IP Library Granted Patent US 9,864,154
Granted Patent B1
US 9,864,154 · App. 15/186,897 · Granted Jan 9, 2018

Field replaceable modular optical interconnect unit with optical module for datacenter switch system

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,864,154
App. No.
15/186,897
Granted
Jan 9, 2018
Kind
B1
Abstract

Apparatuses, systems, and methods of assembly are described that provide mechanisms for integrating an optical module (e.g., an MBOM) into a main switch system to allow the optical module to be replaced without having to replace other components of the main switch system. The field replaceable modular optical interconnect unit includes a housing, a printed circuit board assembly supported within the housing, an optical module supported on the printed circuit board assembly that converts between optical signals and electrical signals for transmitting or receiving optical signals through a fiber optic cable, a board-to-board connector on a rear panel of the housing that enables electrical signals to be transmitted between the printed circuit board assembly and a main switch system box, and an external connector on a front panel of the housing that can engage an external optical fiber for transmitting optical signals between the optical module and an external component.

Claims (43)

1. A field replaceable modular optical interconnect unit configured to be received by a main switch system box installed in a datacenter rack, the field replaceable modular optical interconnect unit comprising:

a housing comprising at least a front panel, a rear panel, and side panels extending between the front and rear panels;

a printed circuit board assembly supported within the housing;

an optical module supported on the printed circuit board assembly and configured to convert between optical signals and corresponding electrical signals for respectively transmitting or receiving optical signals through a fiber optic cable;

a board-to-board connector disposed on the rear panel of the housing and configured to enable electrical signals to be transmitted between the printed circuit board assembly and a main switch system box; and

an external connector disposed on the front panel of the housing and configured to engage an external optical fiber for transmitting optical signals between the optical module and an external component,

wherein the field replaceable modular optical interconnect unit is configured to be received by the main switch system box of a datacenter rack, such that the field replaceable modular optical interconnect unit is electrically connected to the main switch system box via engagement of the board-to-board connector with a corresponding connector of the main switch system box, and

wherein the field replaceable modular optical interconnect unit is configured to be removed from the main switch system box and replaced with another field replaceable modular optical interconnect unit while maintaining the main switch system box installed in the datacenter rack.

2. The field replaceable modular optical interconnect unit of claim 1 , wherein the optical module comprises a mid board optical module (MBOM).

3. The field replaceable modular optical interconnect unit of claim 1 , wherein the external connector is a first external connector, wherein the field replaceable modular optical interconnect unit further comprises a second external connector disposed on the front panel of the housing and configured to enable transmission of electrical signals between the printed circuit board assembly and an external component connected thereto.

4. The field replaceable modular optical interconnect unit of claim 1 , wherein the side panels comprise an engaging feature configured to mate with a corresponding engaging feature of the main switch system box for enabling the field replaceable modular optical interconnect unit to be received therein.

5. The field replaceable modular optical interconnect unit of claim 1 , wherein the front panel of the housing defines a handle configured to be gripped by a user for extracting the field replaceable modular optical interconnect unit from the main switch system box.

6. The field replaceable modular optical interconnect unit of claim 1 , wherein the housing further comprises a top panel configured to enclose the optical module within the housing.

7. The field replaceable modular optical interconnect unit of claim 1 , wherein the optical module is a first optical module, the field replaceable modular optical interconnect unit further comprising at least a second optical module supported by the printed circuit board assembly and coupled to the external connector associated with the first optical module or a separate external connector.

8. A method of assembling a field replaceable modular optical interconnect unit configured to be received by a main switch system box installed in a datacenter rack, the method comprising:

constructing a housing, wherein the housing comprises at least a front panel, a rear panel, and side panels extending between the front and rear panels;

disposing a printed circuit board assembly within the housing;

supporting an optical module on the printed circuit board assembly, wherein the optical module is configured to convert between optical signals and corresponding electrical signals for respectively transmitting or receiving optical signals through a fiber optic cable;

installing a board-to-board connector on the rear panel of the housing, wherein the board-to-board connector is configured to enable electrical signals to be transmitted between the printed circuit board assembly and a main switch system box; and

installing an external connector on the front panel of the housing, wherein the external connector is configured to engage an external optical fiber for transmitting optical signals between the optical module and an external component,

wherein the field replaceable modular optical interconnect unit is configured to be received by the main switch system box, such that the field replaceable modular optical interconnect unit is electrically connected to the main switch system box via engagement of the board-to-board connector with a corresponding connector of the main switch system box, and

wherein the field replaceable modular optical interconnect unit is configured to be removed from the main switch system box and replaced with another field replaceable modular optical interconnect unit.

