Power electronics assemblies having a semiconductor cooling chip and an integrated fluid channel system
A power electronics assembly includes a semiconductor device stack having a wide bandgap semiconductor device, a semiconductor cooling chip thermally coupled to the wide bandgap semiconductor device, and a first electrode electrically coupled to the wide bandgap semiconductor device and positioned between the wide bandgap semiconductor device and the semiconductor cooling chip. The semiconductor cooling chip is positioned between a substrate layer and the wide bandgap semiconductor device. The substrate layer includes a substrate inlet port and a substrate outlet port. An integrated fluid channel system extends between the substrate inlet port and the substrate outlet port and includes a substrate fluid inlet channel extending from the substrate inlet port into the substrate layer, a substrate fluid outlet channel extending from the substrate outlet port into the substrate layer, and one or more cooling chip fluid channels extending into the semiconductor cooling chip.
1. A power electronics assembly comprising:
a semiconductor device stack comprising:
a wide bandgap semiconductor device comprising a wide bandgap semiconductor material;
a semiconductor cooling chip comprising a semiconductor material thermally coupled to the wide bandgap semiconductor device; and
a first electrode electrically coupled to the wide bandgap semiconductor device and positioned between the wide bandgap semiconductor device and the semiconductor cooling chip;
a substrate layer coupled to the semiconductor device stack such that the semiconductor cooling chip is positioned between the substrate layer and the wide bandgap semiconductor device, wherein the substrate layer comprises a substrate inlet port and a substrate outlet port;
an integrated fluid channel system extending between the substrate inlet port and the substrate outlet port of the substrate layer, wherein the integrated fluid channel system comprises:
a substrate fluid inlet channel extending from the substrate inlet port into the substrate layer;
a substrate fluid outlet channel extending from the substrate outlet port into the substrate layer;
one or more cooling chip fluid channels extending into the semiconductor cooling chip, wherein the one or more cooling chip fluid channels are in fluid communication with the substrate fluid inlet channel and the substrate fluid outlet channel;
one or more electrode fluid channels extending into the first electrode, wherein the one or more electrode fluid channels are in fluid communication with the one or more cooling chip fluid channels; and
one or more semiconductor fluid channels extending into the wide bandgap semiconductor device such that the one or more semiconductor fluid channels are in fluid communication with the one or more electrode fluid channels and the one or more cooling chip fluid channels.
2. The power electronics assembly of claim 1 , wherein the semiconductor material of the semiconductor cooling chip comprises at least one of Si, GaAs, SiC, GaN, AlN, BN and diamond.
3. The power electronics assembly of claim 1 , wherein the semiconductor cooling chip comprises a gate drive circuit portion electrically coupled to the wide bandgap semiconductor device.
4. The power electronics assembly of claim 1 , wherein at least a portion of the one or more cooling chip fluid channels comprise a plurality of channel fins extending from the semiconductor cooling chip.
5. The power electronics assembly of claim 1 , wherein at least a portion of the one or more cooling chip fluid channels comprise a plurality of pin fins extending from the semiconductor cooling chip.
6. The power electronics assembly of claim 1 , wherein the wide bandgap semiconductor material of the wide bandgap semiconductor device comprises at least one of SiC, GaN, AlN, BN and diamond.
7. The power electronics assembly of claim 1 , further comprising a second electrode positioned on the wide bandgap semiconductor device opposite the first electrode.
8. The power electronics assembly of claim 7 , wherein the first electrode comprises a drain electrode and the second electrode comprises a source electrode each thermally and electrically coupled to the wide bandgap semiconductor device such that a vertical current pathway extends through the wide bandgap semiconductor device from the source electrode to the drain electrode.
9. The power electronics assembly of claim 1 , wherein the substrate layer comprises a high temperature substrate layer having a melting temperature greater than about 300° C.