Fingerprint sensing device
A fingerprint sensing device includes a board having a sensor array, a sub-board disposed on a bottom surface of the board, a circuit element disposed on the bottom surface of the board, and a through hole disposed through the sub-board, wherein the circuit element is further disposed in the through hole. A thickness of the sub-board is substantially similar to a thickness of the circuit element.
1. A fingerprint sensing device comprising:
a board having a sensor array;
a sub-board disposed on a bottom surface of the board;
a circuit element disposed on the bottom surface of the board; and
a through hole disposed through the sub-board,
wherein the circuit element is further disposed in the through hole,
wherein a thickness of the sub-board is substantially similar to a thickness of the circuit element,
wherein the sensor array comprises: a plurality of first and second electrodes disposed in a base layer,
wherein the plurality of first electrodes are disposed in a lower portion of the base layer, the plurality of second electrodes are disposed in an upper portion of the base layer, and the plurality of first and second electrodes are spaced apart from each other by a predetermined interval in a thickness direction of the board and extend in directions perpendicular to one another in the base layer.
2. The fingerprint sensing device of claim 1 , wherein
the sub-board has a circular shape and comprises a bottom electrode configured to receive solder.
3. The finger print sensing device of claim 1 ,
wherein the sub-board comprises a circular ring portion and an extending portion extending from one end of the ring portion,
wherein a connection terminal configured to connect to a main board is disposed on the extending portion.
4. The fingerprint sensing device of claim 3 , wherein the sub-board further comprises
a via formed in the ring portion and
a circuit pattern connecting the via to the connection terminal.
5. The fingerprint sensing device of claim 1 , wherein
the circuit element and the sub-board are connected to the board through a connection member.
6. The fingerprint sensing device of claim 5 , wherein
the connection member is formed of copper.
7. The fingerprint sensing device of claim 1 , wherein the board comprises:
a first insulating layer disposed on a lower surface of the base layer and
a second insulating layer disposed on an upper surface of the base layer.
8. The fingerprint sensing device of claim 7 , wherein
a first circuit pattern is formed between the first insulating layer and the lower surface of the base layer, and
a second circuit pattern is formed between the second insulating layer and the upper surface of the base layer.
9. The fingerprint sensing device of claim 8 , wherein
an opening in the first insulating layer exposes a portion of the first circuit pattern, and
the circuit element and the sub-board are connected to the portion of the first circuit pattern.
10. A fingerprint sensing device comprising: a sensor array disposed in a base layer of a board; a sub-board disposed on the board, wherein the sub-board comprises a through hole; and a circuit element disposed in the through hole and on the board, wherein a thickness of the circuit element is substantially the same as a thickness of the sub-board, wherein the sensor array comprises a plurality of first electrodes and a plurality of second electrodes disposed in the base layer, wherein the board comprises: a first insulating layer, the base layer disposed on the first insulating layer, and a second insulating layer disposed on the base layer, wherein a first circuit pattern is disposed between the first insulating layer and the base layer, and a second circuit pattern is disposed between the base layer and the second insulating layer, wherein the sub-board comprises: a ring portion having an annular shape and an extending portion extending from one end of the ring portion, and a connection terminal configured to connect to a main board disposed on the extending portion.
11. The fingerprint sensing device of claim 10 , wherein
the circuit element and the sub-board are connected to the first circuit pattern and the second circuit pattern through a connection member, and
the connection member is disposed within an opening formed in the first insulating layer.
12. The fingerprint sensing device of claim 10 , wherein
the sub-board has an annular shape and a bottom electrode configured to receive solder.
13. The fingerprint sensing device of claim 10 , further comprising:
a connection member connecting the first and second circuit patterns to the connection terminal.
14. The fingerprint sensing device of claim 13 , wherein
a via connects the connection member to the connection terminal.
15. The fingerprint sensing device of claim 14 , wherein
a circuit pattern connects the via to the connection terminal.
16. The fingerprint sensing device of claim 10 , wherein
the circuit element is an integrated circuit driving chip.
17. The fingerprint sensing device of claim 10 , wherein the sub-board comprises:
a printed circuit board configured to prevent bowing of the board.
18. A fingerprint sensing device comprising: a sensor array disposed in a base layer of a board; a sub-board disposed on the board, wherein the sub-board comprises a through hole; and a circuit element disposed in the through hole and on the board, wherein a thickness of the circuit element is substantially the same as a thickness of the sub-board, wherein the sensor array comprises a plurality of first electrodes and a plurality of second electrodes disposed in the base layer, wherein the board comprises: a first insulating layer, the base layer disposed on the first insulating layer, and a second insulating layer disposed on the base layer, wherein a first circuit pattern is disposed between the first insulating layer and the base layer, and a second circuit pattern is disposed between the base layer and the second insulating layer, wherein the plurality of first electrodes are disposed in a lower portion of the base layer, the plurality of second electrodes are disposed in an upper portion of the base layer, and the plurality of first and second electrodes are spaced apart from each other by a predetermined interval in a thickness direction of the board and extend in directions perpendicular to one another in the base layer.