9. The method of claim 8 , wherein supporting an optical module on the printed circuit board assembly comprises supporting a mid board optical module (MBOM) on the printed circuit board assembly.

10. The method of claim 8 , wherein the external connector is a first external connector, wherein the method further comprises installing a second external connector on the front panel of the housing that is configured to enable transmission of electrical signals between the printed circuit board assembly and an external component.

11. The method of claim 8 further comprising providing an engaging feature on the side panels of the housing that are configured to mate with a corresponding engaging feature of the main switch system box for enabling the field replaceable modular optical interconnect unit to be received therein.

12. The method of claim 8 further comprising securing a handle to the front panel of the housing, wherein the handle is configured to be gripped by a user for extracting the field replaceable modular optical interconnect unit from the main switch system box.

13. The method of claim 8 , wherein constructing the housing further comprises attaching a top panel to the front, rear, and side panels for enclosing the optical module within the housing.

14. The method of claim 8 , wherein the optical module is a first optical module, the method further comprising supporting at least a second optical module on the printed circuit board assembly and coupling the second optical module to the external connector associated with the first optical module or a separate external connector, wherein the second optical module is configured to convert between optical signals and corresponding electrical signals for respectively transmitting or receiving optical signals through a fiber optic cable.

15. A system for converting between electrical signals and optical signals in a datacenter, the system comprising:

a main switch system box configured to transmit and receive electrical signals installed in a datacenter rack; and

a field replaceable modular optical interconnect unit configured to be received by the main switch system box, the field replaceable modular optical interconnect unit comprising:

a housing comprising at least a front panel, a rear panel, and side panels extending between the front and rear panels;

a printed circuit board assembly supported within the housing;

an optical module supported on the printed circuit board assembly and configured to convert between optical signals and corresponding electrical signals for respectively transmitting or receiving optical signals through a fiber optic cable;

a board-to-board connector disposed on the rear panel of the housing and configured to enable electrical signals to be transmitted between the printed circuit board assembly and a main switch system box; and

an external connector disposed on the front panel of the housing and configured to engage an external optical fiber for transmitting optical signals between the optical module and an external component,

wherein the field replaceable modular optical interconnect unit is configured to be received by the main switch system box of the datacenter rack, such that the field replaceable modular optical interconnect unit is electrically connected to the main switch system box via engagement of the board-to-board connector with a corresponding connector of the main switch system box, and

wherein the field replaceable modular optical interconnect unit is configured to be removed from the main switch system box and replaced with another field replaceable modular optical interconnect unit while maintaining the main switch system box installed in the datacenter rack.

16. The system of claim 15 , wherein the main switch system box is configured to receive multiple field replaceable modular optical interconnect units, wherein the main switch system box is configured to operate each field replaceable modular optical interconnect unit individually or collectively.

17. The system of claim 16 , wherein each field replaceable modular optical interconnect unit comprises external connectors having different size and fiber channel counts.

18. The system of claim 15 , wherein the side panels of the housing of the field replaceable modular optical interconnect unit comprise an engaging feature configured to mate with a corresponding engaging feature of the main switch system box for enabling the field replaceable modular optical interconnect unit to be received therein.

19. The system of claim 15 , wherein the external connector is a first external connector, wherein the field replaceable modular optical interconnect unit further comprises a second external connector disposed on the front panel of the housing and configured to enable transmission of electrical signals between the printed circuit board assembly and an external component connected thereto.

20. The system of claim 15 , wherein the front panel of the housing defines a handle configured to be gripped by a user for extracting the field replaceable modular optical interconnect unit from the main switch system box.

Assignments (4)
RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL AT REEL/FRAME NO. 42962/0859 Recorded Jul 13, 2018
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MELLANOX TECHNOLOGIES, LTD.; MELLANOX TECHNOLOGIES TLV LTD.; MELLANOX TECHNOLOGIES SILICON PHOTONICS INC.
Reel/Frame 046551/0459 →
NUNC PRO TUNC ASSIGNMENT Recorded Sep 5, 2017
From: BADEHI, PIERRE AVNER
To: MELLANOX TECHNOLOGIES, LTD.
Reel/Frame 043489/0275 →
SECURITY INTEREST Recorded Jun 23, 2017
From: MELLANOX TECHNOLOGIES, LTD.; MELLANOX TECHNOLOGIES TLV LTD.; MELLANOX TECHNOLOGIES SILICON PHOTONICS INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 042962/0859 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2016
From: ZER, YORAM; BADIHI, AVNER; ZIMMERMAN, SHY; KIRSHNER, NATAN; GIBBS, AVI; KHAZEN, NIMER
To: MELLANOX TECHNOLOGIES, LTD.
Reel/Frame 038958/0124 →