Method of producing a cap substrate, and packaged radiation-emitting device
The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.
1. A method of producing a cap substrate, comprising:
providing a mold substrate comprising a structured surface region;
arranging a cover substrate on the structured surface region of the mold substrate, the cover substrate comprising a glass material, and connecting the cover substrate to the mold substrate,
the structured surface of the mold substrate being brought into contact with a surface of the cover substrate in such a way that they at least partially overlap;
forming first island regions and respectively associated adjacent second island regions from the mold substrate, recesses being provided between the first island regions and the respectively associated adjacent second island regions;
arranging a window component within a recess of the recesses located between a first island region and the associated adjacent second island region;
arranging a carrier substrate on the first island regions and on the second island regions, wherein the first island regions and the second island regions are formed from the mold substrate, so that the first island regions and the second island regions are located between the carrier substrate and the cover substrate;
tempering the bonded substrates such that the glass material of the cover substrate is caused to flow into the remaining recesses located between the island regions; and
removing the cover substrate from the mold substrate and the carrier substrate so as to achieve the structured cap substrate comprising the window component on a side face of the cap substrate.
2. The method as claimed in claim 1 , wherein said providing of the mold substrate further comprises:
providing a semiconductor wafer comprising a passivation layer on a surface;
lithographing the passivation layer so that the passivation layer will remain on the surface wherever the first island regions and the second island regions are provided;
etching the surface of the semiconductor wafer with regard to the lithographed regions, so that a thickness of the semiconductor wafer is reduced perpendicularly to the lithographed regions of the surface so as to structure the surface region and to thus specify positions for the first island regions and the second island regions; and
completely removing the passivation layer.
3. The method as claimed in claim 1 , wherein said arranging and connecting of the cover substrate comprises:
anodically bonding, region by region, the structured surface region of the mold substrate with a surface region of the cover substrate.
4. The method as claimed in claim 1 , wherein said arranging of the window component in each case comprises:
providing several strip-shaped window components; and
inserting the strip-shaped window components into the recesses located between the first island regions and the second island regions, so that surfaces of the window components that are provided as surfaces of optical output windows are located opposite surfaces of the island regions that are formed from the mold substrate.
5. The method as claimed in claim 1 , wherein said arranging of the respective window component comprises:
inserting semiconductor strips into the recesses prior to inserting the strip-shaped window components into the recesses, so that the semiconductor strips are arranged between surfaces of the window components that are provided as surfaces of optical output windows, and surfaces of the island regions that are formed from the mold substrate.
6. The method as claimed in claim 1 , wherein said arranging of the respective window component comprises:
providing one or more strip-shaped window elements coated with semiconductor material.
7. The method as claimed in claim 1 , wherein said arranging of the window component comprises:
cutting to length of strip-shaped window components from a lens array in each case.
8. The method as claimed in claim 1 , wherein the first and second island regions comprise edge chamfers in a region adjacent to the carrier substrate, said tempering comprising the glass material of the window component flowing into the region located between the chamfers and the carrier substrate so as to form a circumferential protrusion from the glass material.
9. The method as claimed in claim 2 , wherein said providing of the mold substrate further comprises:
wherein, in lithographing the passivation layer, the passivation layer is further removed from the surface where channel structures are provided within the first and second island regions,
wherein during etching of the surface of the semiconductor wafer with regard to the lithographic regions, channels are etched, in addition, into the mold substrate within the first and second island regions.
10. A method of producing a cap substrate, comprising:
providing a mold substrate comprising a structured surface region;
arranging a carrier substrate on the structured surface region of the mold substrate and connecting the carrier substrate to the mold substrate,
the structured surface of the mold substrate being brought into contact with a surface of the carrier substrate in such a way that they at least partially overlap;
forming first island regions and respectively associated adjacent second island regions from the mold substrate, recesses being provided between the first island regions and the respectively associated adjacent second island regions;
arranging a window component within a recess of the recesses located between a first island region and the associated adjacent second island region;
arranging a cover substrate on the first island regions and on the second island regions, wherein the first island regions and the second island regions are formed from the mold substrate, so that the first island regions and the second island regions are located between the carrier substrate and the cover substrate, the cover substrate comprising a glass material;
tempering the bonded substrates such that the glass material of the cover substrate is caused to flow into the remaining recesses located between the island regions; and
removing the cover substrate from the mold substrate and the carrier substrate so as to achieve the structured cap substrate comprising the window component on a side face of the cap substrate.
