted
Apr 7, 2020
Kind
B2
Abstract

Methods and apparatus for vaporizing liquid into the surrounding environment, including directing liquid from a liquid source through an inverse-opal wicking structure to a vaporization port where the vaporization port is formed by a through-hole in a structure connecting a first side of the structure to a second side, with all dimensions ranging from 10 um to 300 um, that is in fluid communication with the liquid source and the surrounding environment so that fluid is transported through the vaporization port between the first and the second side. The methods and apparatus includes plurality of heating elements that may be individually and/or selectively addressable by at least three electrode leads.

Claims (18)

1. A vaporization apparatus that is placed within a surrounding environment and configured to vaporize liquid into the surrounding environment, comprising;

at least one liquid source;

a plurality of vaporization ports that are formed in a planar structure comprising a through hole, the through hole with lateral dimensions ranging from 10 um to 300 um, that is in fluid contact with the liquid source on a first side and a surrounding environment on a second side wherein fluid is transported from the first side of the structure to the second side of the structure through the through hole;

at least one of a plurality of planar heating elements or a continuous planar heating element, comprising thin film resistive elements formed on a top surface of the planar structure and disposed substantially around at least part of each vaporization port;

at least three electrode leads that are in electrical communication with the plurality of thin-film resistive heating elements, selectively powerable to address at least two groups of thin-film heating elements

wherein

the planar structure and the planar heater(s) are microfabricated,

the size of the ports and the planar structure materials are configured to wick liquid from the liquid source to the ports by surface tension, and

heat applied from the heating element, through the planar structure to liquid that is in direct contact with the planar structure, vaporizes the liquid thereby releasing vapor through the vaporization ports into the surrounding environment.

2. The apparatus of claim 1 , wherein five electrode leads are selectively powerable to address four groups of vaporization ports.

3. The apparatus of claim 2 , wherein six electrical connection pads are electrically connected to the five electrode leads and are located in close proximity to the edges of the structure.

4. The apparatus of claim 1 , wherein at least one electrode lead is electrically connected to the at least two addressable groups of resistive heaters.

5. The apparatus of claim 1 , wherein the at least three electrode leads are configured to have low electrical resistance compared to at least one addressable group of resistive heaters.

6. The apparatus of claim 1 , wherein heating element connectors are configured to electrically connect a plurality of thin film resistive heating elements in at least one parallel and series combination circuit.

7. The apparatus of claim 6 , wherein the at least one parallel and series combination circuit provides a network of redundant electrical connections for each heating element contained within an addressable group.

8. The apparatus of claim 7 , wherein the resistances of the heating elements and heating element connectors are configured to provide a controlled thermal distribution.

9. The apparatus of claim 8 , wherein a plurality of thin film resistive heating elements are arranged in a hexagonally-packed configuration.

10. The apparatus of claim 8 , wherein a plurality of thin film resistive heating elements are arranged in a rectangularly-packed configuration.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2016
From: MEINHART, CARL D.; PIOREK, BRIAN; JUDY, NICHOLAS B.
To: NUMERICAL DESIGN, INC.
Reel/Frame 038789/0459 →
Continuity (2)
Continuation In Part 14885822 · Oct 16, 2015
Related Publication 20170108210A1 · Apr 20, 2017