11. The method as claimed in claim 10 , wherein said providing of the mold substrate comprises:
providing a semiconductor wafer comprising a passivation layer on a surface;
lithographing the passivation layer so that the passivation layer will remain on the surface where the first island regions and the second island regions are provided;
etching the surface of the semiconductor wafer with regard to the lithographed regions, so that a thickness of the semiconductor wafer is reduced perpendicularly to the lithographed regions of the surface so as to structure the surface region and to thus specify positions for the first island regions and the second island regions; and
completely removing the passivation layer.
12. The method as claimed in claim 10 , wherein said arranging and connecting of the cover substrate comprises:
connecting, region by region, the structured surface region of the mold substrate to a surface region of the carrier substrate, the mold substrate and the carrier substrate comprising a semiconductor material.
13. The method as claimed in claim 10 , wherein said arranging of the window component in each case comprises:
providing several strip-shaped window components; and
inserting the strip-shaped window components into the recesses located between the first island regions and the second island regions, so that surfaces of the window components that are provided as surfaces of optical output windows are located opposite surfaces of the island regions that are formed from the mold substrate.
14. The method as claimed in claim 10 , wherein said arranging of the respective window component comprises:
inserting semiconductor strips into the recesses prior to inserting the strip-shaped window components into the recesses, so that the semiconductor strips are arranged between surfaces of the window components that are provided as surfaces of optical output windows, and surfaces of the island regions that are formed from the mold substrate.
15. A method of producing a cap substrate, comprising:
providing a reusable tool as the mold substrate, first island regions and respectively associated adjacent second island regions being formed on a surface of the reusable tool, which is effective as a negative structure for a cap structure, recesses being provided, in the reusable wafer, between the first island regions and the respectively associated adjacent second island regions;
arranging a window component on the reusable tool in a recess of the recesses, respectively, located between a first island region and the associated adjacent second island region;
arranging a cover substrate on the island regions of the reusable tool, the cover substrate comprising a glass material;
wherein the surface of the reusable tool is brought into contact with a surface of the cover substrate in such a way that they at least partially overlap;
tempering the bonded substrates such that the glass material of the cover substrate is caused to flow into the recesses located between the island regions; and
separating the cover substrate from the mold substrate so as to achieve the structured cap substrate comprising the window component on a side face of the cap substrate.
16. The method as claimed in claim 15 , wherein said arranging of the window component in each case comprises:
providing several strip-shaped window components; and
inserting the strip-shaped window components into the recesses located between the first island regions and the second island regions, so that surfaces of the window components that are provided as surfaces of optical output windows are located opposite surfaces of the island regions that are formed from the mold substrate.
17. The method as claimed in claim 15 , wherein said arranging of the respective window component comprises:
inserting semiconductor strips into the recesses prior to inserting the strip-shaped window components into the recesses, so that the semiconductor strips are arranged between surfaces of the window components that are provided as surfaces of optical output windows, and surfaces of the island regions that are formed from the mold substrate.
18. The method as claimed in claim 15 , wherein said arranging of the respective window component comprises:
providing one or more strip-shaped window elements coated with semiconductor material.
19. The method as claimed in claim 15 , wherein said arranging of the window component comprises:
cutting to length of strip-shaped window components from a lens array in each case.
20. The method as claimed in claim 15 , wherein said tempering comprises:
applying a negative pressure to the bonded substrates so as to draw the glass material into the remaining recesses located between the island regions.
21. The method as claimed in claim 15 , wherein the first and second island regions comprise edge chamfers in a region adjacent to the carrier substrate, said tempering comprising the glass material of the window component flowing into the region located between the chamfers and the carrier substrate so as to form a circumferential protrusion from the glass material.
22. A method of producing a cap substrate, comprising:
providing a mold substrate comprising a structured surface region;
arranging a cover substrate on the structured surface region of the mold substrate, the cover substrate comprising a glass material, and connecting the cover substrate to the mold substrate, the structured surface of the mold substrate being brought into contact with at least one surface of the cover substrate in such a way that they at least partially overlap;
forming first island regions and respectively associated adjacent second island regions from the mold substrate, recesses being provided between the first island regions and the respectively associated adjacent second island regions;
arranging semiconductor strips in a recess of the recesses, respectively, located between a first island region and the associated adjacent second island region, so that the semiconductor strips with one of their surfaces at least partially overlap respective lateral surfaces of the island regions perpendicularly to the cover substrate, and so that semiconductor strips are located opposite one another with regard to the recess and that a distance, which corresponds to a remaining recess, is formed between the semiconductor strips;
arranging a carrier substrate on the first island regions and on the second island regions, which are formed from the mold substrate, so that the first island regions and the second island regions are located between the carrier substrate and the cover substrate;
tempering the bonded substrates such that the glass material of the cover substrate is caused to flow into the remaining recesses located between the island regions; and
removing the cover substrate from the mold substrate and from the carrier substrate so as to achieve the structured cap substrate comprising the window component on a side face of the cap substrate.
23. method of producing a cap substrate, comprising:
providing a reusable tool as the mold substrate, first island regions and respectively associated adjacent second island regions being formed on a surface of the reusable tool, which is effective as a negative structure for a cap structure, recesses being provided, within the reusable wafer, between the first island regions and the respectively associated adjacent second island regions;
arranging semiconductor strips in a recess of the recesses, respectively, located between a first island region and the associated adjacent second island region, so that the semiconductor strips with one of their surfaces at least partially overlap respective lateral surfaces of the island regions perpendicularly to the cover substrate, and so that semiconductor strips are located opposite one another with regard to the recess and that a distance, which corresponds to a remaining recess, is formed between the semiconductor strips;
arranging a cover substrate on the island regions of the reusable tool, the cover substrate comprising a glass material;
wherein the surface of the reusable tool is brought into contact with a surface of the cover substrate in such a way that they at least partially overlap;
tempering the bonded substrates such that the glass material of the cover substrate is caused to flow into the recesses located between the island regions; and
separating the cover substrate from the mold substrate so as to achieve the structured cap substrate comprising the window component on a side face of the cap substrate.
24. The method as claimed in claim 1 , wherein tempering the bonded substrates causes the glass material of the cover substrate to flow into the remaining recesses located between the island regions, so that the glass material of the cover substrate and the glass material of the window component are integrally bonded.
25. A method of producing a packaged radiation-emitting device, comprising:
providing a cap substrate with the method of producing a cap substrate according to claim 1 ;
providing a device substrate, wherein a radiation-emitting device is arranged on the device substrate; and
bonding the cap substrate to the device substrate for providing a hermetically sealed cavity for the radiation-emitting device within which the radiation-emitting device is packaged, said cap substrate comprising, in a side face, the window component made of a material transparent to the radiation of the radiation-emitting device, said window component of the cap substrate and the radiation-emitting device being arranged in relation to each other such that the radiation emitted during operation of the radiation-emitting device leaves the package in an emission direction in a manner that is parallel with the surface of the device substrate and/or that is perpendicular to the side face of the cap substrate.
26. The method of producing a packaged radiation-emitting device as claimed in claim 25 , wherein the window component is formed from a first glass material and the cap substrate is formed from a second glass material and wherein the second glass material exhibits a viscosity lower than that of the first glass material; and
wherein tempering the bonded substrates causes the glass material of the cover substrate to flow into the remaining recesses located between the island regions, so that the glass material of the cover substrate and the glass material of the window component are integrally bonded.